JPH0345902B2 - - Google Patents
Info
- Publication number
- JPH0345902B2 JPH0345902B2 JP59264342A JP26434284A JPH0345902B2 JP H0345902 B2 JPH0345902 B2 JP H0345902B2 JP 59264342 A JP59264342 A JP 59264342A JP 26434284 A JP26434284 A JP 26434284A JP H0345902 B2 JPH0345902 B2 JP H0345902B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- semiconductor device
- power semiconductor
- connection
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/00—
-
- H10W90/00—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Noodles (AREA)
- Electronic Switches (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3345285.7 | 1983-12-14 | ||
| DE19833345285 DE3345285A1 (de) | 1983-12-14 | 1983-12-14 | Leistungs-halbleiteranordnung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60153155A JPS60153155A (ja) | 1985-08-12 |
| JPH0345902B2 true JPH0345902B2 (enExample) | 1991-07-12 |
Family
ID=6216947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59264342A Granted JPS60153155A (ja) | 1983-12-14 | 1984-12-14 | 電力用半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0150347B1 (enExample) |
| JP (1) | JPS60153155A (enExample) |
| DE (2) | DE3345285A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142856U (enExample) * | 1986-02-28 | 1987-09-09 | ||
| DE3717489A1 (de) * | 1987-05-23 | 1988-12-01 | Asea Brown Boveri | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
| DE3837920A1 (de) * | 1988-11-09 | 1990-05-10 | Semikron Elektronik Gmbh | Halbleiterelement |
| GB2249869B (en) * | 1990-09-17 | 1994-10-12 | Fuji Electric Co Ltd | Semiconductor device |
| DE10024377B4 (de) * | 2000-05-17 | 2006-08-17 | Infineon Technologies Ag | Gehäuseeinrichtung und darin zu verwendendes Kontaktelement |
| DE102005039946A1 (de) * | 2005-08-24 | 2007-03-01 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder |
| WO2007025489A1 (de) * | 2005-08-26 | 2007-03-08 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit auf schaltungsträger aufgebrachten lastanschlusselementen |
| JP4894784B2 (ja) | 2008-02-27 | 2012-03-14 | 三菱電機株式会社 | 半導体装置とその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2639979C3 (de) * | 1976-09-04 | 1980-05-14 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Halbleiterbaueinheit |
| DE2617335A1 (de) * | 1976-04-21 | 1977-11-03 | Siemens Ag | Halbleiterbauelement |
| DE2942409A1 (de) * | 1979-10-19 | 1981-04-23 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit mehreren halbleiterkoerpern |
| JPS5715453A (en) * | 1980-06-30 | 1982-01-26 | Mitsubishi Electric Corp | Transistor module |
| DE3274926D1 (en) * | 1981-05-12 | 1987-02-05 | Lucas Ind Plc | A multi-phase bridge arrangement |
| JPS5823469A (ja) * | 1981-08-03 | 1983-02-12 | Mitsubishi Electric Corp | 複合パワ−トランジスタ |
| DE3143339C2 (de) * | 1981-10-31 | 1987-05-14 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
-
1983
- 1983-12-14 DE DE19833345285 patent/DE3345285A1/de not_active Withdrawn
-
1984
- 1984-12-06 EP EP19840114843 patent/EP0150347B1/de not_active Expired
- 1984-12-06 DE DE8484114843T patent/DE3470255D1/de not_active Expired
- 1984-12-14 JP JP59264342A patent/JPS60153155A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0150347A1 (de) | 1985-08-07 |
| DE3470255D1 (en) | 1988-05-05 |
| DE3345285A1 (de) | 1985-06-27 |
| EP0150347B1 (de) | 1988-03-30 |
| JPS60153155A (ja) | 1985-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7122890B2 (en) | Low cost power semiconductor module without substrate | |
| JP3396566B2 (ja) | 半導体装置 | |
| EP1006578B1 (en) | Semiconductor power module | |
| US6703699B2 (en) | Semiconductor device | |
| US6522544B1 (en) | Power module | |
| EP0142938B1 (en) | Semiconductor integrated circuit including a lead frame chip support | |
| US6421244B1 (en) | Power module | |
| ITMI941840A1 (it) | Modulo di dispositivi a semiconduttori di alta potenza con bassa resistenza termica e metodo di fabbricazione semplificato | |
| US6101114A (en) | Power conversion system having multi-chip packages | |
| JP4177571B2 (ja) | 半導体装置 | |
| JP7228587B2 (ja) | 半導体モジュール | |
| JP4691819B2 (ja) | インバータ装置 | |
| JP7691208B2 (ja) | パワーモジュール及びその製造方法、コンバータ、並びに電子機器 | |
| JPH0644600B2 (ja) | 半導体組立ユニット | |
| JP7158392B2 (ja) | パワー半導体モジュール | |
| US5063434A (en) | Plastic molded type power semiconductor device | |
| KR100820513B1 (ko) | 회로 장치 | |
| JPH0345902B2 (enExample) | ||
| JPH05304248A (ja) | 半導体装置 | |
| KR100635681B1 (ko) | 매트릭스 컨버터 | |
| US20240244750A1 (en) | Semiconductor module | |
| JPH06302734A (ja) | 電力用半導体モジュール | |
| JPH10125898A (ja) | 無接点式半導体接触器 | |
| GB2081016A (en) | Assemblies of Semiconductor Devices | |
| CN220963151U (zh) | 接触器 |