JPS5549154B1 - - Google Patents

Info

Publication number
JPS5549154B1
JPS5549154B1 JP2351172A JP2351172A JPS5549154B1 JP S5549154 B1 JPS5549154 B1 JP S5549154B1 JP 2351172 A JP2351172 A JP 2351172A JP 2351172 A JP2351172 A JP 2351172A JP S5549154 B1 JPS5549154 B1 JP S5549154B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2351172A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712110950 external-priority patent/DE2110950A1/de
Priority claimed from DE19712140215 external-priority patent/DE2140215C2/de
Priority claimed from CH102572A external-priority patent/CH587923A5/de
Application filed filed Critical
Publication of JPS5549154B1 publication Critical patent/JPS5549154B1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP2351172A 1971-03-08 1972-03-07 Pending JPS5549154B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712110950 DE2110950A1 (de) 1971-03-08 1971-03-08 Verfahren zum AEtzen von Kupfer- und Kupferlegierungen
DE19712140215 DE2140215C2 (de) 1971-08-11 1971-08-11 Verfahren und Anlage zum Regenerieren einer zum Ätzen von Kupfer- und Kupferlegierungen, insbesondere kupferkaschierten Leiterplatten, geeigneten Ätzlösung, sowie Meßeinrichtung dieser Anlage
CH102572A CH587923A5 (en) 1971-03-08 1972-01-21 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions

Publications (1)

Publication Number Publication Date
JPS5549154B1 true JPS5549154B1 (enrdf_load_stackoverflow) 1980-12-10

Family

ID=27172613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2351172A Pending JPS5549154B1 (enrdf_load_stackoverflow) 1971-03-08 1972-03-07

Country Status (9)

Country Link
US (1) US3806393A (enrdf_load_stackoverflow)
JP (1) JPS5549154B1 (enrdf_load_stackoverflow)
AT (1) AT313671B (enrdf_load_stackoverflow)
BE (1) BE780292A (enrdf_load_stackoverflow)
CA (1) CA969843A (enrdf_load_stackoverflow)
FR (1) FR2128796B1 (enrdf_load_stackoverflow)
GB (1) GB1376785A (enrdf_load_stackoverflow)
IT (1) IT952925B (enrdf_load_stackoverflow)
NL (1) NL7202652A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3999564A (en) * 1976-01-09 1976-12-28 Pesek Engineering & Mfg. Co. Continuous etching and etched material recovery system
DE2917597A1 (de) * 1979-04-30 1980-11-13 Siemens Ag Verfahren zur regenerierung ammoniakalischer aetzloesungen zum aetzen von metallischem kupfer
DE3308849A1 (de) * 1983-03-12 1984-09-13 Didier Werke Ag Verfahren zur aufbereitung von metallhaltigen aetzloesungen und zur rueckgewinnung des metalls
EP0146732B1 (de) * 1983-11-08 1988-02-03 Holzer, Walter, Senator h.c. Dr.h.c.Ing. Arbeitsverfahren und Vorrichtung zur Ausübung des Verfahrens zur Abscheidung von z.B. Kupfer aus flüssigen Elektrolyten, der durch einen mehrzelligen Elektrolysebehälter geführt wird
DE3422276A1 (de) * 1984-06-15 1985-12-19 Walter Holzer Vorrichtung und arbeitsverfahren zum aetzen von leiterplatten
DE3345050A1 (de) * 1983-12-13 1985-06-20 Walter 7758 Meersburg Holzer Verfahren zum umweltfreundlichen aetzen von leiterplatten und vorrichtung zur ausuebung des arbeitsverfahrens
DE3936363A1 (de) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Verfahren zum aetzen von gegenstaenden sowie aetzanlage
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
CN102321908A (zh) * 2011-09-02 2012-01-18 广州市天承化工有限公司 酸性氯化物蚀刻液的循环再生工艺方法及金属铜回收系统

Also Published As

Publication number Publication date
AT313671B (de) 1974-02-25
GB1376785A (en) 1974-12-11
CA969843A (en) 1975-06-24
US3806393A (en) 1974-04-23
IT952925B (it) 1973-07-30
FR2128796B1 (enrdf_load_stackoverflow) 1976-08-06
NL7202652A (enrdf_load_stackoverflow) 1972-09-12
BE780292A (fr) 1972-07-03
FR2128796A1 (enrdf_load_stackoverflow) 1972-10-20

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