CA1269639A - Multi-cell electrolytic tank with inlet and outlet partitions - Google Patents
Multi-cell electrolytic tank with inlet and outlet partitionsInfo
- Publication number
- CA1269639A CA1269639A CA000469113A CA469113A CA1269639A CA 1269639 A CA1269639 A CA 1269639A CA 000469113 A CA000469113 A CA 000469113A CA 469113 A CA469113 A CA 469113A CA 1269639 A CA1269639 A CA 1269639A
- Authority
- CA
- Canada
- Prior art keywords
- outlet
- tank
- inlet
- partition
- liquid electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/06—Operating or servicing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
ABSTRACT
In electrolysis installations which possess in a common tank a plurality of anode and cathode plates electrically connected one behind the other, uniform supply to or flow through the individual cells is of greatest importance. According to the invention, the inflow, but also if possible the outflow, is placed below the liquid level, and a distributor pocket for uniform distribution of the liquid is connected between the inflow or outflow of the liquid and its entrance or exit from the electrolytic tank, respectively. For optimum adjustment of the chemical and physical constitution of the liquid, flow-independent measuring and adjusting of the liquid is achieved by a sensor which is arranged in a by-pass to the recycle line of the etching fluid between the etching tank and the electrolytic cell. An inlet partition of insulating material is positioned close to the tank inlet. An outlet partition is positioned close to the tank outlet in order to establish buffer containers.
In electrolysis installations which possess in a common tank a plurality of anode and cathode plates electrically connected one behind the other, uniform supply to or flow through the individual cells is of greatest importance. According to the invention, the inflow, but also if possible the outflow, is placed below the liquid level, and a distributor pocket for uniform distribution of the liquid is connected between the inflow or outflow of the liquid and its entrance or exit from the electrolytic tank, respectively. For optimum adjustment of the chemical and physical constitution of the liquid, flow-independent measuring and adjusting of the liquid is achieved by a sensor which is arranged in a by-pass to the recycle line of the etching fluid between the etching tank and the electrolytic cell. An inlet partition of insulating material is positioned close to the tank inlet. An outlet partition is positioned close to the tank outlet in order to establish buffer containers.
Description
3~
PRECIPITATION, PROCESS ~ND APPARATUS USING A MULl'I-CELL
.~
El.ECTROLYTIC TANK
The invention relates to a process for the precipita-tion of e.g. copper from a liquid electrolyte by passage of the liquid stream metered through an inlet into the multi-cell electrolytic tank, whence it exits from an outlet after precipitation of the copper.
The invention further relates to an appara-tus for the practice of this process.
In the older processes and apparatus, the liquid electrolyte was conducted through the multi-cell electrolytic tank in such a way that uniform precipitation on the electrodes did not occur. This irregular precipitation results if the liquid distribution in the tank is not absolutely uniform.
15. In electrolysis installations which possess in a common tank a plurality of anode and cathode plates connected electrically one behind the other, uniform supply /to/ and flow through the individual cells is of greatest importance.
Due to the uniform precipitation of e.g. copper from the liquid electrolyte on the electrodes, the precipitated copper can then immediately be used again in the etching process.
Here, therefore, it is a recycling process that is to be achieved, among other things.
In one of these known devices the sensor was located in the etching fluid, which is circulated continuously. Even if one places the sensor into stagnating areas of the etching tank, the measured result is still so imprecise that the purpose of the invention, namely to obtain an optimum etching rate, is not achieved. By immersion of circuit boards into the etching fluid, its physical and chemical composition ~ .
3~
changes. It has been ~ound that to get an optirnum etching rate, certain pararnete~s of the chemical and/or physical constltution of the etching fluid must exist.
In the present process ecophile etching is concerned, i.e. the etching fluid is circulated continuously. It is not exchanged, as in known processes, when it is used up, but is regenerated or is given additions which ensure that always an optimum etching rate exists.
The object of the invention is, therefore, to conduct the process so and to design the apparatus so that an absolutely uniform distribution of the liquid electrolyte over the electrodes takes place, the liquid electrolyte to be optimally adjusted with respect to its chemical properties.
