GB2062963B - Semiconductor chip mountings - Google Patents

Semiconductor chip mountings

Info

Publication number
GB2062963B
GB2062963B GB8035586A GB8035586A GB2062963B GB 2062963 B GB2062963 B GB 2062963B GB 8035586 A GB8035586 A GB 8035586A GB 8035586 A GB8035586 A GB 8035586A GB 2062963 B GB2062963 B GB 2062963B
Authority
GB
United Kingdom
Prior art keywords
semiconductor chip
chip mountings
mountings
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8035586A
Other languages
English (en)
Other versions
GB2062963A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2062963A publication Critical patent/GB2062963A/en
Application granted granted Critical
Publication of GB2062963B publication Critical patent/GB2062963B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H05K3/346—
    • H05K3/3465—
    • H10W72/01257—
    • H10W72/072—
    • H10W72/07227—
    • H10W72/07236—
    • H10W72/07252—
    • H10W72/07253—
    • H10W72/20—
    • H10W72/227—
    • H10W72/237—
    • H10W72/241—
    • H10W72/251—
    • H10W72/263—
    • H10W72/267—
    • H10W72/285—
    • H10W72/29—
    • H10W72/926—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
GB8035586A 1979-11-12 1980-11-05 Semiconductor chip mountings Expired GB2062963B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979155903U JPS5678356U (cg-RX-API-DMAC10.html) 1979-11-12 1979-11-12

Publications (2)

Publication Number Publication Date
GB2062963A GB2062963A (en) 1981-05-28
GB2062963B true GB2062963B (en) 1984-05-23

Family

ID=15616027

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8035586A Expired GB2062963B (en) 1979-11-12 1980-11-05 Semiconductor chip mountings

Country Status (3)

Country Link
JP (1) JPS5678356U (cg-RX-API-DMAC10.html)
DE (1) DE3042085C2 (cg-RX-API-DMAC10.html)
GB (1) GB2062963B (cg-RX-API-DMAC10.html)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
JPS5873127A (ja) * 1981-10-28 1983-05-02 Hitachi Ltd Ｉｃチツプのはんだ溶融接続方法
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
GB2156153B (en) * 1984-03-21 1988-02-24 Pitney Bowes Inc Alignment process for semiconductor chips
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
US4763829A (en) * 1986-06-04 1988-08-16 American Telephone And Telegraph Company, At&T Bell Laboratories Soldering of electronic components
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
DE4003070A1 (de) * 1990-02-02 1991-08-08 Telefunken Electronic Gmbh Verfahren zum aufloeten eines halbleiterkoerpers auf einen traegerkoerper
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
WO1996031905A1 (en) 1995-04-05 1996-10-10 Mcnc A solder bump structure for a microelectronic substrate
EP0899787A3 (en) * 1997-07-25 2001-05-16 Mcnc Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
DE19738399A1 (de) * 1997-09-03 1999-03-04 Bosch Gmbh Robert Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat
DE19750073A1 (de) * 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
EP1168429A1 (en) * 2000-06-28 2002-01-02 Telefonaktiebolaget L M Ericsson (Publ) Integrated circuit chip and method for mounting an integrated circuit chip to a circuit board
WO2007031298A1 (de) 2005-09-14 2007-03-22 Htc Beteiligungs Gmbh Flip-chip-modul und verfahren zum erzeugen eines flip-chip-moduls
DE102005043910A1 (de) * 2005-09-14 2007-03-15 Weissbach, Ernst-A. Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
FR2918212B1 (fr) 2007-06-27 2009-09-25 Fr De Detecteurs Infrarouges S Procede pour la realisation d'une matrice de rayonnements electromagnetiques et procede pour remplacer un module elementaire d'une telle matrice de detection.
DE102012105297A1 (de) 2012-06-19 2013-12-19 Endress + Hauser Gmbh + Co. Kg Verfahren zum Verbinden eines Bauteils mit einem Träger über eine Lötung und Bauteil zum Verbinden mit einem Träger
JP6702019B2 (ja) * 2016-06-22 2020-05-27 株式会社ジェイテクト 半導体装置
US12324361B2 (en) 2022-05-09 2025-06-03 International Business Machines Corporation Electrical connections between dissimilar materials at cryogenic temperatures
US12150390B2 (en) * 2022-05-09 2024-11-19 International Business Machines Corporation Downstop and bump bonds formation on substrates
WO2023218301A1 (en) * 2022-05-09 2023-11-16 International Business Machines Corporation Electronic structure and method of manufacturing an electronic structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7839000B2 (en) 2002-06-25 2010-11-23 Unitive International Limited Solder structures including barrier layers with nickel and/or copper
US8294269B2 (en) 2002-06-25 2012-10-23 Unitive International Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers

Also Published As

Publication number Publication date
JPS5678356U (cg-RX-API-DMAC10.html) 1981-06-25
GB2062963A (en) 1981-05-28
DE3042085A1 (de) 1981-06-04
DE3042085C2 (de) 1984-09-13

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 20001104