GB1553243A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
GB1553243A
GB1553243A GB30336/76A GB3033676A GB1553243A GB 1553243 A GB1553243 A GB 1553243A GB 30336/76 A GB30336/76 A GB 30336/76A GB 3033676 A GB3033676 A GB 3033676A GB 1553243 A GB1553243 A GB 1553243A
Authority
GB
United Kingdom
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30336/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/601,839 external-priority patent/US4017340A/en
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1553243A publication Critical patent/GB1553243A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/476—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W74/01—
    • H10W74/137—
    • H10W74/147—
    • H10W74/43—
GB30336/76A 1975-08-04 1976-07-21 Semiconductor Expired GB1553243A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60183875A 1975-08-04 1975-08-04
US05/601,839 US4017340A (en) 1975-08-04 1975-08-04 Semiconductor element having a polymeric protective coating and glass coating overlay

Publications (1)

Publication Number Publication Date
GB1553243A true GB1553243A (en) 1979-09-26

Family

ID=27083963

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30336/76A Expired GB1553243A (en) 1975-08-04 1976-07-21 Semiconductor

Country Status (6)

Country Link
JP (1) JPS584816B2 (enExample)
DE (1) DE2634568C2 (enExample)
FR (1) FR2320634A1 (enExample)
GB (1) GB1553243A (enExample)
NL (1) NL185044C (enExample)
SE (1) SE429699B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001015224A1 (fr) * 1999-08-25 2001-03-01 Gemplus Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797995A1 (fr) * 1999-08-25 2001-03-02 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
WO2009010440A1 (de) 2007-07-17 2009-01-22 Siemens Aktiengesellschaft Elektronisches bauelement und vorrichtung mit hoher isolationsfestigkeit sowie verfahren zu deren herstellung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
JPS5978954A (ja) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd 光学ガラスフアイバ用被覆材料
JPH0693451B2 (ja) * 1984-03-31 1994-11-16 株式会社東芝 半導体装置及びその製造方法
EP0347518A1 (de) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivierung eines Halbleiterbauelementes
WO1997012403A1 (fr) * 1995-09-27 1997-04-03 Hitachi, Ltd. Diode
EP3113219B1 (de) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Halbleiterbauelement und verfahren zu dessen herstellung
JP6704359B2 (ja) * 2017-01-10 2020-06-03 三菱電機株式会社 電力用半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034079A (en) * 1959-05-11 1962-05-08 Microwave Ass Hermetically sealed semiconductors
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
IE35063B1 (en) * 1970-05-22 1975-10-29 Gen Electric Semiconductor device with polymeric passivant bonded preform
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
IE35247B1 (en) * 1970-06-08 1975-12-24 Gen Electric Improvements in ceramic passivated semi-conductor device and process for its manufacture
JPS4723980U (enExample) * 1971-03-19 1972-11-17
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JPS5144071B2 (enExample) * 1972-06-14 1976-11-26

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001015224A1 (fr) * 1999-08-25 2001-03-01 Gemplus Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797996A1 (fr) * 1999-08-25 2001-03-02 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797995A1 (fr) * 1999-08-25 2001-03-02 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
WO2009010440A1 (de) 2007-07-17 2009-01-22 Siemens Aktiengesellschaft Elektronisches bauelement und vorrichtung mit hoher isolationsfestigkeit sowie verfahren zu deren herstellung

Also Published As

Publication number Publication date
NL185044C (nl) 1990-01-02
DE2634568C2 (de) 1985-06-20
SE7608727L (sv) 1977-02-05
NL185044B (nl) 1989-08-01
SE429699B (sv) 1983-09-19
JPS584816B2 (ja) 1983-01-27
NL7608544A (nl) 1977-02-08
FR2320634B1 (enExample) 1983-01-07
DE2634568A1 (de) 1977-02-17
JPS5228266A (en) 1977-03-03
FR2320634A1 (fr) 1977-03-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee