GB1382883A - Laminated articles with conductive surfaces - Google Patents
Laminated articles with conductive surfacesInfo
- Publication number
- GB1382883A GB1382883A GB963072A GB963072A GB1382883A GB 1382883 A GB1382883 A GB 1382883A GB 963072 A GB963072 A GB 963072A GB 963072 A GB963072 A GB 963072A GB 1382883 A GB1382883 A GB 1382883A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- march
- nickel
- particles
- sheet material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 239000002245 particle Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229920001721 polyimide Polymers 0.000 abstract 2
- 229910000521 B alloy Inorganic materials 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 150000004985 diamines Chemical class 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 239000012704 polymeric precursor Substances 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11981371A | 1971-03-01 | 1971-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1382883A true GB1382883A (en) | 1975-02-05 |
Family
ID=22386560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB963072A Expired GB1382883A (en) | 1971-03-01 | 1972-03-01 | Laminated articles with conductive surfaces |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS4729889A (enrdf_load_stackoverflow) |
| CA (1) | CA989151A (enrdf_load_stackoverflow) |
| DE (1) | DE2209815A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2128376A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1382883A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615888A (zh) * | 2012-04-09 | 2012-08-01 | 昆山帆宏表面处理有限公司 | 电子产品外壳材料叠层结构及其制造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3175416D1 (en) * | 1980-09-15 | 1986-11-06 | Ciba Geigy Ag | Use of flexible materials in printed circuits |
| JPS59204295A (ja) * | 1983-04-29 | 1984-11-19 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属回路構造体 |
| FR2546704B1 (fr) * | 1983-05-27 | 1986-04-18 | Rhone Poulenc Sa | Substrats metallisables pour circuits imprimes et leur procede de preparation |
-
1972
- 1972-02-24 CA CA135,517A patent/CA989151A/en not_active Expired
- 1972-02-28 FR FR7206681A patent/FR2128376A1/fr not_active Withdrawn
- 1972-02-29 JP JP2029072A patent/JPS4729889A/ja active Pending
- 1972-03-01 GB GB963072A patent/GB1382883A/en not_active Expired
- 1972-03-01 DE DE19722209815 patent/DE2209815A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615888A (zh) * | 2012-04-09 | 2012-08-01 | 昆山帆宏表面处理有限公司 | 电子产品外壳材料叠层结构及其制造方法 |
| CN102615888B (zh) * | 2012-04-09 | 2015-07-15 | 昆山同寅兴业机电制造有限公司 | 电子产品外壳材料叠层结构及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4729889A (enrdf_load_stackoverflow) | 1972-11-07 |
| DE2209815A1 (de) | 1972-09-21 |
| CA989151A (en) | 1976-05-18 |
| FR2128376A1 (enrdf_load_stackoverflow) | 1972-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1482773A (en) | Printed circuit boards | |
| GB1458260A (en) | Composite foil | |
| GB1382883A (en) | Laminated articles with conductive surfaces | |
| JPS5829983U (ja) | 電磁気シ−ルド包装体 | |
| GB1022167A (en) | Process of laminating polytetraflucroethylene to metal and product | |
| GB1261483A (en) | A method of preparing laminated boards | |
| JPS6018340A (ja) | 導電性シ−ト及び導電性プラスチツク | |
| JPS63265494A (ja) | 多層配線板 | |
| JPS6453594A (en) | Flexible wiring board and manufacture thereof | |
| JPH0433389A (ja) | セラミック複合銅張積層板とその製造法 | |
| JPS6340215A (ja) | 電気用積層板 | |
| JPS6260640A (ja) | 金属と樹脂との積層体 | |
| GB1410456A (en) | Plated metal sheet | |
| JPS62132392A (ja) | 金属ベ−ス配線基板 | |
| JPS62108054A (ja) | 金属箔張積層板の製造方法 | |
| JPS6256134A (ja) | 金属箔張積層板 | |
| JPH03278587A (ja) | 金属ベース金属箔張り積層板 | |
| JPH02130146A (ja) | 電気用積層板 | |
| JPH06252549A (ja) | 接着剤被覆積層板の製造方法 | |
| JPH02130143A (ja) | 電気用積層板 | |
| JPS54126467A (en) | Lead frame for semiconductor device | |
| JPH03280490A (ja) | プリント配線板用基板の製造方法 | |
| JPH03215988A (ja) | アルミニウムベース配線基板 | |
| JPS6428992A (en) | Printed circuit board and manufacture thereof | |
| JPS58173648A (ja) | 金属ベ−ス積層板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |