GB1389106A - Masking of workpieces - Google Patents

Masking of workpieces

Info

Publication number
GB1389106A
GB1389106A GB2561072A GB2561072A GB1389106A GB 1389106 A GB1389106 A GB 1389106A GB 2561072 A GB2561072 A GB 2561072A GB 2561072 A GB2561072 A GB 2561072A GB 1389106 A GB1389106 A GB 1389106A
Authority
GB
United Kingdom
Prior art keywords
base member
workpiece
assemblies
june
vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2561072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1389106A publication Critical patent/GB1389106A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials
    • H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/36—Photoelectric screens; Charge-storage screens
    • H01J29/39—Charge-storage screens
    • H01J29/45—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen
    • H01J29/451—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen with photosensitive junctions
    • H01J29/453—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen with photosensitive junctions provided with diode arrays
    • H01J29/455—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen with photosensitive junctions provided with diode arrays formed on a silicon substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/233—Manufacture of photoelectric screens or charge-storage screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Catalysts (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
GB2561072A 1971-06-07 1972-06-01 Masking of workpieces Expired GB1389106A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15034571A 1971-06-07 1971-06-07

Publications (1)

Publication Number Publication Date
GB1389106A true GB1389106A (en) 1975-04-03

Family

ID=22534114

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2561072A Expired GB1389106A (en) 1971-06-07 1972-06-01 Masking of workpieces

Country Status (7)

Country Link
US (3) US3701705A (cg-RX-API-DMAC7.html)
JP (1) JPS523795B1 (cg-RX-API-DMAC7.html)
CA (1) CA930654A (cg-RX-API-DMAC7.html)
DE (1) DE2226237C3 (cg-RX-API-DMAC7.html)
FR (1) FR2141205A5 (cg-RX-API-DMAC7.html)
GB (1) GB1389106A (cg-RX-API-DMAC7.html)
IT (1) IT959057B (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929551A (en) * 1974-07-11 1975-12-30 Buckbee Mears Co Sealing apparatus for continuous moving web
US3954940A (en) * 1974-11-04 1976-05-04 Mcdonnell Douglas Corporation Process for surface work strain relief of electrooptic crystals
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4064186A (en) * 1975-09-23 1977-12-20 Union Carbide Corporation Hydrogenation of styrene oxide to produce 2-phenylethanol
US4011144A (en) * 1975-12-22 1977-03-08 Western Electric Company Methods of forming metallization patterns on beam lead semiconductor devices
JPS5834449B2 (ja) * 1976-09-01 1983-07-27 東ソー株式会社 β−フエニルエチルアルコ−ルの製造法
US4085038A (en) * 1976-12-15 1978-04-18 Western Electric Co., Inc. Methods of and apparatus for sorting parts of a separated article
US4384919A (en) * 1978-11-13 1983-05-24 Sperry Corporation Method of making x-ray masks
US4222815A (en) * 1979-06-04 1980-09-16 The Babcock & Wilcox Company Isotropic etching of silicon strain gages
DE3028117C2 (de) * 1979-07-25 1984-05-10 Rca Corp., New York, N.Y. Verfahren zum Herstellen von Bildaufnahmevorrichtungen mit dünnem Substrat und Verwendung dieses Verfahrens
US4268374A (en) * 1979-08-09 1981-05-19 Bell Telephone Laboratories, Incorporated High capacity sputter-etching apparatus
US4585513A (en) * 1985-01-30 1986-04-29 Rca Corporation Method for removing glass support from semiconductor device
US4671850A (en) * 1985-08-16 1987-06-09 Micronix Corporation Mask using polyimide to support a patterned x-ray opaque layer
US5127984A (en) * 1991-05-02 1992-07-07 Avantek, Inc. Rapid wafer thinning process
DE4202194C2 (de) * 1992-01-28 1996-09-19 Fairchild Convac Gmbh Geraete Verfahren und Vorrichtung zum partiellen Entfernen von dünnen Schichten von einem Substrat
KR101232181B1 (ko) * 2010-02-03 2013-02-12 엘지디스플레이 주식회사 마스크 어셈블리

Also Published As

Publication number Publication date
FR2141205A5 (cg-RX-API-DMAC7.html) 1973-01-19
CA930654A (en) 1973-07-24
US3701705A (en) 1972-10-31
IT959057B (it) 1973-11-10
DE2226237A1 (de) 1973-01-04
US3841930A (en) 1974-10-15
DE2226237B2 (de) 1978-10-05
JPS487625A (cg-RX-API-DMAC7.html) 1973-01-31
DE2226237C3 (de) 1979-06-07
US3823048A (en) 1974-07-09
JPS523795B1 (cg-RX-API-DMAC7.html) 1977-01-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee