JPH0345902B2 - - Google Patents

Info

Publication number
JPH0345902B2
JPH0345902B2 JP59264342A JP26434284A JPH0345902B2 JP H0345902 B2 JPH0345902 B2 JP H0345902B2 JP 59264342 A JP59264342 A JP 59264342A JP 26434284 A JP26434284 A JP 26434284A JP H0345902 B2 JPH0345902 B2 JP H0345902B2
Authority
JP
Japan
Prior art keywords
frame
semiconductor device
power semiconductor
connection
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59264342A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60153155A (ja
Inventor
Uyurutsu Eruiin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS60153155A publication Critical patent/JPS60153155A/ja
Publication of JPH0345902B2 publication Critical patent/JPH0345902B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Noodles (AREA)
  • Electronic Switches (AREA)
JP59264342A 1983-12-14 1984-12-14 電力用半導体装置 Granted JPS60153155A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3345285.7 1983-12-14
DE19833345285 DE3345285A1 (de) 1983-12-14 1983-12-14 Leistungs-halbleiteranordnung

Publications (2)

Publication Number Publication Date
JPS60153155A JPS60153155A (ja) 1985-08-12
JPH0345902B2 true JPH0345902B2 (enExample) 1991-07-12

Family

ID=6216947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59264342A Granted JPS60153155A (ja) 1983-12-14 1984-12-14 電力用半導体装置

Country Status (3)

Country Link
EP (1) EP0150347B1 (enExample)
JP (1) JPS60153155A (enExample)
DE (2) DE3345285A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142856U (enExample) * 1986-02-28 1987-09-09
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
GB2249869B (en) * 1990-09-17 1994-10-12 Fuji Electric Co Ltd Semiconductor device
DE10024377B4 (de) * 2000-05-17 2006-08-17 Infineon Technologies Ag Gehäuseeinrichtung und darin zu verwendendes Kontaktelement
DE102005039946A1 (de) * 2005-08-24 2007-03-01 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder
CN101248527B (zh) 2005-08-26 2012-06-20 西门子公司 带有安装在电路载体上的负载连接元件的功率半导体模块
JP4894784B2 (ja) * 2008-02-27 2012-03-14 三菱電機株式会社 半導体装置とその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2639979C3 (de) * 1976-09-04 1980-05-14 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiterbaueinheit
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
JPS5715453A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Transistor module
EP0064856B1 (en) * 1981-05-12 1986-12-30 LUCAS INDUSTRIES public limited company A multi-phase bridge arrangement
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung

Also Published As

Publication number Publication date
DE3470255D1 (en) 1988-05-05
DE3345285A1 (de) 1985-06-27
JPS60153155A (ja) 1985-08-12
EP0150347A1 (de) 1985-08-07
EP0150347B1 (de) 1988-03-30

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