JPS49129638A - - Google Patents

Info

Publication number
JPS49129638A
JPS49129638A JP3744174A JP3744174A JPS49129638A JP S49129638 A JPS49129638 A JP S49129638A JP 3744174 A JP3744174 A JP 3744174A JP 3744174 A JP3744174 A JP 3744174A JP S49129638 A JPS49129638 A JP S49129638A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3744174A
Other languages
Japanese (ja)
Other versions
JPS5334102B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49129638A publication Critical patent/JPS49129638A/ja
Publication of JPS5334102B2 publication Critical patent/JPS5334102B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP3744174A 1973-04-04 1974-04-04 Expired JPS5334102B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (enrdf_load_stackoverflow) 1973-04-04 1973-04-04

Publications (2)

Publication Number Publication Date
JPS49129638A true JPS49129638A (enrdf_load_stackoverflow) 1974-12-12
JPS5334102B2 JPS5334102B2 (enrdf_load_stackoverflow) 1978-09-19

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3744174A Expired JPS5334102B2 (enrdf_load_stackoverflow) 1973-04-04 1974-04-04

Country Status (11)

Country Link
JP (1) JPS5334102B2 (enrdf_load_stackoverflow)
AT (1) AT326970B (enrdf_load_stackoverflow)
BE (1) BE813195A (enrdf_load_stackoverflow)
CA (1) CA1021103A (enrdf_load_stackoverflow)
CH (1) CH606473A5 (enrdf_load_stackoverflow)
DE (1) DE2414650C3 (enrdf_load_stackoverflow)
FR (1) FR2224555B1 (enrdf_load_stackoverflow)
GB (1) GB1425298A (enrdf_load_stackoverflow)
IT (1) IT1010903B (enrdf_load_stackoverflow)
NL (1) NL7304650A (enrdf_load_stackoverflow)
SE (1) SE392737B (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (nl) * 1974-02-22 1975-08-26 Philips Nv Universele verkoperingsoplossing.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (de) * 2002-04-04 2004-04-08 Chemetall Gmbh Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
JP6030848B2 (ja) * 2012-05-07 2016-11-24 上村工業株式会社 無電解銅めっき浴及び無電解銅めっき方法

Also Published As

Publication number Publication date
NL7304650A (enrdf_load_stackoverflow) 1974-10-08
IT1010903B (it) 1977-01-20
AT326970B (de) 1976-01-12
DE2414650C3 (de) 1978-11-16
CA1021103A (en) 1977-11-22
SE392737B (sv) 1977-04-18
CH606473A5 (enrdf_load_stackoverflow) 1978-10-31
FR2224555B1 (enrdf_load_stackoverflow) 1976-12-17
BE813195A (fr) 1974-10-02
GB1425298A (en) 1976-02-18
ATA266674A (de) 1975-03-15
DE2414650B2 (de) 1978-03-16
FR2224555A1 (enrdf_load_stackoverflow) 1974-10-31
DE2414650A1 (de) 1974-10-17
JPS5334102B2 (enrdf_load_stackoverflow) 1978-09-19

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