ATE320T1 - Verfahren und schablone zum befestigen von bauelementen mit flaechigen anschlusskontakten auf leiterplatten. - Google Patents

Verfahren und schablone zum befestigen von bauelementen mit flaechigen anschlusskontakten auf leiterplatten.

Info

Publication number
ATE320T1
ATE320T1 AT79104855T AT79104855T ATE320T1 AT E320 T1 ATE320 T1 AT E320T1 AT 79104855 T AT79104855 T AT 79104855T AT 79104855 T AT79104855 T AT 79104855T AT E320 T1 ATE320 T1 AT E320T1
Authority
AT
Austria
Prior art keywords
components
printed circuit
circuit board
template
circuit boards
Prior art date
Application number
AT79104855T
Other languages
English (en)
Inventor
Hans Motsch
Original Assignee
Wuerttembergische Metallwarenfabrik Ag.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6056465&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE320(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Wuerttembergische Metallwarenfabrik Ag. filed Critical Wuerttembergische Metallwarenfabrik Ag.
Application granted granted Critical
Publication of ATE320T1 publication Critical patent/ATE320T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/28—Beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT79104855T 1978-12-06 1979-12-03 Verfahren und schablone zum befestigen von bauelementen mit flaechigen anschlusskontakten auf leiterplatten. ATE320T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2852753A DE2852753C3 (de) 1978-12-06 1978-12-06 Verfahren zum Befestigen von Bauelementen mit flächigen Anschlußkontakten auf einer Leiterplatte und Schablone zur Durchführung des Verfahrens
EP79104855A EP0012319B2 (de) 1978-12-06 1979-12-03 Verfahren und Schablone zum Befestigen von Bauelementen mit flächigen Anschlusskontakten auf Leiterplatten

Publications (1)

Publication Number Publication Date
ATE320T1 true ATE320T1 (de) 1981-11-15

Family

ID=6056465

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79104855T ATE320T1 (de) 1978-12-06 1979-12-03 Verfahren und schablone zum befestigen von bauelementen mit flaechigen anschlusskontakten auf leiterplatten.

Country Status (4)

Country Link
US (1) US4373259A (de)
EP (1) EP0012319B2 (de)
AT (1) ATE320T1 (de)
DE (1) DE2852753C3 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205179U (de) * 1981-06-24 1982-12-27
DE3231056A1 (de) * 1982-08-20 1984-02-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zum aufbringen von unbedrahteten bauelementen auf leiterplatten
JPS5998591A (ja) * 1982-11-27 1984-06-06 松下電器産業株式会社 両面回路接続方法
DE3321694A1 (de) * 1983-06-15 1984-12-20 Walter Dipl.-Ing. 2000 Hamburg Kundler Leiterplatte zum aufloeten von integrierten miniaturschaltungen
GB8403968D0 (en) * 1984-02-15 1984-03-21 Heraeus Gmbh W C Chip resistors
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3440668A1 (de) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
DE3570158D1 (en) * 1985-11-13 1989-06-15 Weidmueller C A Gmbh Co Terminals for side-by-side mounting
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
DE3730497A1 (de) * 1987-09-11 1989-03-30 Philips Patentverwaltung Oberflaechenmontierbares bauelement
GB2210818A (en) * 1987-10-10 1989-06-21 Plessey Co Plc A process for soldering a component to a printed circuit board
US4877176A (en) * 1987-11-25 1989-10-31 Northern Telecom Limited Soldering pins into printed circuit boards
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
DE3843984A1 (de) * 1988-12-27 1990-07-05 Asea Brown Boveri Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
US4982376A (en) * 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
US5059105A (en) * 1989-10-23 1991-10-22 Motorola, Inc. Resilient mold assembly
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5270903A (en) * 1990-09-10 1993-12-14 Codex Corporation Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
DE4234418A1 (de) * 1992-10-13 1994-04-14 Thomson Brandt Gmbh Justiervorrichtung
DE4319876A1 (de) * 1993-02-26 1994-09-01 Siemens Ag Verfahren zum Befestigen einer Hybrid-Schaltung auf einer Leiterplatte
US5773195A (en) * 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
US6112406A (en) * 1996-05-06 2000-09-05 Siemens Aktiengesellschaft Method for producing electrically conductive connections between two or more conductor structures
US7473218B2 (en) * 2002-08-06 2009-01-06 Olympus Corporation Assembling method of capsule medical apparatus
JP2007180447A (ja) * 2005-12-28 2007-07-12 Toyota Industries Corp 半田付け方法、半田付け装置、及び半導体装置の製造方法
CN112171061B (zh) * 2020-09-29 2022-06-07 大连优迅科技股份有限公司 用于qsp28模块柔性软板的焊接组装夹具

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302067A (en) * 1967-01-31 Modular circuit package utilizing solder coated
DE1065898B (de) * 1959-09-24
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
DE1089437B (de) * 1957-05-27 1960-09-22 Gen Electric Verfahren zur Bestueckung von Traegern mit flaechenhafter Leitungsfuehrung
DE1194681B (de) * 1962-05-10 1965-06-10 Philips Patentverwaltung Vorrichtung zum Verloeten von ebenen Leiterzugplatten mit den Anschlussdraehten von auf die Platten aufgesetzten Bauteilen
DE1616732B1 (de) 1962-05-11 1970-08-20 Ibm In Mikromodultechnik ausgefuehrte elektrische Schaltung
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3393449A (en) * 1963-11-01 1968-07-23 Itt Method of assembly of resistor matrix
US3355078A (en) * 1964-11-23 1967-11-28 Bunker Ramo Apparatus for assembling electrical components
FR1484521A (fr) * 1965-06-24 1967-06-09 Texas Instruments Inc Dispositif de montage de composants dans un circuit électronique
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3540718A (en) * 1966-08-22 1970-11-17 Robert E Heffron Printed circuit board component clamp and assembly jig
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US3445919A (en) * 1968-07-11 1969-05-27 Electronic Eng Co California Method of using a solder contact fluid
US3690943A (en) * 1970-04-24 1972-09-12 Rca Corp Method of alloying two metals
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3762040A (en) * 1971-10-06 1973-10-02 Western Electric Co Method of forming circuit crossovers
US3982979A (en) * 1973-06-28 1976-09-28 Western Electric Company, Inc. Methods for mounting an article on an adherent site on a substrate
DE2633269C2 (de) * 1976-07-23 1978-04-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Anlöten von Bauelementen an metallisierte Bereiche eines Schichtschaltungssubstrates
DE2640613C2 (de) * 1976-09-09 1985-03-07 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum Kontaktieren von Schaltungsbausteinen in eine Schichtschaltung
DE2657313B2 (de) 1976-12-17 1978-10-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden elektrischer Bauelemente mit den Leiterbahnen einer Leiter- oder Trägerplatte

Also Published As

Publication number Publication date
EP0012319B1 (de) 1981-10-21
DE2852753B2 (de) 1980-11-06
EP0012319A1 (de) 1980-06-25
US4373259A (en) 1983-02-15
EP0012319B2 (de) 1986-01-02
DE2852753A1 (de) 1980-06-12
DE2852753C3 (de) 1985-06-20

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee