GB1502965A - Provision of wire connections for semiconductor devices - Google Patents

Provision of wire connections for semiconductor devices

Info

Publication number
GB1502965A
GB1502965A GB2084075A GB2084075A GB1502965A GB 1502965 A GB1502965 A GB 1502965A GB 2084075 A GB2084075 A GB 2084075A GB 2084075 A GB2084075 A GB 2084075A GB 1502965 A GB1502965 A GB 1502965A
Authority
GB
United Kingdom
Prior art keywords
welding
wire
ball
tool
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2084075A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PHILIPS Ltd
Original Assignee
PHILIPS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PHILIPS Ltd filed Critical PHILIPS Ltd
Publication of GB1502965A publication Critical patent/GB1502965A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
GB2084075A 1974-05-21 1975-05-16 Provision of wire connections for semiconductor devices Expired GB1502965A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
GB1502965A true GB1502965A (en) 1978-03-08

Family

ID=19821385

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2084075A Expired GB1502965A (en) 1974-05-21 1975-05-16 Provision of wire connections for semiconductor devices

Country Status (7)

Country Link
JP (1) JPS5118477A (enExample)
DE (1) DE2522022C3 (enExample)
FR (1) FR2272491B1 (enExample)
GB (1) GB1502965A (enExample)
HK (1) HK1079A (enExample)
IT (1) IT1038208B (enExample)
NL (1) NL7406783A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2146937A (en) * 1983-09-28 1985-05-01 Hitachi Ltd Semiconductor device and method of manufacturing the same
GB2205053A (en) * 1987-05-26 1988-11-30 Vyacheslav Gennadievich Sizov Method and arrangement for interconnection of semiconductor devices

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
AU569998B2 (en) * 1981-03-27 1988-03-03 Dow Chemical Company, The Process for preparation of diene styrene alpha- methylstyrene block polymers
JPH0614322U (ja) * 1992-07-28 1994-02-22 東洋化学株式会社 合成樹脂製軒樋継手

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2146937A (en) * 1983-09-28 1985-05-01 Hitachi Ltd Semiconductor device and method of manufacturing the same
GB2205053A (en) * 1987-05-26 1988-11-30 Vyacheslav Gennadievich Sizov Method and arrangement for interconnection of semiconductor devices

Also Published As

Publication number Publication date
IT1038208B (it) 1979-11-20
HK1079A (en) 1979-01-12
NL7406783A (nl) 1975-11-25
FR2272491A1 (enExample) 1975-12-19
DE2522022C3 (de) 1980-01-10
FR2272491B1 (enExample) 1978-10-27
JPS5118477A (en) 1976-02-14
JPS5310427B2 (enExample) 1978-04-13
DE2522022B2 (de) 1979-05-17
DE2522022A1 (de) 1975-12-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee