GB1468873A - - Google Patents
Info
- Publication number
- GB1468873A GB1468873A GB1630774A GB1630774A GB1468873A GB 1468873 A GB1468873 A GB 1468873A GB 1630774 A GB1630774 A GB 1630774A GB 1630774 A GB1630774 A GB 1630774A GB 1468873 A GB1468873 A GB 1468873A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- soldering
- april
- contacted
- lower side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2319630A DE2319630C3 (de) | 1973-04-18 | 1973-04-18 | Lötvorrichtung für gedruckte Schaltungen |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1468873A true GB1468873A (ko) | 1977-03-30 |
Family
ID=5878502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1630774A Expired GB1468873A (ko) | 1973-04-18 | 1974-04-11 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5530955B2 (ko) |
BE (1) | BE813784A (ko) |
DE (1) | DE2319630C3 (ko) |
FR (1) | FR2226802B1 (ko) |
GB (1) | GB1468873A (ko) |
NL (1) | NL7405070A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1125669A2 (de) * | 2000-02-15 | 2001-08-22 | BOS Berlin Oberspree Sondermaschinenbau | Verfahren und Vorrichtung zum Verfüllen von Kavitäten |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5544734Y2 (ko) * | 1973-12-03 | 1980-10-21 | ||
JPS5376372A (en) * | 1976-12-17 | 1978-07-06 | Matsushita Electric Ind Co Ltd | Device for attaching chip circuit parts |
JPS5425248A (en) * | 1977-07-29 | 1979-02-26 | Hitachi Ltd | Vacuum soldering apparatus |
GB2018036B (en) * | 1978-03-31 | 1982-08-25 | Vishay Intertechnology Inc | Precision resistors subassemblies therefor and their manufacture |
JPS62227571A (ja) * | 1986-03-27 | 1987-10-06 | Tamura Seisakusho Co Ltd | はんだ付け方法 |
-
1973
- 1973-04-18 DE DE2319630A patent/DE2319630C3/de not_active Expired
-
1974
- 1974-04-11 GB GB1630774A patent/GB1468873A/en not_active Expired
- 1974-04-15 JP JP4207374A patent/JPS5530955B2/ja not_active Expired
- 1974-04-16 FR FR7413165A patent/FR2226802B1/fr not_active Expired
- 1974-04-16 BE BE143260A patent/BE813784A/xx unknown
- 1974-04-16 NL NL7405070A patent/NL7405070A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1125669A2 (de) * | 2000-02-15 | 2001-08-22 | BOS Berlin Oberspree Sondermaschinenbau | Verfahren und Vorrichtung zum Verfüllen von Kavitäten |
EP1125669A3 (de) * | 2000-02-15 | 2003-11-05 | BOS Berlin Oberspree Sondermaschinenbau | Verfahren und Vorrichtung zum Verfüllen von Kavitäten |
Also Published As
Publication number | Publication date |
---|---|
DE2319630A1 (de) | 1974-11-14 |
NL7405070A (ko) | 1974-10-22 |
FR2226802A1 (ko) | 1974-11-15 |
BE813784A (fr) | 1974-10-16 |
JPS5530955B2 (ko) | 1980-08-14 |
DE2319630C3 (de) | 1979-12-20 |
DE2319630B2 (de) | 1979-04-12 |
FR2226802B1 (ko) | 1979-06-29 |
JPS509560A (ko) | 1975-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |