GB2239557A - High electron mobility transistors - Google Patents

High electron mobility transistors Download PDF

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Publication number
GB2239557A
GB2239557A GB9005732A GB9005732A GB2239557A GB 2239557 A GB2239557 A GB 2239557A GB 9005732 A GB9005732 A GB 9005732A GB 9005732 A GB9005732 A GB 9005732A GB 2239557 A GB2239557 A GB 2239557A
Authority
GB
United Kingdom
Prior art keywords
layer
buffer layer
compound semiconductor
source
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9005732A
Other languages
English (en)
Other versions
GB9005732D0 (en
Inventor
Chun-Woo Nam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9005732D0 publication Critical patent/GB9005732D0/en
Publication of GB2239557A publication Critical patent/GB2239557A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66431Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0891Source or drain regions of field-effect devices of field-effect transistors with Schottky gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66446Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H01L29/7787Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/161Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
    • H01L29/165Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Peptides Or Proteins (AREA)
GB9005732A 1989-12-31 1990-03-14 High electron mobility transistors Withdrawn GB2239557A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890020733A KR910013568A (ko) 1989-12-31 1989-12-31 화합물 반도체 장치 및 그 제조방법

Publications (2)

Publication Number Publication Date
GB9005732D0 GB9005732D0 (en) 1990-05-09
GB2239557A true GB2239557A (en) 1991-07-03

Family

ID=19294785

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9005732A Withdrawn GB2239557A (en) 1989-12-31 1990-03-14 High electron mobility transistors

Country Status (5)

Country Link
JP (1) JPH03211839A (de)
KR (1) KR910013568A (de)
DE (1) DE4007896A1 (de)
FR (1) FR2656740A1 (de)
GB (1) GB2239557A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5360755A (en) * 1990-06-11 1994-11-01 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a dual field effect transistor
WO2022093330A1 (en) * 2020-10-30 2022-05-05 Raytheon Company Group iii-v semiconductor structures having crystalline regrowth layers and methods for forming such structures

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5609055B2 (ja) * 2009-10-02 2014-10-22 富士通株式会社 化合物半導体装置及びその製造方法
JP6690320B2 (ja) * 2016-03-11 2020-04-28 住友電気工業株式会社 高電子移動度トランジスタ、及び高電子移動度トランジスタの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064370A2 (de) * 1981-04-23 1982-11-10 Fujitsu Limited Halbleiteranordnung mit hoher Elektronenbeweglichkeit
EP0191201A1 (de) * 1985-01-28 1986-08-20 Koninklijke Philips Electronics N.V. Halbleiteranordnung mit bidimensionalem Elektronengas
EP0301862A2 (de) * 1987-07-31 1989-02-01 Sony Corporation Transistoren mit hoher Elektronengeschwindigkeit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189268A (ja) * 1984-03-08 1985-09-26 Fujitsu Ltd 半導体装置
JPS62204578A (ja) * 1986-03-04 1987-09-09 Nec Corp 電界効果トランジスタの製造方法
JPS62209865A (ja) * 1986-03-10 1987-09-16 Nec Corp 半導体装置の製造方法
JPS62232170A (ja) * 1986-04-02 1987-10-12 Matsushita Electric Ind Co Ltd 電界効果トランジスタの製造方法
JPS63308965A (ja) * 1987-06-11 1988-12-16 Toshiba Corp ヘテロ接合電界効果トランジスタ
JP2559412B2 (ja) * 1987-06-22 1996-12-04 株式会社日立製作所 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064370A2 (de) * 1981-04-23 1982-11-10 Fujitsu Limited Halbleiteranordnung mit hoher Elektronenbeweglichkeit
EP0191201A1 (de) * 1985-01-28 1986-08-20 Koninklijke Philips Electronics N.V. Halbleiteranordnung mit bidimensionalem Elektronengas
EP0301862A2 (de) * 1987-07-31 1989-02-01 Sony Corporation Transistoren mit hoher Elektronengeschwindigkeit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5360755A (en) * 1990-06-11 1994-11-01 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a dual field effect transistor
WO2022093330A1 (en) * 2020-10-30 2022-05-05 Raytheon Company Group iii-v semiconductor structures having crystalline regrowth layers and methods for forming such structures
US11515410B2 (en) 2020-10-30 2022-11-29 Raytheon Company Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures
TWI815133B (zh) * 2020-10-30 2023-09-11 美商雷森公司 具有晶體再生層的ⅲ—ⅴ族半導體結構及形成這種結構的方法
US11784248B2 (en) 2020-10-30 2023-10-10 Raytheon Company Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures

Also Published As

Publication number Publication date
DE4007896A1 (de) 1991-07-11
GB9005732D0 (en) 1990-05-09
FR2656740A1 (fr) 1991-07-05
JPH03211839A (ja) 1991-09-17
KR910013568A (ko) 1991-08-08

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