GB2204588B - Forming process for moldable thermosetting composition - Google Patents
Forming process for moldable thermosetting compositionInfo
- Publication number
- GB2204588B GB2204588B GB8811227A GB8811227A GB2204588B GB 2204588 B GB2204588 B GB 2204588B GB 8811227 A GB8811227 A GB 8811227A GB 8811227 A GB8811227 A GB 8811227A GB 2204588 B GB2204588 B GB 2204588B
- Authority
- GB
- United Kingdom
- Prior art keywords
- forming process
- thermosetting composition
- moldable thermosetting
- moldable
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Waveguide Aerials (AREA)
- Waveguides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5024387A | 1987-05-14 | 1987-05-14 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8811227D0 GB8811227D0 (en) | 1988-06-15 |
GB2204588A GB2204588A (en) | 1988-11-16 |
GB2204588B true GB2204588B (en) | 1992-01-02 |
Family
ID=21964164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8811227A Expired - Lifetime GB2204588B (en) | 1987-05-14 | 1988-05-12 | Forming process for moldable thermosetting composition |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP2758899B2 (ja) |
DE (1) | DE3816443C2 (ja) |
FR (1) | FR2615196B1 (ja) |
GB (1) | GB2204588B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2224738B (en) * | 1988-11-15 | 1992-04-08 | Rogers Corp | Forming process for moldable thermosetting composition |
JPH03179805A (ja) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | 誘電体レンズアンテナ用複合材料 |
US5320595A (en) * | 1990-08-22 | 1994-06-14 | Amada Company, Limited | Punch press and a tool magazine for the press |
GB9301929D0 (en) * | 1993-02-01 | 1993-03-17 | Raychem Ltd | Low-temperature-tolerant gels |
JPH07316522A (ja) * | 1994-05-20 | 1995-12-05 | Toyo Ink Mfg Co Ltd | プリントラミネーション用水性接着剤 |
US6291374B1 (en) * | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
JPH09147626A (ja) * | 1995-11-22 | 1997-06-06 | Nippon Zeon Co Ltd | 樹脂組成物、および成形品 |
WO1998026431A1 (en) * | 1996-12-13 | 1998-06-18 | Hoechst Celanese Corporation | Cyclic olefin polymer composites having a high dielectric constant |
US6562448B1 (en) | 2000-04-06 | 2003-05-13 | 3M Innovative Properties Company | Low density dielectric having low microwave loss |
JP3700617B2 (ja) | 2001-07-04 | 2005-09-28 | 株式会社村田製作所 | レンズアンテナ |
TWI663896B (zh) * | 2014-10-15 | 2019-06-21 | 美商羅傑斯公司 | 磁-電介質基板、製作該磁-電介質基板之方法及包含該磁-電介質基板之物件 |
WO2021101958A1 (en) | 2019-11-22 | 2021-05-27 | Rogers Corporation | Shaped dielectric component cross-linked via irradiation and method of making thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4499240A (en) * | 1983-11-23 | 1985-02-12 | Hercules Incorporated | Low density, polybutadiene based, wet filament winding resin |
GB2172892A (en) * | 1985-03-25 | 1986-10-01 | Matsushita Electric Works Ltd | Method of preparing polyphenylene oxide composition and laminate using the composition |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3526606A (en) * | 1966-11-24 | 1970-09-01 | Asahi Chemical Ind | Compositions comprising a block copolymer,rubber and a process oil |
JPS555541B2 (ja) * | 1974-09-05 | 1980-02-07 | ||
US4113800A (en) * | 1974-11-25 | 1978-09-12 | General Electric | High impact polyphenylene ether resin compositions that include A-B-A block copolymers |
JPS5375250A (en) * | 1976-12-17 | 1978-07-04 | Sumitomo Electric Ind Ltd | Resin composition |
JPS5556143A (en) * | 1978-10-19 | 1980-04-24 | Asahi Chem Ind Co Ltd | Polyethylene composition for rotational molding with high gloss releasability and impact resistance |
DE3005332C2 (de) * | 1980-02-13 | 1982-06-03 | Fa. J.S. Staedtler, 8500 Nürnberg | Radiergummi mit thermoplastischem Bindemittel |
JPS6178871A (ja) * | 1984-09-27 | 1986-04-22 | Matsushita Electric Works Ltd | 樹脂硬化物の改質法 |
JPS63224940A (ja) * | 1987-03-15 | 1988-09-20 | 松下電工株式会社 | プリント配線板材料 |
-
1988
- 1988-05-10 FR FR8806292A patent/FR2615196B1/fr not_active Expired - Fee Related
- 1988-05-12 GB GB8811227A patent/GB2204588B/en not_active Expired - Lifetime
- 1988-05-13 DE DE19883816443 patent/DE3816443C2/de not_active Expired - Lifetime
- 1988-05-14 JP JP63118022A patent/JP2758899B2/ja not_active Expired - Fee Related
- 1988-11-15 JP JP63288714A patent/JP2758907B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4499240A (en) * | 1983-11-23 | 1985-02-12 | Hercules Incorporated | Low density, polybutadiene based, wet filament winding resin |
EP0147058A2 (en) * | 1983-11-23 | 1985-07-03 | Hercules Incorporated | Low density, polybutadiene based, wet filament winding resin |
GB2172892A (en) * | 1985-03-25 | 1986-10-01 | Matsushita Electric Works Ltd | Method of preparing polyphenylene oxide composition and laminate using the composition |
Also Published As
Publication number | Publication date |
---|---|
JP2758907B2 (ja) | 1998-05-28 |
FR2615196A1 (fr) | 1988-11-18 |
JPH02145624A (ja) | 1990-06-05 |
JPS64135A (en) | 1989-01-05 |
JP2758899B2 (ja) | 1998-05-28 |
GB2204588A (en) | 1988-11-16 |
FR2615196B1 (fr) | 1994-03-25 |
DE3816443C2 (de) | 2001-07-12 |
DE3816443A1 (de) | 1988-11-24 |
GB8811227D0 (en) | 1988-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Expiry date: 20080511 |