CA969843A - Method and apparatus for etching copper and copper alloys - Google Patents

Method and apparatus for etching copper and copper alloys

Info

Publication number
CA969843A
CA969843A CA136,231A CA136231A CA969843A CA 969843 A CA969843 A CA 969843A CA 136231 A CA136231 A CA 136231A CA 969843 A CA969843 A CA 969843A
Authority
CA
Canada
Prior art keywords
copper
etching
alloys
copper alloys
etching copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA136,231A
Inventor
Rainer Haas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANS HALLMULLER MASCHINENBAU
Original Assignee
HANS HALLMULLER MASCHINENBAU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712110950 external-priority patent/DE2110950A1/en
Priority claimed from DE19712140215 external-priority patent/DE2140215C2/en
Priority claimed from CH102572A external-priority patent/CH587923A5/en
Application filed by HANS HALLMULLER MASCHINENBAU filed Critical HANS HALLMULLER MASCHINENBAU
Application granted granted Critical
Publication of CA969843A publication Critical patent/CA969843A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
CA136,231A 1971-03-08 1972-03-03 Method and apparatus for etching copper and copper alloys Expired CA969843A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712110950 DE2110950A1 (en) 1971-03-08 1971-03-08 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions
DE19712140215 DE2140215C2 (en) 1971-08-11 1971-08-11 Method and system for regenerating an etching solution suitable for etching copper and copper alloys, in particular copper-clad printed circuit boards, as well as measuring device of this system
CH102572A CH587923A5 (en) 1971-03-08 1972-01-21 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions

Publications (1)

Publication Number Publication Date
CA969843A true CA969843A (en) 1975-06-24

Family

ID=27172613

Family Applications (1)

Application Number Title Priority Date Filing Date
CA136,231A Expired CA969843A (en) 1971-03-08 1972-03-03 Method and apparatus for etching copper and copper alloys

Country Status (9)

Country Link
US (1) US3806393A (en)
JP (1) JPS5549154B1 (en)
AT (1) AT313671B (en)
BE (1) BE780292A (en)
CA (1) CA969843A (en)
FR (1) FR2128796B1 (en)
GB (1) GB1376785A (en)
IT (1) IT952925B (en)
NL (1) NL7202652A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3999564A (en) * 1976-01-09 1976-12-28 Pesek Engineering & Mfg. Co. Continuous etching and etched material recovery system
DE2917597A1 (en) * 1979-04-30 1980-11-13 Siemens Ag METHOD FOR REGENERATING AMMONIACAL ETCH SOLUTIONS FOR ETCHING METALLIC COPPER
DE3422276A1 (en) * 1984-06-15 1985-12-19 Walter Holzer Apparatus and procedure for etching printed circuit boards
EP0146732B1 (en) * 1983-11-08 1988-02-03 Holzer, Walter, Senator h.c. Dr.h.c.Ing. Process and apparatus for separating, for example, copper from a liquid electrolyte introduced into a pluricellular electrolyser
DE3345050A1 (en) * 1983-12-13 1985-06-20 Walter 7758 Meersburg Holzer METHOD FOR THE ENVIRONMENTALLY FRIENDLY ASSEMBLY OF CIRCUIT BOARDS AND DEVICE FOR EXERCISING THE WORKING METHOD
DE3936363A1 (en) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
CN102321908A (en) * 2011-09-02 2012-01-18 广州市天承化工有限公司 Recycling and regenerating process method and metal copper recovery system of acid chloride etching solution

Also Published As

Publication number Publication date
IT952925B (en) 1973-07-30
BE780292A (en) 1972-07-03
US3806393A (en) 1974-04-23
FR2128796B1 (en) 1976-08-06
NL7202652A (en) 1972-09-12
GB1376785A (en) 1974-12-11
AT313671B (en) 1974-02-25
FR2128796A1 (en) 1972-10-20
JPS5549154B1 (en) 1980-12-10

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