GB8811227D0 - Moldable thermosetting composition - Google Patents

Moldable thermosetting composition

Info

Publication number
GB8811227D0
GB8811227D0 GB888811227A GB8811227A GB8811227D0 GB 8811227 D0 GB8811227 D0 GB 8811227D0 GB 888811227 A GB888811227 A GB 888811227A GB 8811227 A GB8811227 A GB 8811227A GB 8811227 D0 GB8811227 D0 GB 8811227D0
Authority
GB
United Kingdom
Prior art keywords
thermosetting composition
moldable thermosetting
moldable
composition
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB888811227A
Other versions
GB2204588A (en
GB2204588B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of GB8811227D0 publication Critical patent/GB8811227D0/en
Publication of GB2204588A publication Critical patent/GB2204588A/en
Application granted granted Critical
Publication of GB2204588B publication Critical patent/GB2204588B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
GB8811227A 1987-05-14 1988-05-12 Forming process for moldable thermosetting composition Expired - Lifetime GB2204588B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5024387A 1987-05-14 1987-05-14

Publications (3)

Publication Number Publication Date
GB8811227D0 true GB8811227D0 (en) 1988-06-15
GB2204588A GB2204588A (en) 1988-11-16
GB2204588B GB2204588B (en) 1992-01-02

Family

ID=21964164

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8811227A Expired - Lifetime GB2204588B (en) 1987-05-14 1988-05-12 Forming process for moldable thermosetting composition

Country Status (4)

Country Link
JP (2) JP2758899B2 (en)
DE (1) DE3816443C2 (en)
FR (1) FR2615196B1 (en)
GB (1) GB2204588B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3838717A1 (en) * 1988-11-15 1990-05-17 Rogers Corp FORMING METHOD FOR HARD FORM PARTS
JPH03179805A (en) * 1989-12-07 1991-08-05 Murata Mfg Co Ltd Composite material for dielectric lens antenna
US5320595A (en) * 1990-08-22 1994-06-14 Amada Company, Limited Punch press and a tool magazine for the press
GB9301929D0 (en) * 1993-02-01 1993-03-17 Raychem Ltd Low-temperature-tolerant gels
JPH07316522A (en) * 1994-05-20 1995-12-05 Toyo Ink Mfg Co Ltd Aqueous adhesive for print lamination
US6291374B1 (en) * 1994-10-13 2001-09-18 World Properties, Inc. Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture
JPH09147626A (en) * 1995-11-22 1997-06-06 Nippon Zeon Co Ltd Resin composition and moldings
WO1998026431A1 (en) * 1996-12-13 1998-06-18 Hoechst Celanese Corporation Cyclic olefin polymer composites having a high dielectric constant
US6562448B1 (en) 2000-04-06 2003-05-13 3M Innovative Properties Company Low density dielectric having low microwave loss
JP3700617B2 (en) 2001-07-04 2005-09-28 株式会社村田製作所 Lens antenna
US9596755B2 (en) * 2014-10-15 2017-03-14 Rogers Corporation Magneto-dielectric substrate, circuit material, and assembly having the same
GB2603072B (en) * 2019-11-22 2024-01-24 Rogers Corp Shaped dielectric component cross-linked via irradiation and method of making thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3526606A (en) * 1966-11-24 1970-09-01 Asahi Chemical Ind Compositions comprising a block copolymer,rubber and a process oil
JPS555541B2 (en) * 1974-09-05 1980-02-07
US4113800A (en) * 1974-11-25 1978-09-12 General Electric High impact polyphenylene ether resin compositions that include A-B-A block copolymers
JPS5375250A (en) * 1976-12-17 1978-07-04 Sumitomo Electric Ind Ltd Resin composition
JPS5556143A (en) * 1978-10-19 1980-04-24 Asahi Chem Ind Co Ltd Polyethylene composition for rotational molding with high gloss releasability and impact resistance
DE3005332C2 (en) * 1980-02-13 1982-06-03 Fa. J.S. Staedtler, 8500 Nürnberg Eraser with thermoplastic binder
US4499240A (en) * 1983-11-23 1985-02-12 Hercules Incorporated Low density, polybutadiene based, wet filament winding resin
JPS6178871A (en) * 1984-09-27 1986-04-22 Matsushita Electric Works Ltd Method for modifying cured resin article
CA1285675C (en) * 1985-03-25 1991-07-02 Takaaki Sakamoto Method of preparing polyphenylene oxide composition and laminate using the composition
JPS63224940A (en) * 1987-03-15 1988-09-20 松下電工株式会社 Printed wiring board material

Also Published As

Publication number Publication date
DE3816443A1 (en) 1988-11-24
JPS64135A (en) 1989-01-05
FR2615196B1 (en) 1994-03-25
GB2204588A (en) 1988-11-16
DE3816443C2 (en) 2001-07-12
GB2204588B (en) 1992-01-02
JP2758899B2 (en) 1998-05-28
JPH02145624A (en) 1990-06-05
FR2615196A1 (en) 1988-11-18
JP2758907B2 (en) 1998-05-28

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20080511