GB1403801A - Semiconductor device stud mount - Google Patents
Semiconductor device stud mountInfo
- Publication number
- GB1403801A GB1403801A GB468373A GB468373A GB1403801A GB 1403801 A GB1403801 A GB 1403801A GB 468373 A GB468373 A GB 468373A GB 468373 A GB468373 A GB 468373A GB 1403801 A GB1403801 A GB 1403801A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- semi
- stud
- laser
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB468373A GB1403801A (en) | 1973-01-30 | 1973-01-30 | Semiconductor device stud mount |
| US404968A US3869702A (en) | 1973-01-30 | 1973-10-10 | Stud mount for light emissive semiconductor devices |
| IT19735/74A IT1007051B (it) | 1973-01-30 | 1974-01-24 | Cilindretto per il montaggio di di spositivi semiconduttori |
| DE2403566A DE2403566A1 (de) | 1973-01-30 | 1974-01-25 | Sockel fuer lichtemittierende halbleiterbauelemente |
| FR7403001A FR2215723B1 (enExample) | 1973-01-30 | 1974-01-30 | |
| JP49011928A JPS5048872A (enExample) | 1973-01-30 | 1974-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB468373A GB1403801A (en) | 1973-01-30 | 1973-01-30 | Semiconductor device stud mount |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1403801A true GB1403801A (en) | 1975-08-28 |
Family
ID=9781826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB468373A Expired GB1403801A (en) | 1973-01-30 | 1973-01-30 | Semiconductor device stud mount |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3869702A (enExample) |
| JP (1) | JPS5048872A (enExample) |
| DE (1) | DE2403566A1 (enExample) |
| FR (1) | FR2215723B1 (enExample) |
| GB (1) | GB1403801A (enExample) |
| IT (1) | IT1007051B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS606117B2 (ja) * | 1974-10-05 | 1985-02-15 | 日本電気株式会社 | 注入型半導体発光素子 |
| GB1544241A (en) * | 1976-05-11 | 1979-04-19 | Standard Telephones Cables Ltd | Injection laser mount |
| US4167744A (en) * | 1978-03-23 | 1979-09-11 | Rca Corporation | Electroluminescent semiconductor device having optical fiber window |
| US4347655A (en) * | 1978-09-28 | 1982-09-07 | Optical Information Systems, Inc. | Mounting arrangement for semiconductor optoelectronic devices |
| NL181963C (nl) * | 1979-06-26 | 1987-12-01 | Philips Nv | Halfgeleiderlaserinrichting. |
| US4394679A (en) * | 1980-09-15 | 1983-07-19 | Rca Corporation | Light emitting device with a continuous layer of copper covering the entire header |
| DE3048533C2 (de) * | 1980-12-22 | 1985-01-10 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Anordnung zur Temperaturstabilisierung von Halbleiterlasern |
| JPS58145169A (ja) * | 1982-02-23 | 1983-08-29 | Nec Corp | 光半導体装置 |
| US4581629A (en) * | 1983-06-17 | 1986-04-08 | Rca Corporation | Light emitting devices |
| US4759829A (en) * | 1985-06-27 | 1988-07-26 | Rca Corporation | Device header and method of making same |
| DE4206437A1 (de) * | 1992-02-29 | 1993-09-16 | Telefunken Microelectron | Halbleiter-baugruppe |
| US7061949B1 (en) | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB753136A (en) * | 1953-08-28 | 1956-07-18 | Standard Telephones Cables Ltd | Improvements in or relating to light cells or rectifiers |
| US2969487A (en) * | 1957-08-26 | 1961-01-24 | Raytheon Co | Sealed crystal diode packages |
| FR1319150A (fr) * | 1961-04-05 | 1963-02-22 | Gen Electric | Perfectionnements aux dispositifs à semi-conducteurs |
| US3421203A (en) * | 1965-04-06 | 1969-01-14 | Fairchild Camera Instr Co | Photodevice enclosure |
| FR1519635A (fr) * | 1966-12-28 | 1968-04-05 | Radiotechnique Coprim Rtc | Perfectionnement aux dispositifs semi-conducteurs électroluminescents |
| GB1232812A (enExample) * | 1968-02-02 | 1971-05-19 | ||
| US3647579A (en) * | 1968-03-28 | 1972-03-07 | Rca Corp | Liquid phase double epitaxial process for manufacturing light emitting gallium phosphide devices |
| US3560275A (en) * | 1968-11-08 | 1971-02-02 | Rca Corp | Fabricating semiconductor devices |
| GB1295306A (enExample) * | 1969-04-23 | 1972-11-08 | ||
| FR2127239A5 (enExample) * | 1971-03-01 | 1972-10-13 | Radiotechnique Compelec |
-
1973
- 1973-01-30 GB GB468373A patent/GB1403801A/en not_active Expired
- 1973-10-10 US US404968A patent/US3869702A/en not_active Expired - Lifetime
-
1974
- 1974-01-24 IT IT19735/74A patent/IT1007051B/it active
- 1974-01-25 DE DE2403566A patent/DE2403566A1/de not_active Withdrawn
- 1974-01-30 FR FR7403001A patent/FR2215723B1/fr not_active Expired
- 1974-01-30 JP JP49011928A patent/JPS5048872A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT1007051B (it) | 1976-10-30 |
| DE2403566A1 (de) | 1974-08-15 |
| FR2215723A1 (enExample) | 1974-08-23 |
| US3869702A (en) | 1975-03-04 |
| JPS5048872A (enExample) | 1975-05-01 |
| FR2215723B1 (enExample) | 1977-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1403801A (en) | Semiconductor device stud mount | |
| US4394679A (en) | Light emitting device with a continuous layer of copper covering the entire header | |
| US4894752A (en) | Lead frame for a semiconductor device | |
| GB1333848A (en) | Method of bonding metal bodies together by vibratory energy | |
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| US3304362A (en) | Glass-to-metal seals in electronic devices | |
| JP3187482B2 (ja) | パッケージ型半導体レーザ装置 | |
| IT1147903B (it) | Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura | |
| US5087962A (en) | Insulated lead frame using plasma sprayed dielectric | |
| GB2103420B (en) | Gold-plated package for semiconductor devices | |
| GB1339166A (en) | Capacitors | |
| GB1229381A (enExample) | ||
| GB1057687A (en) | Improvements in and relating to methods of manufacturing semiconductor devices | |
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| JPS57157550A (en) | Semiconductor device | |
| US3353073A (en) | Magnesium-aluminum alloy contacts for semiconductor devices | |
| JP2948382B2 (ja) | パッケージ型半導体レーザ装置 | |
| JPS6018985A (ja) | 発光装置 | |
| JPH05129712A (ja) | パツケージ型半導体レーザ装置 | |
| JPS63262858A (ja) | 半導体装置 | |
| KR850005175A (ko) | 수광 다이오우드와 그 제조방법 | |
| GB1139543A (en) | Construction of semiconductor junction diodes | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19930128 |