GB2124835B - Current printed circuit boards - Google Patents

Current printed circuit boards

Info

Publication number
GB2124835B
GB2124835B GB08222359A GB8222359A GB2124835B GB 2124835 B GB2124835 B GB 2124835B GB 08222359 A GB08222359 A GB 08222359A GB 8222359 A GB8222359 A GB 8222359A GB 2124835 B GB2124835 B GB 2124835B
Authority
GB
United Kingdom
Prior art keywords
pads
printed circuit
pad
holes
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08222359A
Other languages
English (en)
Other versions
GB2124835A (en
Inventor
M Jean Claude Wery
Michel Jehay
Andre Job
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Priority to GB08222359A priority Critical patent/GB2124835B/en
Priority to JP58140444A priority patent/JPS5963792A/ja
Priority to DE8383902435T priority patent/DE3376187D1/de
Priority to EP83902435A priority patent/EP0114857B1/en
Priority to EP86107771A priority patent/EP0206063B1/en
Priority to PCT/GB1983/000187 priority patent/WO1984000664A1/en
Priority to DE8686107771T priority patent/DE3380247D1/de
Publication of GB2124835A publication Critical patent/GB2124835A/en
Priority to GB08506524A priority patent/GB2155382B/en
Priority to GB08506525A priority patent/GB2155368B/en
Application granted granted Critical
Publication of GB2124835B publication Critical patent/GB2124835B/en
Priority to US06/867,908 priority patent/US4654102A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/34—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49732—Repairing by attaching repair preform, e.g., remaking, restoring, or patching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB08222359A 1982-08-03 1982-08-03 Current printed circuit boards Expired GB2124835B (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
GB08222359A GB2124835B (en) 1982-08-03 1982-08-03 Current printed circuit boards
JP58140444A JPS5963792A (ja) 1982-08-03 1983-07-29 印刷回路板上の電気的な接続を変更するための方法および変更するために使用するための装置
EP83902435A EP0114857B1 (en) 1982-08-03 1983-08-02 Pad for correcting printed circuit boards and method of use thereof
EP86107771A EP0206063B1 (en) 1982-08-03 1983-08-02 Method and apparatus for correcting printed circuit boards
DE8383902435T DE3376187D1 (en) 1982-08-03 1983-08-02 Pad for correcting printed circuit boards and method of use thereof
PCT/GB1983/000187 WO1984000664A1 (en) 1982-08-03 1983-08-02 Method and apparatus for correcting printed circuit boards
DE8686107771T DE3380247D1 (en) 1982-08-03 1983-08-02 Method and apparatus for correcting printed circuit boards
GB08506524A GB2155382B (en) 1982-08-03 1985-03-13 Stitch welding of wire to a printed circuit board
GB08506525A GB2155368B (en) 1982-08-03 1985-03-13 Method and apparatus for correcting printed circuit boards
US06/867,908 US4654102A (en) 1982-08-03 1986-05-20 Method for correcting printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08222359A GB2124835B (en) 1982-08-03 1982-08-03 Current printed circuit boards

Publications (2)

Publication Number Publication Date
GB2124835A GB2124835A (en) 1984-02-22
GB2124835B true GB2124835B (en) 1986-04-30

Family

ID=10532072

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08222359A Expired GB2124835B (en) 1982-08-03 1982-08-03 Current printed circuit boards

Country Status (6)

Country Link
US (1) US4654102A (OSRAM)
EP (2) EP0206063B1 (OSRAM)
JP (1) JPS5963792A (OSRAM)
DE (1) DE3376187D1 (OSRAM)
GB (1) GB2124835B (OSRAM)
WO (1) WO1984000664A1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1322271C (en) * 1987-02-25 1993-09-21 Sho Masujima Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
DE8711697U1 (de) * 1987-08-28 1987-11-12 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Ändern und/oder Reparieren von Flachbaugruppen bei Bestückung mit SMD-Bausteinen
WO1989006087A1 (en) * 1987-12-18 1989-06-29 Flowlyne (Uk) Limited Improvements in or relating to the repair of electrical circuits
US5214250A (en) * 1991-09-19 1993-05-25 International Business Machines Corporation Method of reworking circuit panels, and circuit panels reworked thereby
JP2856240B2 (ja) * 1992-10-30 1999-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント回路基板を再加工する方法
CN1047408C (zh) * 1995-09-11 1999-12-15 中国科学院金属研究所 一种激光化学气相沉积金刚石膜的方法
US5794703A (en) * 1996-07-03 1998-08-18 Ctes, L.C. Wellbore tractor and method of moving an item through a wellbore
US6181551B1 (en) 1998-04-15 2001-01-30 Dell Usa, L.P. Pin soldering enhancement and method
US6907701B2 (en) * 2001-06-07 2005-06-21 Gary Edward Smith Steel roofing panel support
US9409031B2 (en) 2010-03-31 2016-08-09 Medtronic, Inc. Medical devices including flexible circuit bodies with exposed portions of circuit traces attached to electrical contacts of components
JP2015023187A (ja) * 2013-07-19 2015-02-02 イビデン株式会社 配線板および配線板の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB585186A (en) * 1944-10-06 1947-01-31 George Crawford Tyce Improvements in and relating to the formation, reinforcement, or sealing of joints, for fibrous materials
DE1108754B (de) * 1958-09-10 1961-06-15 Siemens Ag Verfahren und Vorrichtung zur Herstellung von Schaltungsplatten in Fernmelde-, insbesondere Fernsprech-anlagen
NL261568A (OSRAM) * 1960-02-24
US3234629A (en) * 1962-06-14 1966-02-15 Defiance Printed Circuit Corp Method for producing printed circuits
FR1400933A (fr) * 1964-07-11 1965-05-28 Kupfer Asbest Co Matériel conducteur pour circuits électriques et procédé pour la fabrication de plaques conductrices
GB1104274A (en) * 1965-10-12 1968-02-21 Plastic Coatings Ltd Improvements in or relating to fusible adhesive compositions
US3536565A (en) * 1967-09-14 1970-10-27 Burroughs Corp Method of making an electrical terminal board assembly
US3462540A (en) * 1967-12-21 1969-08-19 Bell Telephone Labor Inc Method and apparatus for mounting,connecting and repairing stacked circuit boards
US3655818A (en) * 1968-10-18 1972-04-11 Minnesota Mining & Mfg Particulate adhesive containing polyepoxides carboxylated butadiene-acrylonitrile copolymer and a urea derivative as a curing agent
US3680209A (en) * 1969-05-07 1972-08-01 Siemens Ag Method of forming stacked circuit boards
US3827918A (en) * 1972-05-25 1974-08-06 Ibm Electrical conductors with chromate solder barrier and method of forming
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US3786172A (en) * 1972-12-07 1974-01-15 Accra Point Arrays Corp Printed circuit board method and apparatus
US3850711A (en) * 1972-12-07 1974-11-26 Accra Paint Arrays Corp Method of forming printed circuit
DE2347217A1 (de) * 1973-09-19 1975-03-27 Siemens Ag Verfahren zum durchkontaktieren eines beidseitig metallkaschierten basismaterials fuer gedruckte schaltungen
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
GB1535820A (en) * 1977-07-14 1978-12-13 British Aircraft Corp Ltd Electrically conductive connections
US4104109A (en) * 1977-08-29 1978-08-01 Bell Telephone Laboratories, Incorporated Apparatus for bonding electrical contacts to printed wiring circuit boards
DE2925286A1 (de) * 1979-06-22 1981-01-08 Siemens Ag Verfahren und schaltungsanordnung zum aendern von leiterplatten
DE3040460C2 (de) * 1980-10-27 1982-12-16 Siemens AG, 1000 Berlin und 8000 München Elektronische Schaltung und Verfahren zu ihrer Herstellung
JPS57103386A (en) * 1980-12-18 1982-06-26 Tokyo Shibaura Electric Co Method of modifying printed board
US4445952A (en) * 1981-11-03 1984-05-01 Trw Inc. Apparatus and method for filling holes in a circuit board

Also Published As

Publication number Publication date
EP0114857A1 (en) 1984-08-08
GB2124835A (en) 1984-02-22
US4654102A (en) 1987-03-31
EP0206063A2 (en) 1986-12-30
DE3376187D1 (en) 1988-05-05
JPS5963792A (ja) 1984-04-11
EP0206063B1 (en) 1989-07-19
EP0206063A3 (en) 1987-03-04
EP0114857B1 (en) 1988-03-30
JPH0479159B2 (OSRAM) 1992-12-15
WO1984000664A1 (en) 1984-02-16

Similar Documents

Publication Publication Date Title
DE3276624D1 (en) Wavesoldering of chips
JPS647697A (en) Manufacture of hybrid multi-layer circuit board
JPS6413735A (en) Method of mounting semiconductor device and mounted semiconductor device
KR890004824B1 (en) Printed circuit board
CA2011000A1 (en) Solder assembly of components
US3717742A (en) Method and apparatus for forming printed circuit boards with infrared radiation
ATE320T1 (de) Verfahren und schablone zum befestigen von bauelementen mit flaechigen anschlusskontakten auf leiterplatten.
JPS5963792A (ja) 印刷回路板上の電気的な接続を変更するための方法および変更するために使用するための装置
JPS6442193A (en) Wiring board
JPS5586679A (en) Method and apparatus for continuous soldering
JPS566459A (en) Removing method of component carried on printed board
EP0396522A3 (en) Universal electrical interconnection system and method
JPS6450596A (en) Method of soldering for surface mounting component
JPH01257340A (ja) ボンディング用ヒーターチップ
DE59510040D1 (de) Verfahren zum wellenlöten von leiterplatten
GB2005084A (en) Improvements in or relating to assemblies including printed circuit boards and methods of making such assemblies
JPS5640267A (en) Pretinning method for flat lead
JPS57165169A (en) Soldering method for electrical parts
CN106028677B (zh) 贴片方法及其装置
ATE94684T1 (de) Kontakt zum hartloeten auf einem traeger mittels widerstandspressschweissung mittels eines kurzzeit-energieimpulses.
JPS6412595A (en) Mounting structure of printed board
JPS6411069A (en) Soldering device for packaging components
ATE212780T1 (de) Flachbaugruppe und verfahren zum nachträglichen aufbringen von zusatzbauelementen auf eine leiterplatte
JPS6476793A (en) Wire bonding apparatus
JPS6447093A (en) Soldering method

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950803