FR2835242A1 - Device for the support with holding of wafers, comprises a support face with suction provision and a screen - Google Patents
Device for the support with holding of wafers, comprises a support face with suction provision and a screen Download PDFInfo
- Publication number
- FR2835242A1 FR2835242A1 FR0200974A FR0200974A FR2835242A1 FR 2835242 A1 FR2835242 A1 FR 2835242A1 FR 0200974 A FR0200974 A FR 0200974A FR 0200974 A FR0200974 A FR 0200974A FR 2835242 A1 FR2835242 A1 FR 2835242A1
- Authority
- FR
- France
- Prior art keywords
- screen
- bearing face
- support face
- support
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
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La présente invention concerne un dispositif pour le support avec maintien de plaquettes, par exemple pour la fixation, la préhension et/ou la manipulation desdites plaquettes qui peuvent, par exemple, être des plaquettes semi-conductrices porteuses d'une pluralité de dispositifs semiconducteurs et généralement appelées wafers dans la technique. The present invention relates to a device for the support with holding of wafers, for example for fixing, gripping and / or handling said wafers which can, for example, be semiconductor wafers carrying a plurality of semiconductor devices and generally called wafers in the art.
Jusqu'à présent, de telles plaquettes semi-conductrices avaient une épaisseur de l'ordre de 600 micromètres et présentaient une résistance mécanique suffisante pour être manipulées à l'aide de brucelles ou de pipettes à vide, les saisissant périphériquement pour éviter d'endommager lesdits dispositifs semi-conducteurs qu'elles portent. Until now, such semiconductor wafers have a thickness of the order of 600 micrometers and have sufficient mechanical strength to be handled using tweezers or vacuum pipettes, gripping them peripherally to avoid damage. said semiconductor devices they carry.
Or, depuis quelque temps, le progrès technique a permis d'abaisser l'épaisseur desdites plaquettes semi-conductrices jusqu'à environ 50 micromètres. En revanche, ces dernières plaquettes ne peuvent plus être manipulées à l'aide de brucelles ou de pipettes à vide, car lorsqu'elles sont saisies périphériquement par ces organes, leur résistance mécanique propre n'est pas suffisante pour qu'elles résistent à leur propre poids. However, for some time, technical progress has made it possible to reduce the thickness of said semiconductor wafers to around 50 micrometers. On the other hand, these latter wafers can no longer be handled using tweezers or vacuum pipettes, because when they are gripped peripherally by these organs, their own mechanical resistance is not sufficient for them to resist their own weight.
La présente invention a pour objet un dispositif permettant la préhension et/ou la manipulation de telles plaquettes, même très minces et de très grande fragilité. The present invention relates to a device allowing the gripping and / or the handling of such plates, even very thin and very fragile.
A cette fin, selon l'invention, le dispositif pour le support avec maintien de plaquettes est remarquable en ce qu'il comporte : - une face d'appui rigide et plane ; - un ensemble d'aspérités portées par ladite face d'appui plane ; et - des moyens de succion débouchant dans ladite face d'appui plane. To this end, according to the invention, the device for the support with holding plates is remarkable in that it comprises: - a rigid and flat bearing face; - a set of roughness carried by said planar support face; and - suction means opening into said planar bearing face.
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Dans un premier mode de réalisation, ledit ensemble d'aspérités peut être formé par un écran poreux de fils croisés appliqué sur ladite face d'appui plane. In a first embodiment, said assembly of asperities can be formed by a porous screen of crossed wires applied to said planar bearing face.
Ainsi, une telle plaquette peut s'appliquer contre ladite face d'appui, sous l'action de la succion, par l'intermédiaire dudit écran poreux, qui constitue une protection pour ladite plaquette. En effet, chaque croisement en relief des fils croisés dudit écran constitue une aspérité en forme de bossage arrondi, par nature doux, mou et non abrasif, qui est au contact de ladite plaquette, de sorte que cette dernière est appliquée contre ladite face d'appui rigide par l'intermédiaire d'une pluralité de tels bossages individuels. Thus, such a plate can be applied against said bearing face, under the action of suction, through said porous screen, which constitutes protection for said plate. Indeed, each cross in relief of the crossed wires of said screen constitutes an asperity in the form of a rounded boss, by nature soft, soft and non-abrasive, which is in contact with said plate, so that the latter is applied against said face of rigid support via a plurality of such individual bosses.
De bons résultats ont été obtenus lorsque ledit écran est en un tissu du type de ceux utilisés comme écran de sérigraphie. Cependant, ledit écran peut être réalisé en toutes sortes de fils autres que textiles, tels que par exemple des fils métalliques ou des fibres de carbone, etc... Il peut être avantageux, dans certains cas d'utilisation, qu'au moins certains fils constituant ledit écran soient conducteurs de l'électricité. Good results have been obtained when said screen is made of a fabric of the type of those used as a screen printing screen. However, said screen can be made of all kinds of threads other than textiles, such as for example metallic threads or carbon fibers, etc. It may be advantageous, in certain use cases, that at least some wires constituting said screen are electrically conductive.
Il est préférable que ledit écran soit tendu sur ladite face d'appui. It is preferable that said screen is stretched over said support face.
Ledit écran peut être fixé à ladite face d'appui, le long de la périphérie de celle-ci, par exemple par collage. Said screen can be fixed to said bearing face, along the periphery thereof, for example by gluing.
Dans un deuxième mode de réalisation de la présente invention, ledit ensemble d'aspérités peut être formé par des irrégularités de surface de ladite face d'appui plane. Ces irrégularités de surface peuvent être for- mées--par estampage, par usinage (par exemple par voie chimique ou abrasive), etc dans ladite face d'appui plane sans en détruire la planéité. De préférence, lesdites irrégularités de surface présentent chacune la forme d'un bossage arrondi, comme décrit ci-dessus à propos dudit écran poreux. In a second embodiment of the present invention, said assembly of asperities can be formed by surface irregularities of said planar bearing face. These surface irregularities can be formed - by stamping, by machining (for example by chemical or abrasive means), etc. in said planar bearing face without destroying their flatness. Preferably, said surface irregularities each have the shape of a rounded boss, as described above with respect to said porous screen.
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Ainsi, grâce à la présente invention, quel que soit le mode de réalisation, ladite plaquette est appliquée contre ladite surface d'appui, par l'intermédiaire d'une pluralité d'appuis localisés non destructifs. Ladite plaquette ne risque donc pas, ni de se briser, ni d'être détériorée. Des essais ont montré que même la face active (celle qui porte les dispositifs semi-conducteurs) de la plaquette n'était pas détériorée par l'utilisation du dispositif conforme à la présente invention. Thus, thanks to the present invention, whatever the embodiment, said plate is applied against said bearing surface, by means of a plurality of localized non-destructive supports. Said plate therefore does not risk either to break or to be damaged. Tests have shown that even the active face (that which carries the semiconductor devices) of the wafer was not deteriorated by the use of the device according to the present invention.
Lesdits moyens de succion peuvent comporter soit une pluralité d'orifices disposés dans ladite face d'appui rigide et plane, soit un orifice unique disposé centralement dans cette dernière. Said suction means may comprise either a plurality of orifices arranged in said rigid and planar bearing face, or a single orifice disposed centrally in the latter.
Le dispositif de support conforme à la présente invention peut constituer soit un outil autonome, soit une partie amovible d'une machine de traitement desdites plaquettes. The support device according to the present invention can constitute either an autonomous tool or a removable part of a machine for processing said wafers.
Les figures du dessin annexé feront bien comprendre comment l'invention peut être réalisée. Sur ces figures, des références identiques désignent des éléments semblables. The figures of the appended drawing will make it clear how the invention can be implemented. In these figures, identical references designate similar elements.
La figure 1 est une coupe diamétrale d'un exemple de réalisation du dispositif de support conforme à la présente invention. Figure 1 is a diametrical section of an exemplary embodiment of the support device according to the present invention.
Les figures 2 et 3 sont respectivement des vues de dessus et de dessous du dispositif de support de la figure 1. Figures 2 and 3 are respectively top and bottom views of the support device of Figure 1.
La figure 4 est une vue en coupe partielle, très agrandie, selon la ligne IV-IV de la figure 1. Figure 4 is a partial sectional view, greatly enlarged, along line IV-IV of Figure 1.
La figure 5 illustre, en vue de dessous comparable à la figure 3, un autre exemple de réalisation du dispositif de support conforme à la présente invention. Figure 5 illustrates, in bottom view comparable to Figure 3, another embodiment of the support device according to the present invention.
La figure 6 est une vue en coupe partielle agrandie, comparable à la figure 4, du dispositif de support de la figure 5. FIG. 6 is an enlarged partial sectional view, comparable to FIG. 4, of the support device of FIG. 5.
Le dispositif de support 1, conforme à la présente invention et représenté sur les figures 1 à 4, comporte un disque rigide 2 pourvu d'une The support device 1, according to the present invention and shown in Figures 1 to 4, comprises a rigid disc 2 provided with a
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face d'appui plane 3 et un embout 4 rapporté à la périphérie dudit disque 2 et apte à être raccordé à une source de vide (non représentée) par un conduit 5. Dans son épaisseur, le disque 2 comporte un réseau de canaux 6 reliés, d'un côté, au conduit 5 et, de l'autre, à au moins un orifice 7 débouchant dans la face d'appui plane 3. Dans le cas où il n'existe qu'un seul orifice 7, celui-ci est de préférence centré par rapport à la face d'appui 3. flat support face 3 and a nozzle 4 attached to the periphery of said disc 2 and able to be connected to a vacuum source (not shown) by a conduit 5. In its thickness, the disc 2 comprises a network of channels 6 connected , on the one hand, to the duct 5 and, on the other, to at least one orifice 7 opening into the planar bearing face 3. In the case where there is only one orifice 7, the latter is preferably centered with respect to the support face 3.
De plus, la face d'appui plane 3 est recouverte d'un écran de tissu 8, tendu sur celle-ci et fixé à la périphérie de ladite face d'appui 3, par exemple par l'intermédiaire d'une zone annulaire de collage 9. Le tissu de l'écran 8 est avantageusement constitué de fils fins croisés 10, 11 (voir la figure 4) et il est par exemple du type utilisé pour la réalisation des écrans de sérigraphie. Les fils 10,11 peuvent également être métalliques ou être constitués par des fibres de grande résistance, telles que des fibres de carbone. In addition, the planar support face 3 is covered with a fabric screen 8, stretched over it and fixed to the periphery of said support face 3, for example by means of an annular zone of bonding 9. The fabric of the screen 8 advantageously consists of fine crossed threads 10, 11 (see FIG. 4) and it is for example of the type used for the production of screen printing screens. The wires 10, 11 can also be metallic or consist of fibers of high resistance, such as carbon fibers.
Le dispositif de support 1 est destiné à supporter et maintenir des plaquettes 12, par exemple des wafers, dont l'épaisseur est par exemple aussi petite que 50 micromètres. The support device 1 is intended to support and maintain plates 12, for example wafers, the thickness of which is for example as small as 50 micrometers.
Pour saisir une plaquette 12, le dispositif 1 est amené en regard de celle-ci, avec son écran 8 dirigé vers ladite plaquette. La source à vide étant connectée au conduit 5, la dépression de succion engendrée à l'orifice 7 aspire la plaquette 12 à travers ledit écran 8, qui est poreux par nature (comme cela est illustré par la flèche sur la figure 4). Ladite plaquette 12 s'applique donc contre la face d'appui 3 avec interposition de l'écran tissé 8. Comme le montre la figure 4, ce sont les bossages 14, formés par les croisements en relief des fils 10 et 11, qui servent d'interface entre la plaquette 12 et la face d'appui 3. To grasp a wafer 12, the device 1 is brought opposite it, with its screen 8 directed towards said wafer. The vacuum source being connected to the conduit 5, the suction depression generated at the orifice 7 sucks the wafer 12 through said screen 8, which is porous by nature (as illustrated by the arrow in Figure 4). Said plate 12 therefore applies against the bearing face 3 with the interposition of the woven screen 8. As shown in FIG. 4, it is the bosses 14, formed by the raised crosses of the wires 10 and 11, which serve interface between the plate 12 and the support face 3.
Bien entendu, lorsque le vide est coupé, la succion prend fin et la plaquette 12 peut être déposée sur un support adéquat. Of course, when the vacuum is cut, the suction ends and the wafer 12 can be placed on a suitable support.
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Dans la variante de réalisation de la présente invention illustrée par les figures 5 et 6, le dispositif de support 20 comporte un disque rigide 21 (comparable au disque 2) pourvu d'une face d'appui plane 22 et d'un embout 23 (comparable à l'embout 4), apte à être raccordé, d'un côté, à une source de vide (non représentée) et, de l'autre, à un orifice d'aspiration 24 (semblable à l'orifice 7), disposé centralement dans ladite face 22. In the alternative embodiment of the present invention illustrated by FIGS. 5 and 6, the support device 20 comprises a rigid disc 21 (comparable to the disc 2) provided with a flat bearing face 22 and a nozzle 23 ( comparable to the nozzle 4), capable of being connected, on one side, to a vacuum source (not shown) and, on the other, to a suction orifice 24 (similar to orifice 7), centrally disposed in said face 22.
De plus, cette face d'appui plane 22 comporte un ensemble d'aspérités superficielles 25, de forme arrondie, par exemple réalisées par usinage, ne nuisant pas à la planéité de ladite face 22. In addition, this planar bearing face 22 comprises a set of surface asperities 25, of rounded shape, for example produced by machining, not detrimental to the flatness of said face 22.
On comprendra aisément (voir la figure 6) que lesdites aspérités 25 jouent le même rôle d'interface que les bossages 14 pour la préhension et le maintien des plaquettes 12. It will be readily understood (see FIG. 6) that said roughness 25 plays the same interface role as the bosses 14 for gripping and holding the pads 12.
Chacun des dispositifs 1 et 20 peut constituer une partie de machine pour le traitement desdites plaquettes ou bien un outil de préhension et/ou manipulation autonome. Dans ce dernier cas, il est avantageux de prévoir une poignée creuse (non représentée) apte à transmettre le vide et disposée entre la source de vide et lesdits dispositifs 1,20, ladite poignée étant prévue pour s'emboîter par une de ses extrémités dans lesdits embouts 4 et 23. Each of the devices 1 and 20 can constitute a part of a machine for the treatment of said plates or else a tool for gripping and / or autonomous handling. In the latter case, it is advantageous to provide a hollow handle (not shown) capable of transmitting the vacuum and disposed between the vacuum source and said devices 1.20, said handle being designed to fit by one of its ends in said ends 4 and 23.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0200974A FR2835242A1 (en) | 2002-01-28 | 2002-01-28 | Device for the support with holding of wafers, comprises a support face with suction provision and a screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0200974A FR2835242A1 (en) | 2002-01-28 | 2002-01-28 | Device for the support with holding of wafers, comprises a support face with suction provision and a screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2835242A1 true FR2835242A1 (en) | 2003-08-01 |
Family
ID=27619683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0200974A Pending FR2835242A1 (en) | 2002-01-28 | 2002-01-28 | Device for the support with holding of wafers, comprises a support face with suction provision and a screen |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2835242A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006072453A1 (en) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co. Kg | Holder with porous gripper |
| WO2012112025A1 (en) * | 2011-02-16 | 2012-08-23 | Texchem Advanced Products Incorporated Sdn. Bhd. | Single and dual stage wafer cushion and wafer separator |
| WO2016142237A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
| WO2016142240A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4433835A (en) * | 1981-11-30 | 1984-02-28 | Tencor Instruments | Wafer chuck with wafer cleaning feature |
| GB2149697A (en) * | 1983-11-01 | 1985-06-19 | Varian Associates | Cluck |
| US4711014A (en) * | 1985-08-29 | 1987-12-08 | Vichem Corporation | Method for handling semiconductor die and the like |
| US20010010119A1 (en) * | 1998-08-26 | 2001-08-02 | Farnworth. Warren M. | Apparatus and method for removing carrier film from a singulated die |
-
2002
- 2002-01-28 FR FR0200974A patent/FR2835242A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4433835A (en) * | 1981-11-30 | 1984-02-28 | Tencor Instruments | Wafer chuck with wafer cleaning feature |
| GB2149697A (en) * | 1983-11-01 | 1985-06-19 | Varian Associates | Cluck |
| US4711014A (en) * | 1985-08-29 | 1987-12-08 | Vichem Corporation | Method for handling semiconductor die and the like |
| US20010010119A1 (en) * | 1998-08-26 | 2001-08-02 | Farnworth. Warren M. | Apparatus and method for removing carrier film from a singulated die |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006072453A1 (en) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co. Kg | Holder with porous gripper |
| DE102004063855A1 (en) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co.Kg | Holder with porous gripper |
| WO2012112025A1 (en) * | 2011-02-16 | 2012-08-23 | Texchem Advanced Products Incorporated Sdn. Bhd. | Single and dual stage wafer cushion and wafer separator |
| WO2016142237A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
| WO2016142240A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
| CN107431034A (en) * | 2015-03-11 | 2017-12-01 | 贝卡尔特公司 | Carrier for interim bonding wafer |
| JP2018511172A (en) * | 2015-03-11 | 2018-04-19 | エンベー ベカルト ソシエテ アノニムＮＶ Ｂｅｋａｅｒｔ ＳＡ | Temporarily bonded wafer carrier |
| US10354905B2 (en) | 2015-03-11 | 2019-07-16 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
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