GB1474575A - Semiconductor components - Google Patents

Semiconductor components

Info

Publication number
GB1474575A
GB1474575A GB2922074A GB2922074A GB1474575A GB 1474575 A GB1474575 A GB 1474575A GB 2922074 A GB2922074 A GB 2922074A GB 2922074 A GB2922074 A GB 2922074A GB 1474575 A GB1474575 A GB 1474575A
Authority
GB
United Kingdom
Prior art keywords
silver
aluminium
contact
electrode
july
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2922074A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1474575A publication Critical patent/GB1474575A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
GB2922074A 1973-07-16 1974-07-02 Semiconductor components Expired GB1474575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2336152A DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1474575A true GB1474575A (en) 1977-05-25

Family

ID=5887096

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2922074A Expired GB1474575A (en) 1973-07-16 1974-07-02 Semiconductor components

Country Status (8)

Country Link
JP (1) JPS5510134B2 (https=)
BE (1) BE817065A (https=)
CA (1) CA1015070A (https=)
DE (1) DE2336152C3 (https=)
FR (1) FR2238248B1 (https=)
GB (1) GB1474575A (https=)
IT (1) IT1017057B (https=)
SE (1) SE395201B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584058Y2 (ja) * 1976-08-10 1983-01-24 株式会社ターダ ガス器具
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
JPS5490732U (https=) * 1977-12-12 1979-06-27
JPS6123050U (ja) * 1985-06-17 1986-02-10 株式会社 同和 バ−ナにおける始動消火連動装置

Also Published As

Publication number Publication date
FR2238248B1 (https=) 1978-03-24
DE2336152C3 (de) 1979-03-22
SE7409300L (https=) 1975-02-21
JPS5040075A (https=) 1975-04-12
IT1017057B (it) 1977-07-20
FR2238248A1 (https=) 1975-02-14
BE817065A (fr) 1974-10-16
JPS5510134B2 (https=) 1980-03-14
SE395201B (sv) 1977-08-01
DE2336152A1 (de) 1975-01-30
DE2336152B2 (de) 1978-07-20
CA1015070A (en) 1977-08-02

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee