GB1376785A - Method and apparatus for etching copper and copper alloys - Google Patents

Method and apparatus for etching copper and copper alloys

Info

Publication number
GB1376785A
GB1376785A GB925472A GB925472A GB1376785A GB 1376785 A GB1376785 A GB 1376785A GB 925472 A GB925472 A GB 925472A GB 925472 A GB925472 A GB 925472A GB 1376785 A GB1376785 A GB 1376785A
Authority
GB
United Kingdom
Prior art keywords
container
measurer
valve
controls
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB925472A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLMULLER H
Original Assignee
HOLLMULLER H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712110950 external-priority patent/DE2110950A1/de
Priority claimed from DE19712140215 external-priority patent/DE2140215C2/de
Priority claimed from CH102572A external-priority patent/CH587923A5/de
Application filed by HOLLMULLER H filed Critical HOLLMULLER H
Publication of GB1376785A publication Critical patent/GB1376785A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
GB925472A 1971-03-08 1972-02-29 Method and apparatus for etching copper and copper alloys Expired GB1376785A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712110950 DE2110950A1 (de) 1971-03-08 1971-03-08 Verfahren zum AEtzen von Kupfer- und Kupferlegierungen
DE19712140215 DE2140215C2 (de) 1971-08-11 1971-08-11 Verfahren und Anlage zum Regenerieren einer zum Ätzen von Kupfer- und Kupferlegierungen, insbesondere kupferkaschierten Leiterplatten, geeigneten Ätzlösung, sowie Meßeinrichtung dieser Anlage
CH102572A CH587923A5 (en) 1971-03-08 1972-01-21 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions

Publications (1)

Publication Number Publication Date
GB1376785A true GB1376785A (en) 1974-12-11

Family

ID=27172613

Family Applications (1)

Application Number Title Priority Date Filing Date
GB925472A Expired GB1376785A (en) 1971-03-08 1972-02-29 Method and apparatus for etching copper and copper alloys

Country Status (9)

Country Link
US (1) US3806393A (enrdf_load_stackoverflow)
JP (1) JPS5549154B1 (enrdf_load_stackoverflow)
AT (1) AT313671B (enrdf_load_stackoverflow)
BE (1) BE780292A (enrdf_load_stackoverflow)
CA (1) CA969843A (enrdf_load_stackoverflow)
FR (1) FR2128796B1 (enrdf_load_stackoverflow)
GB (1) GB1376785A (enrdf_load_stackoverflow)
IT (1) IT952925B (enrdf_load_stackoverflow)
NL (1) NL7202652A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3999564A (en) * 1976-01-09 1976-12-28 Pesek Engineering & Mfg. Co. Continuous etching and etched material recovery system
DE2917597A1 (de) * 1979-04-30 1980-11-13 Siemens Ag Verfahren zur regenerierung ammoniakalischer aetzloesungen zum aetzen von metallischem kupfer
DE3308849A1 (de) * 1983-03-12 1984-09-13 Didier Werke Ag Verfahren zur aufbereitung von metallhaltigen aetzloesungen und zur rueckgewinnung des metalls
EP0146732B1 (de) * 1983-11-08 1988-02-03 Holzer, Walter, Senator h.c. Dr.h.c.Ing. Arbeitsverfahren und Vorrichtung zur Ausübung des Verfahrens zur Abscheidung von z.B. Kupfer aus flüssigen Elektrolyten, der durch einen mehrzelligen Elektrolysebehälter geführt wird
DE3422276A1 (de) * 1984-06-15 1985-12-19 Walter Holzer Vorrichtung und arbeitsverfahren zum aetzen von leiterplatten
DE3345050A1 (de) * 1983-12-13 1985-06-20 Walter 7758 Meersburg Holzer Verfahren zum umweltfreundlichen aetzen von leiterplatten und vorrichtung zur ausuebung des arbeitsverfahrens
DE3936363A1 (de) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Verfahren zum aetzen von gegenstaenden sowie aetzanlage
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
CN102321908A (zh) * 2011-09-02 2012-01-18 广州市天承化工有限公司 酸性氯化物蚀刻液的循环再生工艺方法及金属铜回收系统

Also Published As

Publication number Publication date
FR2128796B1 (enrdf_load_stackoverflow) 1976-08-06
BE780292A (fr) 1972-07-03
FR2128796A1 (enrdf_load_stackoverflow) 1972-10-20
AT313671B (de) 1974-02-25
US3806393A (en) 1974-04-23
NL7202652A (enrdf_load_stackoverflow) 1972-09-12
IT952925B (it) 1973-07-30
JPS5549154B1 (enrdf_load_stackoverflow) 1980-12-10
CA969843A (en) 1975-06-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee