FR2292335A1 - Dispositif de refroidissement de composants electroniques - Google Patents

Dispositif de refroidissement de composants electroniques

Info

Publication number
FR2292335A1
FR2292335A1 FR7532786A FR7532786A FR2292335A1 FR 2292335 A1 FR2292335 A1 FR 2292335A1 FR 7532786 A FR7532786 A FR 7532786A FR 7532786 A FR7532786 A FR 7532786A FR 2292335 A1 FR2292335 A1 FR 2292335A1
Authority
FR
France
Prior art keywords
electronic component
cooling device
component cooling
electronic
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7532786A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sundstrand Heat Transfer Inc
Original Assignee
Sundstrand Heat Transfer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Heat Transfer Inc filed Critical Sundstrand Heat Transfer Inc
Publication of FR2292335A1 publication Critical patent/FR2292335A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7532786A 1974-11-25 1975-10-27 Dispositif de refroidissement de composants electroniques Withdrawn FR2292335A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52664374A 1974-11-25 1974-11-25

Publications (1)

Publication Number Publication Date
FR2292335A1 true FR2292335A1 (fr) 1976-06-18

Family

ID=24098158

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7532786A Withdrawn FR2292335A1 (fr) 1974-11-25 1975-10-27 Dispositif de refroidissement de composants electroniques

Country Status (6)

Country Link
JP (1) JPS5162901A (fr)
DE (1) DE2550419A1 (fr)
FR (1) FR2292335A1 (fr)
GB (1) GB1499578A (fr)
IT (1) IT1052396B (fr)
SE (1) SE412144B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2577349A1 (fr) * 1985-02-08 1986-08-14 Sintra Dispositif de refroidissement de circuits integres a semi-conducteur
FR2608841A1 (fr) * 1986-12-22 1988-06-24 Sundstrand Corp Ensemble forme d'un substrat pour composants electroniques et d'une structure de refroidissement

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE3305687A1 (de) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Verfahren zur herstellung komplexer mikroschaltungsplatten, -substrate und mikroschaltungen und nach dem verfahren hergestellte substrate und mikroschaltungen
JPS59500742A (ja) * 1983-04-27 1984-04-26 ヒユ−ズ・エアクラフト・カンパニ− 高電力回路基盤用ヒ−トパイプ冷却モジユ−ル
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2577349A1 (fr) * 1985-02-08 1986-08-14 Sintra Dispositif de refroidissement de circuits integres a semi-conducteur
EP0192541A1 (fr) * 1985-02-08 1986-08-27 Thomson-Csf Dispositif de refroidissement de circuits intégrés à semiconducteur
FR2608841A1 (fr) * 1986-12-22 1988-06-24 Sundstrand Corp Ensemble forme d'un substrat pour composants electroniques et d'une structure de refroidissement

Also Published As

Publication number Publication date
IT1052396B (it) 1981-06-20
SE7512989L (sv) 1976-05-26
DE2550419A1 (de) 1976-05-26
SE412144B (sv) 1980-02-18
JPS5162901A (en) 1976-05-31
GB1499578A (en) 1978-02-01

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Legal Events

Date Code Title Description
ST Notification of lapse