GB8427544D0 - Pin chuck - Google Patents

Pin chuck

Info

Publication number
GB8427544D0
GB8427544D0 GB848427544A GB8427544A GB8427544D0 GB 8427544 D0 GB8427544 D0 GB 8427544D0 GB 848427544 A GB848427544 A GB 848427544A GB 8427544 A GB8427544 A GB 8427544A GB 8427544 D0 GB8427544 D0 GB 8427544D0
Authority
GB
United Kingdom
Prior art keywords
pin chuck
chuck
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB848427544A
Other versions
GB2149697B (en
GB2149697A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of GB8427544D0 publication Critical patent/GB8427544D0/en
Publication of GB2149697A publication Critical patent/GB2149697A/en
Application granted granted Critical
Publication of GB2149697B publication Critical patent/GB2149697B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
GB08427544A 1983-11-01 1984-10-31 Chuck Expired GB2149697B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54781183A 1983-11-01 1983-11-01

Publications (3)

Publication Number Publication Date
GB8427544D0 true GB8427544D0 (en) 1984-12-05
GB2149697A GB2149697A (en) 1985-06-19
GB2149697B GB2149697B (en) 1987-04-23

Family

ID=24186226

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08427544A Expired GB2149697B (en) 1983-11-01 1984-10-31 Chuck

Country Status (5)

Country Link
JP (1) JPS6099538A (en)
DE (1) DE3438980A1 (en)
FR (1) FR2554250A1 (en)
GB (1) GB2149697B (en)
NL (1) NL8403227A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
DE3514741A1 (en) * 1985-04-24 1986-10-30 Supfina Maschinenfabrik Hentzen Kg, 5630 Remscheid DEVICE FOR FINISHING LEVEL SURFACES OF DISK-SHAPED WORKPIECES WITH UNPROCESSED SUPPORT PAGE AND LOW WALL THICKNESS
JP2581066B2 (en) * 1987-03-31 1997-02-12 富士通株式会社 Wafer transfer method and apparatus
JP2748127B2 (en) * 1988-09-02 1998-05-06 キヤノン株式会社 Wafer holding method
JPH02174116A (en) * 1988-12-26 1990-07-05 Toshiba Ceramics Co Ltd Susceptor
JPH0488045U (en) * 1990-12-18 1992-07-30
JPH05251544A (en) * 1992-03-05 1993-09-28 Fujitsu Ltd Conveyor
US5600530A (en) 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck
US5645646A (en) * 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
EP0669640A1 (en) * 1994-02-25 1995-08-30 Applied Materials, Inc. Susceptor for deposition apparatus
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5588203A (en) * 1995-02-28 1996-12-31 Matsushita Communication Industrial Corporation Of America Nozzle for a vacuum mounting head
US6399143B1 (en) * 1996-04-09 2002-06-04 Delsys Pharmaceutical Corporation Method for clamping and electrostatically coating a substrate
DE19630932A1 (en) * 1996-07-31 1998-02-05 Wacker Siltronic Halbleitermat Carrier for a semiconductor wafer and use of the carrier
US6383890B2 (en) * 1997-12-26 2002-05-07 Canon Kabushiki Kaisha Wafer bonding method, apparatus and vacuum chuck
DE10027931C1 (en) 2000-05-31 2002-01-10 Infineon Technologies Ag Method for rear-side electrical contacting of a semiconductor substrate during its processing
JP3577546B2 (en) * 2001-02-08 2004-10-13 株式会社 日立インダストリイズ Substrate assembling method and assembling apparatus
US6803780B2 (en) * 2001-07-10 2004-10-12 Solid State Measurements, Inc. Sample chuck with compound construction
FR2835242A1 (en) * 2002-01-28 2003-08-01 Karl Suss France Device for the support with holding of wafers, comprises a support face with suction provision and a screen
DE10235482B3 (en) * 2002-08-02 2004-01-22 Süss Microtec Lithography Gmbh Device for fixing thin and flexible substrates
EP1431825A1 (en) * 2002-12-20 2004-06-23 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate holder
EP1431831B1 (en) * 2002-12-20 2007-08-08 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method and substrate holder
DE10319272A1 (en) * 2003-04-29 2004-11-25 Infineon Technologies Ag Multifunction carrier and associated docking station
JP3894562B2 (en) 2003-10-01 2007-03-22 キヤノン株式会社 Substrate adsorption apparatus, exposure apparatus, and device manufacturing method
CN102581976B (en) * 2012-03-14 2015-04-29 浙江昀丰新能源科技有限公司 Crystal processing orientation device
NL2018051A (en) 2016-02-08 2017-08-11 Asml Netherlands Bv Lithographic apparatus, method for unloading a substrate and method for loading a substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US661840A (en) * 1899-12-23 1900-11-13 John G Baker Photographic-print holder.
FR1504796A (en) * 1966-10-28 1967-12-08 Sud Aviation Method and device for vacuum fastening of workpieces
US3652075A (en) * 1969-11-10 1972-03-28 Sheldon Thompson Vacuum chuck and related apparatus and methods
US3740900A (en) * 1970-07-01 1973-06-26 Signetics Corp Vacuum chuck assembly for semiconductor manufacture
GB1443215A (en) * 1973-11-07 1976-07-21 Mullard Ltd Electrostatically clamping a semiconductor wafer during device manufacture
SE444526B (en) * 1978-01-23 1986-04-21 Western Electric Co PUT IN PLACE AND PLAN TO PLACE A SUBSTRATE DISH
US4213698A (en) * 1978-12-01 1980-07-22 Bell Telephone Laboratories, Incorporated Apparatus and method for holding and planarizing thin workpieces
DD143131A1 (en) * 1979-04-26 1980-07-30 Ute Bergner DEVICE FOR ELECTROSTATIC HOLDING OF WORKPIECES, PARTICULARLY SEMICONDUCTED DISCS
DK73681A (en) * 1981-02-19 1982-08-20 Carlsen Litho A S PROCEDURE FOR APPLICATION OF THICKNESS AND RIGENT CARTON ORIGINALS ON A SCANNER CYLINDER, AND APPARATUS FOR USE IN EXERCISING THE PROCEDURE
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means

Also Published As

Publication number Publication date
GB2149697B (en) 1987-04-23
DE3438980A1 (en) 1985-05-09
JPS6099538A (en) 1985-06-03
GB2149697A (en) 1985-06-19
FR2554250A1 (en) 1985-05-03
NL8403227A (en) 1985-06-03

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931031