GB1447843A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1447843A
GB1447843A GB4287974A GB4287974A GB1447843A GB 1447843 A GB1447843 A GB 1447843A GB 4287974 A GB4287974 A GB 4287974A GB 4287974 A GB4287974 A GB 4287974A GB 1447843 A GB1447843 A GB 1447843A
Authority
GB
United Kingdom
Prior art keywords
organic material
layer
semi
insulating layer
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4287974A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1447843A publication Critical patent/GB1447843A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

1447843 Semi-conductor devices SIEMENS AG 3 Oct 1974 [17 Oct 1973] 42879/74 Heading H1K A semi-conductor device is produced by forming a first inorganic insulating layer 2 on a surface of a semi-conductor body 1, producing a metal layer 5, 6 on the inorganic layer 2, covering a part 7 of the metal layer 5, 6 with a layer of organic material 8 containing at least one additive compound which decomposes or vaporizes at a lower temperature than the organic material 8, covering the organic material 8 and the metal layer 5, 6 with a second inorganic insulating layer 9 at a temperature so as not to affect the organic material 8, and heating the device to evolve a non- reactive gas and lift the portion 10 of the second insulating layer 9 over the organic material 8. The organic material 8 may be a photo-lacquer and several examples of the additive compound are given, including ammonium and nitro compounds.
GB4287974A 1973-10-17 1974-10-03 Semiconductor devices Expired GB1447843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732352138 DE2352138A1 (en) 1973-10-17 1973-10-17 METHOD OF MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

Publications (1)

Publication Number Publication Date
GB1447843A true GB1447843A (en) 1976-09-02

Family

ID=5895702

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4287974A Expired GB1447843A (en) 1973-10-17 1974-10-03 Semiconductor devices

Country Status (7)

Country Link
US (1) US3984588A (en)
JP (1) JPS5080084A (en)
CA (1) CA1021469A (en)
DE (1) DE2352138A1 (en)
FR (1) FR2248614B1 (en)
GB (1) GB1447843A (en)
IT (1) IT1022912B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837826A1 (en) * 1988-11-08 1990-05-10 Nokia Unterhaltungselektronik METHOD FOR COATING A SUBSTRATE PLATE FOR A LIQUID CRYSTAL CELL
US5772104A (en) * 1996-08-26 1998-06-30 Peerless Of America Incorporated Methods of brazing and preparing articles for brazing, and coating composition for use in such methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020156A (en) * 1957-05-10 1962-02-06 Mycalex Corp Of America Method of coating metal on dielectric material
US3222173A (en) * 1961-05-15 1965-12-07 Vitramon Inc Method of making an electrical unit
US3443944A (en) * 1963-10-23 1969-05-13 United Aircraft Corp Method of depositing conductive patterns on a substrate
US3518751A (en) * 1967-05-25 1970-07-07 Hughes Aircraft Co Electrical connection and/or mounting arrays for integrated circuit chips
US3775117A (en) * 1971-07-13 1973-11-27 Siemens Ag Process for selective metallization of insulating material bodies
GB1384028A (en) * 1972-08-21 1974-02-12 Hughes Aircraft Co Method of making a semiconductor device
US3936531A (en) * 1973-05-01 1976-02-03 Union Carbide Corporation Masking process with thermal destruction of edges of mask

Also Published As

Publication number Publication date
IT1022912B (en) 1978-04-20
FR2248614B1 (en) 1978-11-24
FR2248614A1 (en) 1975-05-16
JPS5080084A (en) 1975-06-28
US3984588A (en) 1976-10-05
CA1021469A (en) 1977-11-22
DE2352138A1 (en) 1975-04-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee