JPS5715453A - Transistor module - Google Patents

Transistor module

Info

Publication number
JPS5715453A
JPS5715453A JP9010880A JP9010880A JPS5715453A JP S5715453 A JPS5715453 A JP S5715453A JP 9010880 A JP9010880 A JP 9010880A JP 9010880 A JP9010880 A JP 9010880A JP S5715453 A JPS5715453 A JP S5715453A
Authority
JP
Japan
Prior art keywords
terminals
composites
module
power transistor
parallel connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9010880A
Other languages
Japanese (ja)
Inventor
Yoshio Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9010880A priority Critical patent/JPS5715453A/en
Publication of JPS5715453A publication Critical patent/JPS5715453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)

Abstract

PURPOSE:To miniaturize a module with easier parallel connection by housing two power transistor composites into a common container in such as specified arrangement that electrode terminals are led out to the top thereof. CONSTITUTION:For example, two composites composed of power transistor chip connected to a feedback diode and a resistance and a diode chip in a Darlington connection are housed in a package 15 having a metal base plate 13 by way of insulating plates 11a and 11b. Electrode terminals of the composites are led to a fixed position at the top of a container through a printed board 14 supported by collector lead terminals 1a and 1b. Collector terminals 1a and 1b with the tip bent and emitter terminals 9a and 9b are arranged at a specified space on the top of the this module 100 sealed with a resin 16. Base terminals 10a and 10b and emitter auxiliary terminals 18a and 18b are at the end thereof. Thus, the use of the bars 19-22 facilitates the parallel connection of a pluality of modules while enabling smaller size configuration because of easier assembly.
JP9010880A 1980-06-30 1980-06-30 Transistor module Pending JPS5715453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9010880A JPS5715453A (en) 1980-06-30 1980-06-30 Transistor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9010880A JPS5715453A (en) 1980-06-30 1980-06-30 Transistor module

Publications (1)

Publication Number Publication Date
JPS5715453A true JPS5715453A (en) 1982-01-26

Family

ID=13989318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9010880A Pending JPS5715453A (en) 1980-06-30 1980-06-30 Transistor module

Country Status (1)

Country Link
JP (1) JPS5715453A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153155A (en) * 1983-12-14 1985-08-12 シーメンス・アクチエンゲゼルシヤフト Power semiconductor device
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
US5559374A (en) * 1993-03-25 1996-09-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138017A (en) * 1977-05-06 1978-12-02 Semikron Gleichrichterbau Semiiconductor rectifier device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138017A (en) * 1977-05-06 1978-12-02 Semikron Gleichrichterbau Semiiconductor rectifier device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153155A (en) * 1983-12-14 1985-08-12 シーメンス・アクチエンゲゼルシヤフト Power semiconductor device
JPH0345902B2 (en) * 1983-12-14 1991-07-12 Siemens Ag
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
US5559374A (en) * 1993-03-25 1996-09-24 Sanyo Electric Co., Ltd. Hybrid integrated circuit

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