JPS549766A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS549766A
JPS549766A JP7573077A JP7573077A JPS549766A JP S549766 A JPS549766 A JP S549766A JP 7573077 A JP7573077 A JP 7573077A JP 7573077 A JP7573077 A JP 7573077A JP S549766 A JPS549766 A JP S549766A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
hybrid
circuit
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7573077A
Other languages
Japanese (ja)
Inventor
Hisao Kanai
Masamichi Murase
Takashi Nakahara
Hiroetsu Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7573077A priority Critical patent/JPS549766A/en
Publication of JPS549766A publication Critical patent/JPS549766A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7573077A 1977-06-24 1977-06-24 Hybrid integrated circuit Pending JPS549766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7573077A JPS549766A (en) 1977-06-24 1977-06-24 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7573077A JPS549766A (en) 1977-06-24 1977-06-24 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS549766A true JPS549766A (en) 1979-01-24

Family

ID=13584670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7573077A Pending JPS549766A (en) 1977-06-24 1977-06-24 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS549766A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4902039A (en) * 1986-09-11 1990-02-20 Nippon Seiko Kabushiki Kaisha Passive seat belt system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4902039A (en) * 1986-09-11 1990-02-20 Nippon Seiko Kabushiki Kaisha Passive seat belt system

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