GB1553559A - Hybrid circuits - Google Patents

Hybrid circuits

Info

Publication number
GB1553559A
GB1553559A GB16953/78A GB1695378A GB1553559A GB 1553559 A GB1553559 A GB 1553559A GB 16953/78 A GB16953/78 A GB 16953/78A GB 1695378 A GB1695378 A GB 1695378A GB 1553559 A GB1553559 A GB 1553559A
Authority
GB
United Kingdom
Prior art keywords
hybrid circuits
hybrid
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16953/78A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of GB1553559A publication Critical patent/GB1553559A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/701Tape-automated bond [TAB] connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688Flexible insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
GB16953/78A 1977-05-02 1978-04-28 Hybrid circuits Expired GB1553559A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7704773A NL7704773A (nl) 1977-05-02 1977-05-02 Hybrideschakeling voorzien van een halfgeleider- schakeling.

Publications (1)

Publication Number Publication Date
GB1553559A true GB1553559A (en) 1979-09-26

Family

ID=19828470

Family Applications (1)

Application Number Title Priority Date Filing Date
GB16953/78A Expired GB1553559A (en) 1977-05-02 1978-04-28 Hybrid circuits

Country Status (9)

Country Link
US (1) US4180828A (https=)
JP (1) JPS593855B2 (https=)
AU (1) AU515259B2 (https=)
CA (1) CA1110778A (https=)
DE (1) DE2817480C2 (https=)
FR (1) FR2390006B1 (https=)
GB (1) GB1553559A (https=)
IT (1) IT1094979B (https=)
NL (1) NL7704773A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
GB2218847A (en) * 1988-05-16 1989-11-22 Gen Electric Co Plc Semiconductor devices
GB2274544A (en) * 1992-12-18 1994-07-27 Yamaichi Electronics Co Ltd IC carrier

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS57103430A (en) * 1980-12-18 1982-06-28 Sony Corp Dpcm encoding device
ATE39787T1 (de) * 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
ATE39788T1 (de) * 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
JPS6080357A (ja) * 1983-10-08 1985-05-08 Ricoh Co Ltd 電子回路担持装置
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
JPS62169434A (ja) * 1986-01-22 1987-07-25 Sharp Corp Lsi搭載方式
DE3727389A1 (de) * 1987-08-17 1989-03-02 Heidenhain Gmbh Dr Johannes Elektrische verbindung
DE4132947C2 (de) * 1991-10-04 1998-11-26 Export Contor Ausenhandelsgese Elektronische Schaltungsanordnung
DE4418679A1 (de) * 1994-05-28 1995-11-30 Telefunken Microelectron Vorrichtung zur Kontaktierung zweier Schaltungsteile
US5512780A (en) * 1994-09-09 1996-04-30 Sun Microsystems, Inc. Inorganic chip-to-package interconnection circuit
DE19529237C1 (de) * 1995-08-09 1996-08-29 Semikron Elektronik Gmbh Schaltungsanordnung
US6168971B1 (en) 1998-05-05 2001-01-02 Fujitsu Limited Method of assembling thin film jumper connectors to a substrate
DE10121970B4 (de) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Leistungshalbleitermodul in Druckkontaktierung
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021484A1 (https=) * 1968-10-24 1970-07-24 Inst Halvledarfors
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US3916435A (en) * 1974-09-09 1975-10-28 Gen Motors Corp Heat sink assembly for button diode rectifiers
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167228A (en) * 1984-10-11 1986-05-21 Sinclair Res Ltd Integrated circuit package
GB2218847A (en) * 1988-05-16 1989-11-22 Gen Electric Co Plc Semiconductor devices
GB2218847B (en) * 1988-05-16 1991-04-24 Gen Electric Co Plc Carrier for semiconductor devices
GB2274544A (en) * 1992-12-18 1994-07-27 Yamaichi Electronics Co Ltd IC carrier

Also Published As

Publication number Publication date
IT1094979B (it) 1985-08-10
DE2817480A1 (de) 1978-11-09
FR2390006B1 (https=) 1985-05-17
JPS53136481A (en) 1978-11-29
AU515259B2 (en) 1981-03-26
US4180828A (en) 1979-12-25
CA1110778A (en) 1981-10-13
DE2817480C2 (de) 1984-02-16
AU3556978A (en) 1979-11-01
FR2390006A1 (https=) 1978-12-01
JPS593855B2 (ja) 1984-01-26
NL7704773A (nl) 1978-11-06
IT7822877A0 (it) 1978-04-28

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee