GB1494394A - Selective electroplating of gold onto composite surfaces - Google Patents

Selective electroplating of gold onto composite surfaces

Info

Publication number
GB1494394A
GB1494394A GB7091/75A GB709175A GB1494394A GB 1494394 A GB1494394 A GB 1494394A GB 7091/75 A GB7091/75 A GB 7091/75A GB 709175 A GB709175 A GB 709175A GB 1494394 A GB1494394 A GB 1494394A
Authority
GB
United Kingdom
Prior art keywords
plating
gold
feb
regions
optionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7091/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US443625A external-priority patent/US3873428A/en
Priority claimed from US443624A external-priority patent/US3926747A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1494394A publication Critical patent/GB1494394A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
GB7091/75A 1974-02-19 1975-02-19 Selective electroplating of gold onto composite surfaces Expired GB1494394A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443625A US3873428A (en) 1974-02-19 1974-02-19 Preferential gold electroplating
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (1)

Publication Number Publication Date
GB1494394A true GB1494394A (en) 1977-12-07

Family

ID=27033593

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7091/75A Expired GB1494394A (en) 1974-02-19 1975-02-19 Selective electroplating of gold onto composite surfaces

Country Status (7)

Country Link
JP (1) JPS5440056B2 (https=)
DE (1) DE2506990C3 (https=)
FR (1) FR2261352B1 (https=)
GB (1) GB1494394A (https=)
IT (1) IT1031886B (https=)
NL (1) NL160034C (https=)
SE (1) SE446751B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533837A1 (en) * 1997-03-10 2005-05-25 Asahi Kasei Kabushiki Kaisha Selective electroplating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533837A1 (en) * 1997-03-10 2005-05-25 Asahi Kasei Kabushiki Kaisha Selective electroplating method

Also Published As

Publication number Publication date
FR2261352A1 (https=) 1975-09-12
FR2261352B1 (https=) 1978-04-21
DE2506990A1 (de) 1975-08-28
JPS50124841A (https=) 1975-10-01
SE446751B (sv) 1986-10-06
JPS5440056B2 (https=) 1979-12-01
IT1031886B (it) 1979-05-10
DE2506990C3 (de) 1979-09-13
DE2506990B2 (de) 1979-01-25
NL160034C (nl) 1979-09-17
SE7501777L (https=) 1975-08-20
NL160034B (nl) 1979-04-17
NL7501908A (nl) 1975-08-21

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee