GB1385730A - Apparatus for diffusing dopants into semiconductor wafers - Google Patents

Apparatus for diffusing dopants into semiconductor wafers

Info

Publication number
GB1385730A
GB1385730A GB2730172A GB2730172A GB1385730A GB 1385730 A GB1385730 A GB 1385730A GB 2730172 A GB2730172 A GB 2730172A GB 2730172 A GB2730172 A GB 2730172A GB 1385730 A GB1385730 A GB 1385730A
Authority
GB
United Kingdom
Prior art keywords
fixture
wafers
grooves
base
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2730172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2133843A external-priority patent/DE2133843A1/de
Priority claimed from DE2133877A external-priority patent/DE2133877A1/de
Priority claimed from DE2133876A external-priority patent/DE2133876A1/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1385730A publication Critical patent/GB1385730A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB2730172A 1971-07-07 1972-06-12 Apparatus for diffusing dopants into semiconductor wafers Expired GB1385730A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2133843A DE2133843A1 (de) 1971-07-07 1971-07-07 Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben
DE2133877A DE2133877A1 (de) 1971-07-07 1971-07-07 Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben
DE2133876A DE2133876A1 (de) 1971-07-07 1971-07-07 Anordnung zum eindiffundieren von dotierstoffen

Publications (1)

Publication Number Publication Date
GB1385730A true GB1385730A (en) 1975-02-26

Family

ID=27183548

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2730172A Expired GB1385730A (en) 1971-07-07 1972-06-12 Apparatus for diffusing dopants into semiconductor wafers

Country Status (4)

Country Link
FR (1) FR2144678B1 (enrdf_load_stackoverflow)
GB (1) GB1385730A (enrdf_load_stackoverflow)
IT (1) IT962430B (enrdf_load_stackoverflow)
NL (1) NL7206014A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2159328A (en) * 1984-05-21 1985-11-27 Christopher Frank Mcconnell Vessel and apparatus for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US6136724A (en) * 1997-02-18 2000-10-24 Scp Global Technologies Multiple stage wet processing chamber
WO2002003428A3 (en) * 2000-06-30 2002-04-11 Integrated Materials Inc Silicon fixtures for supporting wafers during thermal processing and method of fabrication
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
WO2004095545A3 (en) * 2003-03-28 2005-05-12 Saint Gobain Ceramics Wafer carrier having improved processing characteristics
WO2016156607A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und plasma-behandlungsvorrichtung für wafer

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1502754A (en) * 1975-12-22 1978-03-01 Siemens Ag Heat-treatment of semi-conductor wafers
JPS5595321A (en) * 1979-01-12 1980-07-19 Matsushita Electric Ind Co Ltd Container of semiconductor substrate for liquid-phase epitaxial growth
FR2702088B1 (fr) * 1993-02-24 1995-05-24 Sgs Thomson Microelectronics Nacelle pour plaquettes de silicium.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2159328A (en) * 1984-05-21 1985-11-27 Christopher Frank Mcconnell Vessel and apparatus for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US6136724A (en) * 1997-02-18 2000-10-24 Scp Global Technologies Multiple stage wet processing chamber
WO2002003428A3 (en) * 2000-06-30 2002-04-11 Integrated Materials Inc Silicon fixtures for supporting wafers during thermal processing and method of fabrication
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
WO2004095545A3 (en) * 2003-03-28 2005-05-12 Saint Gobain Ceramics Wafer carrier having improved processing characteristics
WO2016156607A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und plasma-behandlungsvorrichtung für wafer

Also Published As

Publication number Publication date
FR2144678A1 (enrdf_load_stackoverflow) 1973-02-16
IT962430B (it) 1973-12-20
FR2144678B1 (enrdf_load_stackoverflow) 1975-08-29
NL7206014A (enrdf_load_stackoverflow) 1973-01-09

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee