IT1052396B - Dispositivo per scambio di calore - Google Patents

Dispositivo per scambio di calore

Info

Publication number
IT1052396B
IT1052396B IT52381/75A IT5238175A IT1052396B IT 1052396 B IT1052396 B IT 1052396B IT 52381/75 A IT52381/75 A IT 52381/75A IT 5238175 A IT5238175 A IT 5238175A IT 1052396 B IT1052396 B IT 1052396B
Authority
IT
Italy
Prior art keywords
heat exchange
exchange device
heat
exchange
Prior art date
Application number
IT52381/75A
Other languages
English (en)
Italian (it)
Original Assignee
Sundstrand Heat Transfer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sundstrand Heat Transfer Inc filed Critical Sundstrand Heat Transfer Inc
Application granted granted Critical
Publication of IT1052396B publication Critical patent/IT1052396B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT52381/75A 1974-11-25 1975-11-25 Dispositivo per scambio di calore IT1052396B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52664374A 1974-11-25 1974-11-25

Publications (1)

Publication Number Publication Date
IT1052396B true IT1052396B (it) 1981-06-20

Family

ID=24098158

Family Applications (1)

Application Number Title Priority Date Filing Date
IT52381/75A IT1052396B (it) 1974-11-25 1975-11-25 Dispositivo per scambio di calore

Country Status (6)

Country Link
JP (1) JPS5162901A (cg-RX-API-DMAC10.html)
DE (1) DE2550419A1 (cg-RX-API-DMAC10.html)
FR (1) FR2292335A1 (cg-RX-API-DMAC10.html)
GB (1) GB1499578A (cg-RX-API-DMAC10.html)
IT (1) IT1052396B (cg-RX-API-DMAC10.html)
SE (1) SE412144B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353415A (en) 1979-07-30 1982-10-12 United Kingdom Atomic Energy Authority Heat pipes and thermal siphons
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE3305687A1 (de) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Verfahren zur herstellung komplexer mikroschaltungsplatten, -substrate und mikroschaltungen und nach dem verfahren hergestellte substrate und mikroschaltungen
JPS59500742A (ja) * 1983-04-27 1984-04-26 ヒユ−ズ・エアクラフト・カンパニ− 高電力回路基盤用ヒ−トパイプ冷却モジユ−ル
FR2577349B1 (fr) * 1985-02-08 1987-10-09 Sintra Dispositif de refroidissement de circuits integres a semi-conducteur
US4805691A (en) * 1986-12-22 1989-02-21 Sundstrand Corporation Cooling technique for compact electronics inverter
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法

Also Published As

Publication number Publication date
SE7512989L (sv) 1976-05-26
FR2292335A1 (fr) 1976-06-18
SE412144B (sv) 1980-02-18
DE2550419A1 (de) 1976-05-26
GB1499578A (en) 1978-02-01
JPS5162901A (en) 1976-05-31

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