GB1404524A - Method of forming interconnection leads in multilayer micro electronic devices - Google Patents
Method of forming interconnection leads in multilayer micro electronic devicesInfo
- Publication number
- GB1404524A GB1404524A GB3392673A GB3392673A GB1404524A GB 1404524 A GB1404524 A GB 1404524A GB 3392673 A GB3392673 A GB 3392673A GB 3392673 A GB3392673 A GB 3392673A GB 1404524 A GB1404524 A GB 1404524A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- interconnections
- aluminium
- masking
- magnesium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004377 microelectronic Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000004411 aluminium Substances 0.000 abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052782 aluminium Inorganic materials 0.000 abstract 4
- 230000000873 masking effect Effects 0.000 abstract 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 3
- 239000011777 magnesium Substances 0.000 abstract 3
- 229910052749 magnesium Inorganic materials 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- 235000011054 acetic acid Nutrition 0.000 abstract 1
- 150000001243 acetic acids Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27251972A | 1972-07-17 | 1972-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1404524A true GB1404524A (en) | 1975-09-03 |
Family
ID=23040144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3392673A Expired GB1404524A (en) | 1972-07-17 | 1973-07-17 | Method of forming interconnection leads in multilayer micro electronic devices |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS4963966A (pt) |
| FR (1) | FR2193256B1 (pt) |
| GB (1) | GB1404524A (pt) |
| NL (1) | NL7309531A (pt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2937993A1 (de) * | 1979-09-20 | 1981-04-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von integrierten mos-halbleiterschaltungen nach der silizium-gate-technologie |
| US7790624B2 (en) | 2008-07-16 | 2010-09-07 | Global Foundries Inc. | Methods for removing a metal-comprising material from a semiconductor substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3507766A (en) * | 1968-01-19 | 1970-04-21 | Texas Instruments Inc | Method of forming a heterogeneous composite insulating layer of silicon dioxide in multilevel integrated circuits |
-
1973
- 1973-07-06 NL NL7309531A patent/NL7309531A/xx not_active Application Discontinuation
- 1973-07-16 FR FR7325991A patent/FR2193256B1/fr not_active Expired
- 1973-07-17 GB GB3392673A patent/GB1404524A/en not_active Expired
- 1973-07-17 JP JP48079987A patent/JPS4963966A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4963966A (pt) | 1974-06-20 |
| NL7309531A (pt) | 1974-01-21 |
| FR2193256B1 (pt) | 1978-02-17 |
| DE2334213A1 (de) | 1974-01-31 |
| DE2334213B2 (de) | 1974-08-29 |
| FR2193256A1 (pt) | 1974-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |