FR2615196B1 - MOLDABLE THERMOSETTING COMPOSITION CONTAINING A POLYISOPRENE OR POLYBUTADIENE RESIN AND A THERMOPLASTIC ELASTOMER WITH OPTIONALLY A FILLER, PROCESS FOR FORMING THE SAME, AND THERMOSETTED SHAPED ARTICLE THEREOF - Google Patents
MOLDABLE THERMOSETTING COMPOSITION CONTAINING A POLYISOPRENE OR POLYBUTADIENE RESIN AND A THERMOPLASTIC ELASTOMER WITH OPTIONALLY A FILLER, PROCESS FOR FORMING THE SAME, AND THERMOSETTED SHAPED ARTICLE THEREOFInfo
- Publication number
- FR2615196B1 FR2615196B1 FR8806292A FR8806292A FR2615196B1 FR 2615196 B1 FR2615196 B1 FR 2615196B1 FR 8806292 A FR8806292 A FR 8806292A FR 8806292 A FR8806292 A FR 8806292A FR 2615196 B1 FR2615196 B1 FR 2615196B1
- Authority
- FR
- France
- Prior art keywords
- thermosetted
- polyisoprene
- filler
- optionally
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5024387A | 1987-05-14 | 1987-05-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2615196A1 FR2615196A1 (en) | 1988-11-18 |
FR2615196B1 true FR2615196B1 (en) | 1994-03-25 |
Family
ID=21964164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8806292A Expired - Fee Related FR2615196B1 (en) | 1987-05-14 | 1988-05-10 | MOLDABLE THERMOSETTING COMPOSITION CONTAINING A POLYISOPRENE OR POLYBUTADIENE RESIN AND A THERMOPLASTIC ELASTOMER WITH OPTIONALLY A FILLER, PROCESS FOR FORMING THE SAME, AND THERMOSETTED SHAPED ARTICLE THEREOF |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP2758899B2 (en) |
DE (1) | DE3816443C2 (en) |
FR (1) | FR2615196B1 (en) |
GB (1) | GB2204588B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3838717A1 (en) * | 1988-11-15 | 1990-05-17 | Rogers Corp | FORMING METHOD FOR HARD FORM PARTS |
JPH03179805A (en) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | Composite material for dielectric lens antenna |
US5320595A (en) * | 1990-08-22 | 1994-06-14 | Amada Company, Limited | Punch press and a tool magazine for the press |
GB9301929D0 (en) * | 1993-02-01 | 1993-03-17 | Raychem Ltd | Low-temperature-tolerant gels |
JPH07316522A (en) * | 1994-05-20 | 1995-12-05 | Toyo Ink Mfg Co Ltd | Aqueous adhesive for print lamination |
US6291374B1 (en) * | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
JPH09147626A (en) * | 1995-11-22 | 1997-06-06 | Nippon Zeon Co Ltd | Resin composition and moldings |
WO1998026431A1 (en) * | 1996-12-13 | 1998-06-18 | Hoechst Celanese Corporation | Cyclic olefin polymer composites having a high dielectric constant |
US6562448B1 (en) | 2000-04-06 | 2003-05-13 | 3M Innovative Properties Company | Low density dielectric having low microwave loss |
JP3700617B2 (en) | 2001-07-04 | 2005-09-28 | 株式会社村田製作所 | Lens antenna |
US9596755B2 (en) * | 2014-10-15 | 2017-03-14 | Rogers Corporation | Magneto-dielectric substrate, circuit material, and assembly having the same |
KR20220105642A (en) * | 2019-11-22 | 2022-07-27 | 로저스코포레이션 | Molded dielectric component crosslinked through irradiation and method of making same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3526606A (en) * | 1966-11-24 | 1970-09-01 | Asahi Chemical Ind | Compositions comprising a block copolymer,rubber and a process oil |
JPS555541B2 (en) * | 1974-09-05 | 1980-02-07 | ||
US4113800A (en) * | 1974-11-25 | 1978-09-12 | General Electric | High impact polyphenylene ether resin compositions that include A-B-A block copolymers |
JPS5375250A (en) * | 1976-12-17 | 1978-07-04 | Sumitomo Electric Ind Ltd | Resin composition |
JPS5556143A (en) * | 1978-10-19 | 1980-04-24 | Asahi Chem Ind Co Ltd | Polyethylene composition for rotational molding with high gloss releasability and impact resistance |
DE3005332C2 (en) * | 1980-02-13 | 1982-06-03 | Fa. J.S. Staedtler, 8500 Nürnberg | Eraser with thermoplastic binder |
US4499240A (en) * | 1983-11-23 | 1985-02-12 | Hercules Incorporated | Low density, polybutadiene based, wet filament winding resin |
JPS6178871A (en) * | 1984-09-27 | 1986-04-22 | Matsushita Electric Works Ltd | Method for modifying cured resin article |
CA1285675C (en) * | 1985-03-25 | 1991-07-02 | Takaaki Sakamoto | Method of preparing polyphenylene oxide composition and laminate using the composition |
JPS63224940A (en) * | 1987-03-15 | 1988-09-20 | 松下電工株式会社 | Printed wiring board material |
-
1988
- 1988-05-10 FR FR8806292A patent/FR2615196B1/en not_active Expired - Fee Related
- 1988-05-12 GB GB8811227A patent/GB2204588B/en not_active Expired - Lifetime
- 1988-05-13 DE DE19883816443 patent/DE3816443C2/en not_active Expired - Lifetime
- 1988-05-14 JP JP63118022A patent/JP2758899B2/en not_active Expired - Fee Related
- 1988-11-15 JP JP63288714A patent/JP2758907B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02145624A (en) | 1990-06-05 |
DE3816443C2 (en) | 2001-07-12 |
FR2615196A1 (en) | 1988-11-18 |
JPS64135A (en) | 1989-01-05 |
GB2204588B (en) | 1992-01-02 |
DE3816443A1 (en) | 1988-11-24 |
JP2758907B2 (en) | 1998-05-28 |
GB2204588A (en) | 1988-11-16 |
GB8811227D0 (en) | 1988-06-15 |
JP2758899B2 (en) | 1998-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |