FR2395603A1 - Composant a semi-conducteurs - Google Patents

Composant a semi-conducteurs

Info

Publication number
FR2395603A1
FR2395603A1 FR7817756A FR7817756A FR2395603A1 FR 2395603 A1 FR2395603 A1 FR 2395603A1 FR 7817756 A FR7817756 A FR 7817756A FR 7817756 A FR7817756 A FR 7817756A FR 2395603 A1 FR2395603 A1 FR 2395603A1
Authority
FR
France
Prior art keywords
semiconductor elements
semiconductor
semiconductor component
housing
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7817756A
Other languages
English (en)
Other versions
FR2395603B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2395603A1 publication Critical patent/FR2395603A1/fr
Application granted granted Critical
Publication of FR2395603B1 publication Critical patent/FR2395603B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Abstract

L'invention concerne un composant à semi-conducteurs. Ce composant comporte un boîtier 1, 2, 3 logeant des éléments semi-conducteurs 8, 9 et comportant deux evidements 4, 5, les éléments semi-conducteurs s'appuient sur des bandes de contact 6, 14 reliées thermiquement au fond 1, et il est prévu des électrodes d'alimentation 12, 24 reliées aux autres pôles des éléments semi-conducteurs, cependant que la bande 6 et l'électrode 24 sont reliées électriquement entre elles et que les électrodes 12, 24 sont pressées contre les éléments semi-conducteurs par l'intermédiaire de ressorts 16. Application notamment aux ponts redresseurs à semi-conducteurs.
FR7817756A 1977-06-23 1978-06-14 Composant a semi-conducteurs Granted FR2395603A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772728313 DE2728313A1 (de) 1977-06-23 1977-06-23 Halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2395603A1 true FR2395603A1 (fr) 1979-01-19
FR2395603B1 FR2395603B1 (fr) 1982-11-19

Family

ID=6012187

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7817756A Granted FR2395603A1 (fr) 1977-06-23 1978-06-14 Composant a semi-conducteurs

Country Status (5)

Country Link
US (1) US4218695A (fr)
JP (1) JPS5410672A (fr)
DE (1) DE2728313A1 (fr)
FR (1) FR2395603A1 (fr)
GB (1) GB1559969A (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0027629A1 (fr) * 1979-10-19 1981-04-29 Siemens Aktiengesellschaft Composant semiconducteur ayant au moins un ou plusieurs corps semiconducteurs
EP0035135A2 (fr) * 1980-02-13 1981-09-09 SEMIKRON Elektronik GmbH Unité à semiconducteurs avec au minimum deux éléments semiconducteurs
EP0138048A2 (fr) * 1983-09-29 1985-04-24 Kabushiki Kaisha Toshiba Dispositif semi-conducteur dans un empaquetage à pression
EP0473260A1 (fr) * 1990-08-28 1992-03-04 International Business Machines Corporation Fabrication d'empaquetages pour semi-conducteurs
EP0577264A1 (fr) * 1992-06-29 1994-01-05 Fuji Electric Co. Ltd. Dispositif semi-conducteur comprenant une pluralité de puces semi-conductrices
FR2710190A1 (fr) * 1993-09-15 1995-03-24 Int Rectifier Corp Module pour dispositif à semi-conducteur à haute puissance avec une résistance thermique faible et une fabrication simplifiée.
EP1950807A1 (fr) 2007-01-24 2008-07-30 SEMIKRON Elektronik GmbH & Co. KG Module semi-conducteur de puissance doté d'un corps de pression

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313128A (en) * 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
DE3142576A1 (de) * 1981-10-27 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit durch druck kontaktierbaren halbleiterkoerpern
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
DE3143339A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
JPS58153340A (ja) * 1982-03-05 1983-09-12 Hitachi Ltd 半導体装置
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
DE3232184A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiterelement
US4518983A (en) * 1982-10-22 1985-05-21 Westinghouse Electric Corp. Assembly-heat sink for semiconductor devices
DE3241509A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
JPS6074461A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
JPS6074462A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体装置
WO1985003385A1 (fr) * 1984-01-23 1985-08-01 La Telemecanique Electrique Dispositif de montage et de connexion pour semi-conducteurs de puissance
JPS60176698A (ja) * 1984-02-22 1985-09-10 山本　敏樹 ミシンにおける脇割り仕上方法および装置
EP0178387B1 (fr) * 1984-10-19 1992-10-07 BBC Brown Boveri AG Dispositif semi-conducteur de puissance à blocage par gâchette
DE3508456A1 (de) * 1985-03-09 1986-09-11 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
CH668667A5 (de) * 1985-11-15 1989-01-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul.
US4853762A (en) * 1986-03-27 1989-08-01 International Rectifier Corporation Semi-conductor modules
DE3628556C1 (en) * 1986-08-22 1988-04-14 Semikron Elektronik Gmbh Semiconductor device
DE58905844D1 (de) * 1989-02-02 1993-11-11 Asea Brown Boveri Druckkontaktiertes Halbleiterbauelement.
US5378928A (en) * 1993-04-27 1995-01-03 Motorola, Inc. Plastic encapsulated microelectronic device and method
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US8120171B2 (en) * 2007-12-26 2012-02-21 Keihin Corporation Power drive unit including a heat sink and a fastener
DE102011004541B4 (de) * 2011-02-22 2014-07-17 Infineon Technologies Bipolar Gmbh & Co. Kg Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
JP2013243264A (ja) * 2012-05-21 2013-12-05 Yaskawa Electric Corp 電子部品取付モジュールおよび電力変換装置
US11195784B2 (en) 2016-06-20 2021-12-07 Dynex Semiconductor Limited Semiconductor device sub-assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2112559A1 (fr) * 1970-11-09 1972-06-16 Gen Electric
FR2308205A1 (fr) * 1975-04-19 1976-11-12 Semikron Gleichrichterbau Dispositif redresseur avec deux elements semiconducteurs, connexions d'entree et de sortie, et une troisieme connexion associee au conducteur de liaison des elements
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US3142000A (en) * 1961-02-15 1964-07-21 Radio Receptor Company Inc Matrix for holding and making electrical connection with a plurality of electrical units
BE633287A (fr) * 1962-06-09
GB1255749A (en) * 1969-04-30 1971-12-01 Westinghouse Brake & Signal Semiconductor devices
GB1328351A (en) * 1969-12-31 1973-08-30 Lucas Industries Ltd Full wave rectifier assemblies
DE7103749U (de) * 1970-02-02 1971-10-28 Gec Halbleiterbauelement
US3763052A (en) * 1971-08-12 1973-10-02 American Optical Corp Low threshold yttrium silicate laser glass with high damage threshold
DE2246423C3 (de) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor mit scheibenförmigem Gehäuse
DE2336152C3 (de) * 1973-07-16 1979-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2112559A1 (fr) * 1970-11-09 1972-06-16 Gen Electric
FR2308205A1 (fr) * 1975-04-19 1976-11-12 Semikron Gleichrichterbau Dispositif redresseur avec deux elements semiconducteurs, connexions d'entree et de sortie, et une troisieme connexion associee au conducteur de liaison des elements
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0027629A1 (fr) * 1979-10-19 1981-04-29 Siemens Aktiengesellschaft Composant semiconducteur ayant au moins un ou plusieurs corps semiconducteurs
EP0035135A2 (fr) * 1980-02-13 1981-09-09 SEMIKRON Elektronik GmbH Unité à semiconducteurs avec au minimum deux éléments semiconducteurs
EP0035135A3 (en) * 1980-02-13 1981-09-16 Semikron, Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor unit with a minimum of two semiconductor elements
EP0138048A2 (fr) * 1983-09-29 1985-04-24 Kabushiki Kaisha Toshiba Dispositif semi-conducteur dans un empaquetage à pression
EP0138048A3 (en) * 1983-09-29 1986-12-30 Kabushiki Kaisha Toshiba Press-packed semiconductor device
US4694322A (en) * 1983-09-29 1987-09-15 Kabushiki Kaisha Toshiba Press-packed semiconductor device
EP0473260A1 (fr) * 1990-08-28 1992-03-04 International Business Machines Corporation Fabrication d'empaquetages pour semi-conducteurs
US5446314A (en) * 1990-08-28 1995-08-29 International Business Machines Corporation Low profile metal-ceramic-metal packaging
EP0577264A1 (fr) * 1992-06-29 1994-01-05 Fuji Electric Co. Ltd. Dispositif semi-conducteur comprenant une pluralité de puces semi-conductrices
US5350946A (en) * 1992-06-29 1994-09-27 Fuji Electric Co., Ltd. Semiconductor device with correct case placement feature
FR2710190A1 (fr) * 1993-09-15 1995-03-24 Int Rectifier Corp Module pour dispositif à semi-conducteur à haute puissance avec une résistance thermique faible et une fabrication simplifiée.
EP1950807A1 (fr) 2007-01-24 2008-07-30 SEMIKRON Elektronik GmbH & Co. KG Module semi-conducteur de puissance doté d'un corps de pression

Also Published As

Publication number Publication date
JPS5410672A (en) 1979-01-26
FR2395603B1 (fr) 1982-11-19
DE2728313A1 (de) 1979-01-04
GB1559969A (en) 1980-01-30
US4218695A (en) 1980-08-19

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