JPS5678356U - - Google Patents

Info

Publication number
JPS5678356U
JPS5678356U JP1979155903U JP15590379U JPS5678356U JP S5678356 U JPS5678356 U JP S5678356U JP 1979155903 U JP1979155903 U JP 1979155903U JP 15590379 U JP15590379 U JP 15590379U JP S5678356 U JPS5678356 U JP S5678356U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979155903U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979155903U priority Critical patent/JPS5678356U/ja
Priority to GB8035586A priority patent/GB2062963B/en
Priority to DE3042085A priority patent/DE3042085C2/de
Publication of JPS5678356U publication Critical patent/JPS5678356U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H05K3/346—
    • H05K3/3465—
    • H10W72/01257—
    • H10W72/072—
    • H10W72/07227—
    • H10W72/07236—
    • H10W72/07252—
    • H10W72/07253—
    • H10W72/20—
    • H10W72/227—
    • H10W72/237—
    • H10W72/241—
    • H10W72/251—
    • H10W72/263—
    • H10W72/267—
    • H10W72/285—
    • H10W72/29—
    • H10W72/926—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
JP1979155903U 1979-11-12 1979-11-12 Pending JPS5678356U (cg-RX-API-DMAC10.html)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1979155903U JPS5678356U (cg-RX-API-DMAC10.html) 1979-11-12 1979-11-12
GB8035586A GB2062963B (en) 1979-11-12 1980-11-05 Semiconductor chip mountings
DE3042085A DE3042085C2 (de) 1979-11-12 1980-11-07 Halbleiteranordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979155903U JPS5678356U (cg-RX-API-DMAC10.html) 1979-11-12 1979-11-12

Publications (1)

Publication Number Publication Date
JPS5678356U true JPS5678356U (cg-RX-API-DMAC10.html) 1981-06-25

Family

ID=15616027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979155903U Pending JPS5678356U (cg-RX-API-DMAC10.html) 1979-11-12 1979-11-12

Country Status (3)

Country Link
JP (1) JPS5678356U (cg-RX-API-DMAC10.html)
DE (1) DE3042085C2 (cg-RX-API-DMAC10.html)
GB (1) GB2062963B (cg-RX-API-DMAC10.html)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
JPS5873127A (ja) * 1981-10-28 1983-05-02 Hitachi Ltd Ｉｃチツプのはんだ溶融接続方法
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
GB2156153B (en) * 1984-03-21 1988-02-24 Pitney Bowes Inc Alignment process for semiconductor chips
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
US4763829A (en) * 1986-06-04 1988-08-16 American Telephone And Telegraph Company, At&T Bell Laboratories Soldering of electronic components
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices
AU645283B2 (en) * 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
DE4003070A1 (de) * 1990-02-02 1991-08-08 Telefunken Electronic Gmbh Verfahren zum aufloeten eines halbleiterkoerpers auf einen traegerkoerper
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
EP0899787A3 (en) * 1997-07-25 2001-05-16 Mcnc Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
DE19738399A1 (de) * 1997-09-03 1999-03-04 Bosch Gmbh Robert Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat
DE19750073A1 (de) * 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
EP1168429A1 (en) * 2000-06-28 2002-01-02 Telefonaktiebolaget L M Ericsson (Publ) Integrated circuit chip and method for mounting an integrated circuit chip to a circuit board
AU2002228926A1 (en) 2000-11-10 2002-05-21 Unitive Electronics, Inc. Methods of positioning components using liquid prime movers and related structures
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
WO2004001837A2 (en) 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
TWI225899B (en) 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
WO2005101499A2 (en) 2004-04-13 2005-10-27 Unitive International Limited Methods of forming solder bumps on exposed metal pads and related structures
KR101247138B1 (ko) 2005-09-14 2013-03-29 하테체 베타일리궁스 게엠베하 플립-칩 모듈 및 플립-칩 모듈의 제조 방법
DE102005043910A1 (de) * 2005-09-14 2007-03-15 Weissbach, Ernst-A. Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
FR2918212B1 (fr) 2007-06-27 2009-09-25 Fr De Detecteurs Infrarouges S Procede pour la realisation d'une matrice de rayonnements electromagnetiques et procede pour remplacer un module elementaire d'une telle matrice de detection.
DE102012105297A1 (de) * 2012-06-19 2013-12-19 Endress + Hauser Gmbh + Co. Kg Verfahren zum Verbinden eines Bauteils mit einem Träger über eine Lötung und Bauteil zum Verbinden mit einem Träger
JP6702019B2 (ja) * 2016-06-22 2020-05-27 株式会社ジェイテクト 半導体装置
WO2023218301A1 (en) * 2022-05-09 2023-11-16 International Business Machines Corporation Electronic structure and method of manufacturing an electronic structure
US12324361B2 (en) 2022-05-09 2025-06-03 International Business Machines Corporation Electrical connections between dissimilar materials at cryogenic temperatures
US12150390B2 (en) * 2022-05-09 2024-11-19 International Business Machines Corporation Downstop and bump bonds formation on substrates

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate

Also Published As

Publication number Publication date
DE3042085A1 (de) 1981-06-04
DE3042085C2 (de) 1984-09-13
GB2062963B (en) 1984-05-23
GB2062963A (en) 1981-05-28

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