GB2149697B - Chuck - Google Patents
ChuckInfo
- Publication number
- GB2149697B GB2149697B GB08427544A GB8427544A GB2149697B GB 2149697 B GB2149697 B GB 2149697B GB 08427544 A GB08427544 A GB 08427544A GB 8427544 A GB8427544 A GB 8427544A GB 2149697 B GB2149697 B GB 2149697B
- Authority
- GB
- United Kingdom
- Prior art keywords
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54781183A | 1983-11-01 | 1983-11-01 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8427544D0 GB8427544D0 (en) | 1984-12-05 |
GB2149697A GB2149697A (en) | 1985-06-19 |
GB2149697B true GB2149697B (en) | 1987-04-23 |
Family
ID=24186226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08427544A Expired GB2149697B (en) | 1983-11-01 | 1984-10-31 | Chuck |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS6099538A (nl) |
DE (1) | DE3438980A1 (nl) |
FR (1) | FR2554250A1 (nl) |
GB (1) | GB2149697B (nl) |
NL (1) | NL8403227A (nl) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600530A (en) | 1992-08-04 | 1997-02-04 | The Morgan Crucible Company Plc | Electrostatic chuck |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551192A (en) * | 1983-06-30 | 1985-11-05 | International Business Machines Corporation | Electrostatic or vacuum pinchuck formed with microcircuit lithography |
DE3514741A1 (de) * | 1985-04-24 | 1986-10-30 | Supfina Maschinenfabrik Hentzen Kg, 5630 Remscheid | Vorrichtung zum feinbearbeiten ebener flaechen von scheibenfoermigen werkstuecken mit unbearbeiteter auflageseite und geringer wandstaerke |
JP2581066B2 (ja) * | 1987-03-31 | 1997-02-12 | 富士通株式会社 | ウエ−ハ搬送方法及び装置 |
JP2748127B2 (ja) * | 1988-09-02 | 1998-05-06 | キヤノン株式会社 | ウエハ保持方法 |
JPH02174116A (ja) * | 1988-12-26 | 1990-07-05 | Toshiba Ceramics Co Ltd | サセプタ |
JPH0488045U (nl) * | 1990-12-18 | 1992-07-30 | ||
JPH05251544A (ja) * | 1992-03-05 | 1993-09-28 | Fujitsu Ltd | 搬送装置 |
EP0669640A1 (en) * | 1994-02-25 | 1995-08-30 | Applied Materials, Inc. | Susceptor for deposition apparatus |
US5645646A (en) * | 1994-02-25 | 1997-07-08 | Applied Materials, Inc. | Susceptor for deposition apparatus |
US5583736A (en) * | 1994-11-17 | 1996-12-10 | The United States Of America As Represented By The Department Of Energy | Micromachined silicon electrostatic chuck |
US5588203A (en) * | 1995-02-28 | 1996-12-31 | Matsushita Communication Industrial Corporation Of America | Nozzle for a vacuum mounting head |
US6399143B1 (en) * | 1996-04-09 | 2002-06-04 | Delsys Pharmaceutical Corporation | Method for clamping and electrostatically coating a substrate |
DE19630932A1 (de) * | 1996-07-31 | 1998-02-05 | Wacker Siltronic Halbleitermat | Träger für eine Halbleiterscheibe und Verwendung des Trägers |
US6383890B2 (en) * | 1997-12-26 | 2002-05-07 | Canon Kabushiki Kaisha | Wafer bonding method, apparatus and vacuum chuck |
DE10027931C1 (de) * | 2000-05-31 | 2002-01-10 | Infineon Technologies Ag | Verfahren zur rückseitigen elektrischen Kontaktierung eines Halbleitersubstrats während seiner Bearbeitung |
JP3577546B2 (ja) * | 2001-02-08 | 2004-10-13 | 株式会社 日立インダストリイズ | 基板の組立方法及び組立装置 |
US6803780B2 (en) * | 2001-07-10 | 2004-10-12 | Solid State Measurements, Inc. | Sample chuck with compound construction |
FR2835242A1 (fr) * | 2002-01-28 | 2003-08-01 | Karl Suss France | Dispositif pour le support avec maintien de plaquettes |
DE10235482B3 (de) * | 2002-08-02 | 2004-01-22 | Süss Microtec Lithography Gmbh | Vorrichtung zum Fixieren dünner und flexibler Substrate |
EP1431831B1 (en) * | 2002-12-20 | 2007-08-08 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method and substrate holder |
EP1431825A1 (en) | 2002-12-20 | 2004-06-23 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and substrate holder |
DE10319272A1 (de) * | 2003-04-29 | 2004-11-25 | Infineon Technologies Ag | Multifunktionsträger sowie zugehörige Andockstation |
JP3894562B2 (ja) | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | 基板吸着装置、露光装置およびデバイス製造方法 |
CN102581976B (zh) * | 2012-03-14 | 2015-04-29 | 浙江昀丰新能源科技有限公司 | 一种晶体加工用定向装置 |
US11664264B2 (en) | 2016-02-08 | 2023-05-30 | Asml Netherlands B.V. | Lithographic apparatus, method for unloading a substrate and method for loading a substrate |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US661840A (en) * | 1899-12-23 | 1900-11-13 | John G Baker | Photographic-print holder. |
FR1504796A (fr) * | 1966-10-28 | 1967-12-08 | Sud Aviation | Procédé et dispositif de fixation par dépression de pièces à usiner |
US3652075A (en) * | 1969-11-10 | 1972-03-28 | Sheldon Thompson | Vacuum chuck and related apparatus and methods |
US3740900A (en) * | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
GB1443215A (en) * | 1973-11-07 | 1976-07-21 | Mullard Ltd | Electrostatically clamping a semiconductor wafer during device manufacture |
US4213698A (en) * | 1978-12-01 | 1980-07-22 | Bell Telephone Laboratories, Incorporated | Apparatus and method for holding and planarizing thin workpieces |
SE444526B (sv) * | 1978-01-23 | 1986-04-21 | Western Electric Co | Sett att i lege och plan placera en substratbricka |
DD143131A1 (de) * | 1979-04-26 | 1980-07-30 | Ute Bergner | Vorrichtung zum elektrostatischen halten von werkstuecken,insbesondere halbleiterscheiben |
DK73681A (da) * | 1981-02-19 | 1982-08-20 | Carlsen Litho A S | Fremgangsmaade ved anbringelse af forholdsvis tykke og stive kartonoriginaler paa en scannercylinder,samt apparat til brug ved udoevelse af fremgangsmaaden |
US4433835A (en) * | 1981-11-30 | 1984-02-28 | Tencor Instruments | Wafer chuck with wafer cleaning feature |
US4506184A (en) * | 1984-01-10 | 1985-03-19 | Varian Associates, Inc. | Deformable chuck driven by piezoelectric means |
-
1984
- 1984-10-18 JP JP21744884A patent/JPS6099538A/ja active Pending
- 1984-10-24 DE DE19843438980 patent/DE3438980A1/de not_active Withdrawn
- 1984-10-24 NL NL8403227A patent/NL8403227A/nl not_active Application Discontinuation
- 1984-10-30 FR FR8416591A patent/FR2554250A1/fr active Pending
- 1984-10-31 GB GB08427544A patent/GB2149697B/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600530A (en) | 1992-08-04 | 1997-02-04 | The Morgan Crucible Company Plc | Electrostatic chuck |
Also Published As
Publication number | Publication date |
---|---|
JPS6099538A (ja) | 1985-06-03 |
FR2554250A1 (fr) | 1985-05-03 |
GB8427544D0 (en) | 1984-12-05 |
GB2149697A (en) | 1985-06-19 |
DE3438980A1 (de) | 1985-05-09 |
NL8403227A (nl) | 1985-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19931031 |