The solution of the problem of the invention now consists in that -- proceeding from the known processes for the precipitation of e.g. copper from a liquid electrolyte by conduction of the liquid stream, metered through an inlet into the multi-cell electrolytic tank, whence it issues from an outlet after precipitation of the copper -- the liquid stream passes through a liquid receiver forming a controlled liquid stream before the inlet located under the liquid level of the electrolytic tank. For example, a liquid-buffer tank can be used to control the flow of electrolyte through the indlvidual cells of the electrolytic tank with uniform distribution.
Here an entirely new route is taken. Heretofore the liquid electrolyte was indeed allowed to flow into the electrolytic tank metered and as uniformly as possible in a free jet, and via a drain or overflow the liquid stream, from which e.g. copper had now been removed, left the tank again.
It turned out that on the electrodes a very uneven precipitation occurred~ or where the flow was especially strong, no precipitation at all took place.
PRECIPITATION, PROCESS ~ND APPARATUS USING A MULl'I-CELL
.~
El.ECTROLYTIC TANK
The invention relates to a process for the precipita-tion of e.g. copper from a liquid electrolyte by passage of the liquid stream metered through an inlet into the multi-cell electrolytic tank, whence it exits from an outlet after precipitation of the copper.
The invention further relates to an appara-tus for the practice of this process.
In the older processes and apparatus, the liquid electrolyte was conducted through the multi-cell electrolytic tank in such a way that uniform precipitation on the electrodes did not occur. This irregular precipitation results if the liquid distribution in the tank is not absolutely uniform.
15. In electrolysis installations which possess in a common tank a plurality of anode and cathode plates connected electrically one behind the other, uniform supply /to/ and flow through the individual cells is of greatest importance.
Due to the uniform precipitation of e.g. copper from the liquid electrolyte on the electrodes, the precipitated copper can then immediately be used again in the etching process.
Here, therefore, it is a recycling process that is to be achieved, among other things.
In one of these known devices the sensor was located in the etching fluid, which is circulated continuously. Even if one places the sensor into stagnating areas of the etching tank, the measured result is still so imprecise that the purpose of the invention, namely to obtain an optimum etching rate, is not achieved. By immersion of circuit boards into the etching fluid, its physical and chemical composition ~ .
3~
changes. It has been ~ound that to get an optirnum etching rate, certain pararnete~s of the chemical and/or physical constltution of the etching fluid must exist.
In the present process ecophile etching is concerned, i.e. the etching fluid is circulated continuously. It is not exchanged, as in known processes, when it is used up, but is regenerated or is given additions which ensure that always an optimum etching rate exists.
The object of the invention is, therefore, to conduct the process so and to design the apparatus so that an absolutely uniform distribution of the liquid electrolyte over the electrodes takes place, the liquid electrolyte to be optimally adjusted with respect to its chemical properties.
The solution of the problem of the invention now consists in that -- proceeding from the known processes for the precipitation of e.g. copper from a liquid electrolyte by conduction of the liquid stream, metered through an inlet into the multi-cell electrolytic tank, whence it issues from an outlet after precipitation of the copper -- the liquid stream passes through a liquid receiver forming a controlled liquid stream before the inlet located under the liquid level of the electrolytic tank. For example, a liquid-buffer tank can be used to control the flow of electrolyte through the indlvidual cells of the electrolytic tank with uniform distribution.
Here an entirely new route is taken. Heretofore the liquid electrolyte was indeed allowed to flow into the electrolytic tank metered and as uniformly as possible in a free jet, and via a drain or overflow the liquid stream, from which e.g. copper had now been removed, left the tank again.
It turned out that on the electrodes a very uneven precipitation occurred~ or where the flow was especially strong, no precipitation at all took place.
- 2 -With the new process the llquid elect~olyte no longer flows freely lnto the tank. It gets into the tank only via a liquid receive~. The velocit~ of the liquid stream bet~een the inle~ and the outle-t is very low. The admission oF the liquid stream on the inlet side is uniforrn and the discharge of the stream is also uniform in order -to fully use the area of the anode and cathode plates -- and thereby achieve a uniform precipitation.
The solution of the problem, namely to achieve an accuratet i.e. flow-independent measurement and adjustment of the etching fluid by a sensor, is effected in that the sensor is arranged in a by-pass to the cycle line of the etching fluid between etching tank and electrolytic cell, which is connected at adjustable intervals of time with the cycle line, e.g. via a valve, and the switching phase of the sensor takes place with the valve closed, i.e. in the by-pass during repose of the etching Fluid.
