GB1425298A - Electroless deposition of copper - Google Patents
Electroless deposition of copperInfo
- Publication number
- GB1425298A GB1425298A GB1480474A GB1480474A GB1425298A GB 1425298 A GB1425298 A GB 1425298A GB 1480474 A GB1480474 A GB 1480474A GB 1480474 A GB1480474 A GB 1480474A GB 1425298 A GB1425298 A GB 1425298A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alkyl
- compound
- aralkyl
- april
- aryl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 125000000217 alkyl group Chemical group 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- NHIRIMBKJDSLBY-UHFFFAOYSA-N 3-[bis(3-hydroxypropyl)amino]propan-1-ol Chemical compound OCCCN(CCCO)CCCO NHIRIMBKJDSLBY-UHFFFAOYSA-N 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 1
- 101150003085 Pdcl gene Proteins 0.000 abstract 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract 1
- 125000005157 alkyl carboxy group Chemical group 0.000 abstract 1
- TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 abstract 1
- -1 ethoxylated phosphate ester Chemical class 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 125000005702 oxyalkylene group Chemical group 0.000 abstract 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 abstract 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7304650A NL7304650A (enrdf_load_stackoverflow) | 1973-04-04 | 1973-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1425298A true GB1425298A (en) | 1976-02-18 |
Family
ID=19818567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1480474A Expired GB1425298A (en) | 1973-04-04 | 1974-04-03 | Electroless deposition of copper |
Country Status (11)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
| WO2003085167A1 (de) * | 2002-04-04 | 2003-10-16 | Chemetall Gmbh | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
| US20130295294A1 (en) * | 2012-05-07 | 2013-11-07 | C. Uyemura & Co., Ltd. | Electroless copper plating bath and electroless copper plating method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7402423A (nl) * | 1974-02-22 | 1975-08-26 | Philips Nv | Universele verkoperingsoplossing. |
| US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
| CA1144304A (en) * | 1978-10-23 | 1983-04-12 | Glenn O. Mallory, Jr. | Electroless deposition of copper |
-
1973
- 1973-04-04 NL NL7304650A patent/NL7304650A/xx not_active Application Discontinuation
-
1974
- 1974-03-27 DE DE19742414650 patent/DE2414650C3/de not_active Expired
- 1974-04-01 CH CH451274A patent/CH606473A5/xx not_active IP Right Cessation
- 1974-04-01 AT AT266674A patent/AT326970B/de not_active IP Right Cessation
- 1974-04-02 BE BE142758A patent/BE813195A/xx not_active IP Right Cessation
- 1974-04-02 SE SE7404432A patent/SE392737B/xx not_active IP Right Cessation
- 1974-04-03 CA CA196,764A patent/CA1021103A/en not_active Expired
- 1974-04-03 IT IT4263674A patent/IT1010903B/it active
- 1974-04-03 FR FR7411799A patent/FR2224555B1/fr not_active Expired
- 1974-04-03 GB GB1480474A patent/GB1425298A/en not_active Expired
- 1974-04-04 JP JP3744174A patent/JPS5334102B2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
| WO2003085167A1 (de) * | 2002-04-04 | 2003-10-16 | Chemetall Gmbh | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
| US7282088B2 (en) | 2002-04-04 | 2007-10-16 | Chemetall Gmbh | Method for copper-plating or bronze-plating an object and liquid mixtures therefor |
| CN100365163C (zh) * | 2002-04-04 | 2008-01-30 | 坎梅陶尔股份有限公司 | 对物体镀铜或镀青铜的方法和用于该方法的液态混合物 |
| US20130295294A1 (en) * | 2012-05-07 | 2013-11-07 | C. Uyemura & Co., Ltd. | Electroless copper plating bath and electroless copper plating method |
| CN103388138A (zh) * | 2012-05-07 | 2013-11-13 | 上村工业株式会社 | 非电解镀铜浴和非电解镀铜方法 |
| CN103388138B (zh) * | 2012-05-07 | 2018-07-24 | 上村工业株式会社 | 非电解镀铜浴和非电解镀铜方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2224555A1 (enrdf_load_stackoverflow) | 1974-10-31 |
| DE2414650B2 (de) | 1978-03-16 |
| JPS49129638A (enrdf_load_stackoverflow) | 1974-12-12 |
| CA1021103A (en) | 1977-11-22 |
| IT1010903B (it) | 1977-01-20 |
| SE392737B (sv) | 1977-04-18 |
| DE2414650A1 (de) | 1974-10-17 |
| ATA266674A (de) | 1975-03-15 |
| DE2414650C3 (de) | 1978-11-16 |
| NL7304650A (enrdf_load_stackoverflow) | 1974-10-08 |
| CH606473A5 (enrdf_load_stackoverflow) | 1978-10-31 |
| BE813195A (fr) | 1974-10-02 |
| FR2224555B1 (enrdf_load_stackoverflow) | 1976-12-17 |
| AT326970B (de) | 1976-01-12 |
| JPS5334102B2 (enrdf_load_stackoverflow) | 1978-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |