GB1559969A - Semiconductor component housing assemblies - Google Patents

Semiconductor component housing assemblies Download PDF

Info

Publication number
GB1559969A
GB1559969A GB19726/78A GB1972678A GB1559969A GB 1559969 A GB1559969 A GB 1559969A GB 19726/78 A GB19726/78 A GB 19726/78A GB 1972678 A GB1972678 A GB 1972678A GB 1559969 A GB1559969 A GB 1559969A
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
electrode
enclosure
base member
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19726/78A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1559969A publication Critical patent/GB1559969A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Thyristors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB19726/78A 1977-06-23 1978-05-16 Semiconductor component housing assemblies Expired GB1559969A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772728313 DE2728313A1 (de) 1977-06-23 1977-06-23 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1559969A true GB1559969A (en) 1980-01-30

Family

ID=6012187

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19726/78A Expired GB1559969A (en) 1977-06-23 1978-05-16 Semiconductor component housing assemblies

Country Status (5)

Country Link
US (1) US4218695A (enExample)
JP (1) JPS5410672A (enExample)
DE (1) DE2728313A1 (enExample)
FR (1) FR2395603A1 (enExample)
GB (1) GB1559969A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390891A (en) 1979-10-19 1983-06-28 Siemens Aktiengesellschaft Semiconductor component with a plurality of semiconductor elements

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
DE3142576A1 (de) * 1981-10-27 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit durch druck kontaktierbaren halbleiterkoerpern
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
JPS58153340A (ja) * 1982-03-05 1983-09-12 Hitachi Ltd 半導体装置
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3232184A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiterelement
US4518983A (en) * 1982-10-22 1985-05-21 Westinghouse Electric Corp. Assembly-heat sink for semiconductor devices
DE3241509A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
JPS6074462A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
JPS6074461A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
EP0138048B1 (en) * 1983-09-29 1993-12-15 Kabushiki Kaisha Toshiba Press-packed semiconductor device
EP0168456B1 (fr) * 1984-01-23 1988-06-08 Telemecanique Dispositif de montage et de connexion pour semi-conducteurs de puissance
JPS60176698A (ja) * 1984-02-22 1985-09-10 山本　敏樹 ミシンにおける脇割り仕上方法および装置
EP0178387B1 (de) * 1984-10-19 1992-10-07 BBC Brown Boveri AG Abschaltbares Leistungshalbleiterbauelement
DE3508456C2 (de) * 1985-03-09 1987-01-08 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls
CH668667A5 (de) * 1985-11-15 1989-01-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul.
US4853762A (en) * 1986-03-27 1989-08-01 International Rectifier Corporation Semi-conductor modules
DE3628556C1 (en) * 1986-08-22 1988-04-14 Semikron Elektronik Gmbh Semiconductor device
DE58905844D1 (de) * 1989-02-02 1993-11-11 Asea Brown Boveri Druckkontaktiertes Halbleiterbauelement.
EP0473260B1 (en) * 1990-08-28 1995-12-27 International Business Machines Corporation Fabrication of semiconductor packages
JP3120575B2 (ja) * 1992-06-29 2000-12-25 富士電機株式会社 半導体装置
US5378928A (en) * 1993-04-27 1995-01-03 Motorola, Inc. Plastic encapsulated microelectronic device and method
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
DE102007003587B4 (de) 2007-01-24 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Druckkörper
US8120171B2 (en) * 2007-12-26 2012-02-21 Keihin Corporation Power drive unit including a heat sink and a fastener
DE102011004541B4 (de) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
JP2013243264A (ja) * 2012-05-21 2013-12-05 Yaskawa Electric Corp 電子部品取付モジュールおよび電力変換装置
CN108701667B (zh) * 2016-06-20 2020-08-28 株洲中车时代电气股份有限公司 半导体设备子组件
DE102024127418A1 (de) * 2024-09-23 2026-03-26 Infineon Technologies Bipolar Gmbh & Co. Kg Halbleitermodul

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US3142000A (en) * 1961-02-15 1964-07-21 Radio Receptor Company Inc Matrix for holding and making electrical connection with a plurality of electrical units
NL295752A (enExample) * 1962-06-09
GB1255749A (en) * 1969-04-30 1971-12-01 Westinghouse Brake & Signal Semiconductor devices
GB1328351A (en) * 1969-12-31 1973-08-30 Lucas Industries Ltd Full wave rectifier assemblies
DE2104726A1 (de) * 1970-02-02 1972-08-10 Gen Electric Halbleiterbauelement
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US3763052A (en) * 1971-08-12 1973-10-02 American Optical Corp Low threshold yttrium silicate laser glass with high damage threshold
DE2246423C3 (de) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor mit scheibenförmigem Gehäuse
DE2336152C3 (de) * 1973-07-16 1979-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390891A (en) 1979-10-19 1983-06-28 Siemens Aktiengesellschaft Semiconductor component with a plurality of semiconductor elements

Also Published As

Publication number Publication date
US4218695A (en) 1980-08-19
FR2395603B1 (enExample) 1982-11-19
JPS5410672A (en) 1979-01-26
FR2395603A1 (fr) 1979-01-19
DE2728313A1 (de) 1979-01-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee