JPS5690597A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS5690597A
JPS5690597A JP16879079A JP16879079A JPS5690597A JP S5690597 A JPS5690597 A JP S5690597A JP 16879079 A JP16879079 A JP 16879079A JP 16879079 A JP16879079 A JP 16879079A JP S5690597 A JPS5690597 A JP S5690597A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
hybrid
circuit
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16879079A
Other languages
Japanese (ja)
Inventor
Noboru Terao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16879079A priority Critical patent/JPS5690597A/en
Publication of JPS5690597A publication Critical patent/JPS5690597A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP16879079A 1979-12-24 1979-12-24 Hybrid integrated circuit Pending JPS5690597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16879079A JPS5690597A (en) 1979-12-24 1979-12-24 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16879079A JPS5690597A (en) 1979-12-24 1979-12-24 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5690597A true JPS5690597A (en) 1981-07-22

Family

ID=15874513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16879079A Pending JPS5690597A (en) 1979-12-24 1979-12-24 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5690597A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384096A (en) * 1986-09-26 1988-04-14 アイシン精機株式会社 Circuit board
JPH0194696A (en) * 1987-10-06 1989-04-13 Ibiden Co Ltd Printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384096A (en) * 1986-09-26 1988-04-14 アイシン精機株式会社 Circuit board
JPH0194696A (en) * 1987-10-06 1989-04-13 Ibiden Co Ltd Printed wiring board
JPH0582076B2 (en) * 1987-10-06 1993-11-17 Ibiden Co Ltd

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