JPS5530955B2 - - Google Patents

Info

Publication number
JPS5530955B2
JPS5530955B2 JP4207374A JP4207374A JPS5530955B2 JP S5530955 B2 JPS5530955 B2 JP S5530955B2 JP 4207374 A JP4207374 A JP 4207374A JP 4207374 A JP4207374 A JP 4207374A JP S5530955 B2 JPS5530955 B2 JP S5530955B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4207374A
Other versions
JPS509560A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS509560A publication Critical patent/JPS509560A/ja
Publication of JPS5530955B2 publication Critical patent/JPS5530955B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP4207374A 1973-04-18 1974-04-15 Expired JPS5530955B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2319630A DE2319630C3 (de) 1973-04-18 1973-04-18 Lötvorrichtung für gedruckte Schaltungen

Publications (2)

Publication Number Publication Date
JPS509560A JPS509560A (ja) 1975-01-31
JPS5530955B2 true JPS5530955B2 (ja) 1980-08-14

Family

ID=5878502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4207374A Expired JPS5530955B2 (ja) 1973-04-18 1974-04-15

Country Status (6)

Country Link
JP (1) JPS5530955B2 (ja)
BE (1) BE813784A (ja)
DE (1) DE2319630C3 (ja)
FR (1) FR2226802B1 (ja)
GB (1) GB1468873A (ja)
NL (1) NL7405070A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544734Y2 (ja) * 1973-12-03 1980-10-21
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS5425248A (en) * 1977-07-29 1979-02-26 Hitachi Ltd Vacuum soldering apparatus
GB2018036B (en) * 1978-03-31 1982-08-25 Vishay Intertechnology Inc Precision resistors subassemblies therefor and their manufacture
JPS62227571A (ja) * 1986-03-27 1987-10-06 Tamura Seisakusho Co Ltd はんだ付け方法
DE10008031A1 (de) * 2000-02-15 2001-08-16 Bos Berlin Oberspree Sondermas Verfahren und Vorrichtung zum Verfüllen von Kavitäten

Also Published As

Publication number Publication date
FR2226802A1 (ja) 1974-11-15
NL7405070A (ja) 1974-10-22
DE2319630B2 (de) 1979-04-12
DE2319630A1 (de) 1974-11-14
DE2319630C3 (de) 1979-12-20
GB1468873A (ja) 1977-03-30
JPS509560A (ja) 1975-01-31
FR2226802B1 (ja) 1979-06-29
BE813784A (fr) 1974-10-16

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