GB1553559A - Hybrid circuits - Google Patents
Hybrid circuitsInfo
- Publication number
- GB1553559A GB1553559A GB16953/78A GB1695378A GB1553559A GB 1553559 A GB1553559 A GB 1553559A GB 16953/78 A GB16953/78 A GB 16953/78A GB 1695378 A GB1695378 A GB 1695378A GB 1553559 A GB1553559 A GB 1553559A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hybrid circuits
- hybrid
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7704773A NL7704773A (nl) | 1977-05-02 | 1977-05-02 | Hybrideschakeling voorzien van een halfgeleider- schakeling. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1553559A true GB1553559A (en) | 1979-09-26 |
Family
ID=19828470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB16953/78A Expired GB1553559A (en) | 1977-05-02 | 1978-04-28 | Hybrid circuits |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4180828A (https=) |
| JP (1) | JPS593855B2 (https=) |
| AU (1) | AU515259B2 (https=) |
| CA (1) | CA1110778A (https=) |
| DE (1) | DE2817480C2 (https=) |
| FR (1) | FR2390006B1 (https=) |
| GB (1) | GB1553559A (https=) |
| IT (1) | IT1094979B (https=) |
| NL (1) | NL7704773A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2167228A (en) * | 1984-10-11 | 1986-05-21 | Sinclair Res Ltd | Integrated circuit package |
| GB2218847A (en) * | 1988-05-16 | 1989-11-22 | Gen Electric Co Plc | Semiconductor devices |
| GB2274544A (en) * | 1992-12-18 | 1994-07-27 | Yamaichi Electronics Co Ltd | IC carrier |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2435883A1 (fr) * | 1978-06-29 | 1980-04-04 | Materiel Telephonique | Circuit integre hybride et son procede de fabrication |
| JPS5568659A (en) * | 1978-11-20 | 1980-05-23 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
| JPS57103430A (en) * | 1980-12-18 | 1982-06-28 | Sony Corp | Dpcm encoding device |
| ATE39787T1 (de) * | 1982-09-09 | 1989-01-15 | Siemens Ag | Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. |
| ATE39788T1 (de) * | 1982-09-09 | 1989-01-15 | Siemens Ag | Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. |
| JPS6080357A (ja) * | 1983-10-08 | 1985-05-08 | Ricoh Co Ltd | 電子回路担持装置 |
| US4607276A (en) * | 1984-03-08 | 1986-08-19 | Olin Corporation | Tape packages |
| JPS62169434A (ja) * | 1986-01-22 | 1987-07-25 | Sharp Corp | Lsi搭載方式 |
| DE3727389A1 (de) * | 1987-08-17 | 1989-03-02 | Heidenhain Gmbh Dr Johannes | Elektrische verbindung |
| DE4132947C2 (de) * | 1991-10-04 | 1998-11-26 | Export Contor Ausenhandelsgese | Elektronische Schaltungsanordnung |
| DE4418679A1 (de) * | 1994-05-28 | 1995-11-30 | Telefunken Microelectron | Vorrichtung zur Kontaktierung zweier Schaltungsteile |
| US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
| DE19529237C1 (de) * | 1995-08-09 | 1996-08-29 | Semikron Elektronik Gmbh | Schaltungsanordnung |
| US6168971B1 (en) | 1998-05-05 | 2001-01-02 | Fujitsu Limited | Method of assembling thin film jumper connectors to a substrate |
| DE10121970B4 (de) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Leistungshalbleitermodul in Druckkontaktierung |
| JP6858688B2 (ja) * | 2017-10-24 | 2021-04-14 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2021484A1 (https=) * | 1968-10-24 | 1970-07-24 | Inst Halvledarfors | |
| US3811186A (en) * | 1972-12-11 | 1974-05-21 | Ibm | Method of aligning and attaching circuit devices on a substrate |
| US3916435A (en) * | 1974-09-09 | 1975-10-28 | Gen Motors Corp | Heat sink assembly for button diode rectifiers |
| US4009485A (en) * | 1974-12-23 | 1977-02-22 | General Electric Company | Semiconductor pellet assembly mounted on ceramic substrate |
-
1977
- 1977-05-02 NL NL7704773A patent/NL7704773A/xx not_active Application Discontinuation
-
1978
- 1978-04-21 DE DE2817480A patent/DE2817480C2/de not_active Expired
- 1978-04-24 US US05/899,070 patent/US4180828A/en not_active Expired - Lifetime
- 1978-04-27 CA CA302,144A patent/CA1110778A/en not_active Expired
- 1978-04-28 JP JP53050200A patent/JPS593855B2/ja not_active Expired
- 1978-04-28 IT IT7822877A patent/IT1094979B/it active
- 1978-04-28 AU AU35569/78A patent/AU515259B2/en not_active Expired
- 1978-04-28 FR FR7812641A patent/FR2390006B1/fr not_active Expired
- 1978-04-28 GB GB16953/78A patent/GB1553559A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2167228A (en) * | 1984-10-11 | 1986-05-21 | Sinclair Res Ltd | Integrated circuit package |
| GB2218847A (en) * | 1988-05-16 | 1989-11-22 | Gen Electric Co Plc | Semiconductor devices |
| GB2218847B (en) * | 1988-05-16 | 1991-04-24 | Gen Electric Co Plc | Carrier for semiconductor devices |
| GB2274544A (en) * | 1992-12-18 | 1994-07-27 | Yamaichi Electronics Co Ltd | IC carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| IT1094979B (it) | 1985-08-10 |
| DE2817480A1 (de) | 1978-11-09 |
| FR2390006B1 (https=) | 1985-05-17 |
| JPS53136481A (en) | 1978-11-29 |
| AU515259B2 (en) | 1981-03-26 |
| US4180828A (en) | 1979-12-25 |
| CA1110778A (en) | 1981-10-13 |
| DE2817480C2 (de) | 1984-02-16 |
| AU3556978A (en) | 1979-11-01 |
| FR2390006A1 (https=) | 1978-12-01 |
| JPS593855B2 (ja) | 1984-01-26 |
| NL7704773A (nl) | 1978-11-06 |
| IT7822877A0 (it) | 1978-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |