JPS50124841A - - Google Patents
Info
- Publication number
- JPS50124841A JPS50124841A JP50020808A JP2080875A JPS50124841A JP S50124841 A JPS50124841 A JP S50124841A JP 50020808 A JP50020808 A JP 50020808A JP 2080875 A JP2080875 A JP 2080875A JP S50124841 A JPS50124841 A JP S50124841A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US443625A US3873428A (en) | 1974-02-19 | 1974-02-19 | Preferential gold electroplating |
| US443624A US3926747A (en) | 1974-02-19 | 1974-02-19 | Selective electrodeposition of gold on electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50124841A true JPS50124841A (https=) | 1975-10-01 |
| JPS5440056B2 JPS5440056B2 (https=) | 1979-12-01 |
Family
ID=27033593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2080875A Expired JPS5440056B2 (https=) | 1974-02-19 | 1975-02-19 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5440056B2 (https=) |
| DE (1) | DE2506990C3 (https=) |
| FR (1) | FR2261352B1 (https=) |
| GB (1) | GB1494394A (https=) |
| IT (1) | IT1031886B (https=) |
| NL (1) | NL160034C (https=) |
| SE (1) | SE446751B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4226167C2 (de) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik |
| DE69832380T2 (de) * | 1997-03-10 | 2006-08-03 | Asahi Kasei Kabushiki Kaisha | Herstellungsmethode für die verdrahtung von halbleiteranordnungen |
-
1975
- 1975-02-18 NL NL7501908.A patent/NL160034C/xx not_active IP Right Cessation
- 1975-02-18 SE SE7501777A patent/SE446751B/xx not_active IP Right Cessation
- 1975-02-19 IT IT20452/75A patent/IT1031886B/it active
- 1975-02-19 GB GB7091/75A patent/GB1494394A/en not_active Expired
- 1975-02-19 FR FR7505153A patent/FR2261352B1/fr not_active Expired
- 1975-02-19 JP JP2080875A patent/JPS5440056B2/ja not_active Expired
- 1975-02-19 DE DE2506990A patent/DE2506990C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2261352A1 (https=) | 1975-09-12 |
| FR2261352B1 (https=) | 1978-04-21 |
| DE2506990A1 (de) | 1975-08-28 |
| SE446751B (sv) | 1986-10-06 |
| JPS5440056B2 (https=) | 1979-12-01 |
| IT1031886B (it) | 1979-05-10 |
| GB1494394A (en) | 1977-12-07 |
| DE2506990C3 (de) | 1979-09-13 |
| DE2506990B2 (de) | 1979-01-25 |
| NL160034C (nl) | 1979-09-17 |
| SE7501777L (https=) | 1975-08-20 |
| NL160034B (nl) | 1979-04-17 |
| NL7501908A (nl) | 1975-08-21 |