FR2094394A5 - - Google Patents

Info

Publication number
FR2094394A5
FR2094394A5 FR7022666A FR7022666A FR2094394A5 FR 2094394 A5 FR2094394 A5 FR 2094394A5 FR 7022666 A FR7022666 A FR 7022666A FR 7022666 A FR7022666 A FR 7022666A FR 2094394 A5 FR2094394 A5 FR 2094394A5
Authority
FR
France
Prior art keywords
wire
conductor
semi
ball
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7022666A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7022666A priority Critical patent/FR2094394A5/fr
Priority to DE19712125748 priority patent/DE2125748A1/de
Priority to NL7108093A priority patent/NL7108093A/xx
Priority to GB2814171A priority patent/GB1341259A/en
Priority to CH880671A priority patent/CH550632A/xx
Application granted granted Critical
Publication of FR2094394A5 publication Critical patent/FR2094394A5/fr
Priority to US05/353,375 priority patent/US3950631A/en
Priority to HK579/76*UA priority patent/HK57976A/xx
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
FR7022666A 1970-06-19 1970-06-19 Expired FR2094394A5 (enExample)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR7022666A FR2094394A5 (enExample) 1970-06-19 1970-06-19
DE19712125748 DE2125748A1 (de) 1970-06-19 1971-05-25 Verfahren und Vorrichtung zum Verschweißen eines Drahtes mittels einer Thermokompressionsverbindung
NL7108093A NL7108093A (enExample) 1970-06-19 1971-06-12
GB2814171A GB1341259A (en) 1970-06-19 1971-06-16 Thermo-compression wire bonding
CH880671A CH550632A (de) 1970-06-19 1971-06-16 Verfahren zum befestigen eines drahtes an einem halbleiterkoerper.
US05/353,375 US3950631A (en) 1970-06-19 1973-04-23 Device for welding a wire by means of thermo-compression bonding
HK579/76*UA HK57976A (en) 1970-06-19 1976-09-23 Improvements in and relating to thermo-compression wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7022666A FR2094394A5 (enExample) 1970-06-19 1970-06-19

Publications (1)

Publication Number Publication Date
FR2094394A5 true FR2094394A5 (enExample) 1972-02-04

Family

ID=9057450

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7022666A Expired FR2094394A5 (enExample) 1970-06-19 1970-06-19

Country Status (6)

Country Link
CH (1) CH550632A (enExample)
DE (1) DE2125748A1 (enExample)
FR (1) FR2094394A5 (enExample)
GB (1) GB1341259A (enExample)
HK (1) HK57976A (enExample)
NL (1) NL7108093A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2311430A1 (fr) * 1975-05-15 1976-12-10 Welding Inst Procede et appareil de connexion electrique de fils metalliques par spherule ou petite boule d'extremite

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
GB2260096B (en) * 1991-08-31 1995-05-17 Hydro Marine Systems Limited A method of and apparatus for testing the integrity of a friction weld
DE4306282A1 (de) * 1993-03-01 1994-09-15 Emhart Inc Verfahren und Vorrichtung zum Verschweißen eines Einschweißteils in einer eine Metallplatte und eine darüberliegende Metallauflage umfassenden Schweißstelle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2311430A1 (fr) * 1975-05-15 1976-12-10 Welding Inst Procede et appareil de connexion electrique de fils metalliques par spherule ou petite boule d'extremite

Also Published As

Publication number Publication date
DE2125748A1 (de) 1971-12-23
CH550632A (de) 1974-06-28
GB1341259A (en) 1973-12-19
NL7108093A (enExample) 1971-12-21
HK57976A (en) 1976-10-01

Similar Documents

Publication Publication Date Title
GB1536872A (en) Electrical inter-connection method and apparatus
GB1373962A (en) Methods for machining electrodes
GB1007459A (en) Bonding device for joining a wire-like member to a part
GB1094699A (en) Method of attaching leads to thin films
GB987524A (en) Method of producing cup-shaped mounts for semiconductors
NL7108093A (enExample)
GB995853A (en) Apparatus for bonding wire-like elements to articles
JPS55118643A (en) Wire bonding process
GB1502965A (en) Provision of wire connections for semiconductor devices
GB1181280A (en) Improvements in or relating to Ultrasonic Bonding
GB1295707A (enExample)
ES302857A1 (es) Un metodo para soldar por un procedimiento del tipo de escoria electrica
GB1222477A (en) A method of making a welded joint between copper and aluminium components
GB1308217A (en) Bonding
CN112367772A (zh) Igbt功率模块端子压焊方法
CN222705445U (zh) 一种防氧化引线键合机
GB1219196A (en) Method of, and machine for, rivetting wire terminals to a substrate
CN213003508U (zh) 金丝线焊线机专用夹紧结构
GB1203122A (en) Method of producing a welded joint between workpieces of copper and aluminium
JPS568851A (en) Lead wire connecting method of semiconductor device
FR2160764A1 (en) Semiconductor component prodn machine - with thermocompression welder
GB983957A (en) Semiconductor device and method of manufacture
GB1260000A (en) Improvements in soldering machines
JPS6379331A (ja) ワイヤボンデイング装置
GB875273A (en) Improvements in and relating to devices for electric arc-welding with flux-covered arc

Legal Events

Date Code Title Description
ST Notification of lapse