GB1499578A - Circuit board assembly and heat transfer structure - Google Patents

Circuit board assembly and heat transfer structure

Info

Publication number
GB1499578A
GB1499578A GB44838/75A GB4483875A GB1499578A GB 1499578 A GB1499578 A GB 1499578A GB 44838/75 A GB44838/75 A GB 44838/75A GB 4483875 A GB4483875 A GB 4483875A GB 1499578 A GB1499578 A GB 1499578A
Authority
GB
United Kingdom
Prior art keywords
heat transfer
transfer structure
circuit board
heat
mountings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB44838/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sundstrand Heat Transfer Inc
Original Assignee
Sundstrand Heat Transfer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Heat Transfer Inc filed Critical Sundstrand Heat Transfer Inc
Publication of GB1499578A publication Critical patent/GB1499578A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB44838/75A 1974-11-25 1975-10-30 Circuit board assembly and heat transfer structure Expired GB1499578A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52664374A 1974-11-25 1974-11-25

Publications (1)

Publication Number Publication Date
GB1499578A true GB1499578A (en) 1978-02-01

Family

ID=24098158

Family Applications (1)

Application Number Title Priority Date Filing Date
GB44838/75A Expired GB1499578A (en) 1974-11-25 1975-10-30 Circuit board assembly and heat transfer structure

Country Status (6)

Country Link
JP (1) JPS5162901A (cg-RX-API-DMAC10.html)
DE (1) DE2550419A1 (cg-RX-API-DMAC10.html)
FR (1) FR2292335A1 (cg-RX-API-DMAC10.html)
GB (1) GB1499578A (cg-RX-API-DMAC10.html)
IT (1) IT1052396B (cg-RX-API-DMAC10.html)
SE (1) SE412144B (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
CN100449247C (zh) * 2002-12-12 2009-01-07 索尼株式会社 热输送装置及其制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3305687A1 (de) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Verfahren zur herstellung komplexer mikroschaltungsplatten, -substrate und mikroschaltungen und nach dem verfahren hergestellte substrate und mikroschaltungen
JPS59500742A (ja) * 1983-04-27 1984-04-26 ヒユ−ズ・エアクラフト・カンパニ− 高電力回路基盤用ヒ−トパイプ冷却モジユ−ル
FR2577349B1 (fr) * 1985-02-08 1987-10-09 Sintra Dispositif de refroidissement de circuits integres a semi-conducteur
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
GB2199650B (en) * 1986-12-22 1990-11-14 Sundstrand Corp Heat dissipating mounting for electronic components
CN100449247C (zh) * 2002-12-12 2009-01-07 索尼株式会社 热输送装置及其制造方法

Also Published As

Publication number Publication date
IT1052396B (it) 1981-06-20
SE7512989L (sv) 1976-05-26
FR2292335A1 (fr) 1976-06-18
SE412144B (sv) 1980-02-18
DE2550419A1 (de) 1976-05-26
JPS5162901A (en) 1976-05-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee