GB2218714B - Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures - Google Patents

Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures

Info

Publication number
GB2218714B
GB2218714B GB8909623A GB8909623A GB2218714B GB 2218714 B GB2218714 B GB 2218714B GB 8909623 A GB8909623 A GB 8909623A GB 8909623 A GB8909623 A GB 8909623A GB 2218714 B GB2218714 B GB 2218714B
Authority
GB
United Kingdom
Prior art keywords
fissures
formulating
deposits
operating
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8909623A
Other languages
English (en)
Other versions
GB8909623D0 (en
GB2218714A (en
Inventor
Rowan Hughes
Milan Paunovic
Rudolph J Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Kollmorgen Corp
Original Assignee
AMP Akzo Corp
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp, Kollmorgen Corp filed Critical AMP Akzo Corp
Publication of GB8909623D0 publication Critical patent/GB8909623D0/en
Publication of GB2218714A publication Critical patent/GB2218714A/en
Application granted granted Critical
Publication of GB2218714B publication Critical patent/GB2218714B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8909623A 1988-04-29 1989-04-27 Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures Expired - Lifetime GB2218714B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18782288A 1988-04-29 1988-04-29

Publications (3)

Publication Number Publication Date
GB8909623D0 GB8909623D0 (en) 1989-06-14
GB2218714A GB2218714A (en) 1989-11-22
GB2218714B true GB2218714B (en) 1992-10-14

Family

ID=22690615

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8909623A Expired - Lifetime GB2218714B (en) 1988-04-29 1989-04-27 Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures
GB929220923A Pending GB9220923D0 (en) 1988-04-29 1992-10-05 Electroless plating bath solutions

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB929220923A Pending GB9220923D0 (en) 1988-04-29 1992-10-05 Electroless plating bath solutions

Country Status (8)

Country Link
EP (1) EP0340649B1 (enrdf_load_stackoverflow)
JP (1) JPH07107193B2 (enrdf_load_stackoverflow)
KR (1) KR890016207A (enrdf_load_stackoverflow)
AU (1) AU3304389A (enrdf_load_stackoverflow)
BR (1) BR8901962A (enrdf_load_stackoverflow)
CA (1) CA1331420C (enrdf_load_stackoverflow)
DE (1) DE3914180A1 (enrdf_load_stackoverflow)
GB (2) GB2218714B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
MX344173B (es) 2010-08-17 2016-12-07 Chemetall Gmbh * Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1168370A (en) * 1966-12-19 1969-10-22 Matsushita Electric Industrial Co Ltd Improvements in and relating to plating Processes
GB1588758A (en) * 1976-11-22 1981-04-29 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
GB2066510A (en) * 1979-12-29 1981-07-08 Uemura Kogyo Kk Method and apparatus for controlling electroless plating bath
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
GB2207249A (en) * 1986-10-31 1989-01-25 Kollmorgen Corp Control of electroless plating baths

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS5927379A (ja) * 1982-08-09 1984-02-13 Hitachi Ltd パタ−ン映像信号処理方式
JPH0247550B2 (ja) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
JPH0239596B2 (ja) * 1983-03-25 1990-09-06 Uemura Kogyo Kk Kagakudometsukinokontorooruhoho
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
US4692346A (en) * 1986-04-21 1987-09-08 International Business Machines Corporation Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1168370A (en) * 1966-12-19 1969-10-22 Matsushita Electric Industrial Co Ltd Improvements in and relating to plating Processes
GB1588758A (en) * 1976-11-22 1981-04-29 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
GB2066510A (en) * 1979-12-29 1981-07-08 Uemura Kogyo Kk Method and apparatus for controlling electroless plating bath
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
GB2207249A (en) * 1986-10-31 1989-01-25 Kollmorgen Corp Control of electroless plating baths

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US Re 31694 *

Also Published As

Publication number Publication date
KR890016207A (ko) 1989-11-28
EP0340649A1 (en) 1989-11-08
JPH07107193B2 (ja) 1995-11-15
DE3914180A1 (de) 1989-11-09
GB8909623D0 (en) 1989-06-14
BR8901962A (pt) 1989-12-05
GB2218714A (en) 1989-11-22
EP0340649B1 (en) 1993-02-03
JPH0270070A (ja) 1990-03-08
CA1331420C (en) 1994-08-16
AU3304389A (en) 1989-11-02
DE3914180C2 (enrdf_load_stackoverflow) 1991-04-18
GB9220923D0 (en) 1992-11-18

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930427

PCNP Patent ceased through non-payment of renewal fee

Free format text: IN JOURNAL 5465, PAGE 5734

PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980427