Here an entirely new method is employed. Measuring is no longer done continuously, as is customary in such processes, but intermittently. The intervals of time result by taking from the liquid a sample, transferring it into a measuring vessel and then measuring this liquid very accurately in the static state, independent of flow. As a function of this measured result the etching fluid is then regenerated or modified until an optimum etching speed exists.
A realization according to the invention consists in that the sensor is a float known in itself, with inductive or capacitive tap.
Further the sensor is appropriately contained in an overflow vessel disposed in the by-pass line.
This overflow vessel assures that the quan-tity of sample liquid remains always exactly constant.
Appropriately the valve is arranged in the inflow to the overflow vessel.
For automatic operation, the valve may be an electromagnetic valve whose open and closed position is program-controlled.
In a preFerred realization, in which the copper content in the etching fluid is adjusted to a certain amount, it is important that -the sensor adjusts the current supply of the electrolytic cell, e.g. via an amplifier.
The electrolytic cell is used for copper precipita-tion, and depending on an adjusted value one is -then in a p~sition to assign to the etching fluid a certain specific gravity according to a specific copper content.
Another possibility is that the sensor regulates the liquid supply to the electrolytic cell, e.g. via a valve and an amplifier.
If not only the copper content is to be adjus-ted by a switchable electrolytic cell, but if other parameters are selected which are to be adjusted to achieve an optimum etching rate, there results a process for etching circuit boards by continuously monitoring the etching fluid in its tank; the teaching of the invention then consists in that the etching fluid is intermittently replenished by additions -depending on the number of etching operations ~ until an optimum etching rate is obtained. This is possible as a sensor monitors the state of the etching fluid in a control vessel which is filled at selected intervals of time, and as the measuring phase of the sensor is shifted to the static phase of the measured liquid in the control vessel.
A preferred device which solves the problem of obtaining a uniform distribution of the liquid electrolyte includes a liquid-buffer tank formed by a partition within the tank and generally parallel to the inlet side of the electrolytic tank. The partition defines a flow path to the 1i39 tank to provide a uniforrn distribution of electrolyte therethroughou-t.
This device is suitable for use wl-th -top or bottorn inlets.
One possibility consists in that the inflow into -the liquid-buffer tank occurs from below under hydrostatic pressure.
By using a buffer tank, therefore, it is here achieved that under hydraulic pressure, a very uniforrn distribution takes place.
The design of the buffer tank or of the dividing walls may vary. ûne possibility is that the upper edge of the partition extends above the liquid level of the electrolytic tank and the inlet openings in the partition are arranged below the liquid level.
Depending on the size of the electrolytic tank and the type of liquid electrolyte, the inlet openings may be arranged approximately at mid-height of the liquid level so that they introduce the liquid stream evenly between the electrodes.
A plurality of inlet openings may be combined to form one slit. In another arrangement several partitions form a siphon type receiver.
The outlet side also has one or more partitions and the discharge below the liquid level through individual openings and/or slits occurs in a similar manner as at the inlet.
A variety of designs on the inlet side can be combined with designs on the outlet side. For example, on the inlet side one might use two dividing walls and on the outlet side only one dividing wall, or the same type of distribution device for the liquid stream at the inlet side and outlet side. The inlet openings in the partitions or dividing walls on the inlet side rnay be arranged at the top, but still bel~w the liquid level, while on the outlet side openings are located far-ther down. In thls rnar,ner, tne li4Uid goes in and out of the electrolytic tank through openinys, slits, overflow edges or the li~e, w~lich are located ~elow the liquid level.
Preferred embodiments of the invention are shown in ` the drawings, wherein:
o Figure 1 is a plan view of an electrolytic tank showing the flow pattern;
Figure 2 is a side view illustrating the electrolytic tank provided with a partition;
Figure 3 is a partial perspective view of a second lS embodiment of the partition;
Figure 4 is a partial perspective of a thir~
embodiment of the partition;
Figure 5 is a side view illustrating an etching tank with an electrolytic cell and measuring device; and Figure 6 is an enlarged side view illus~rating the mesuring device of the etching tank.
In Figure 1, the arrow direction 1 shows the liquid stream of the liquid electrolyte through the electrolytic tank
The solution of the problem, namely to achieve an accuratet i.e. flow-independent measurement and adjustment of the etching fluid by a sensor, is effected in that the sensor is arranged in a by-pass to the cycle line of the etching fluid between etching tank and electrolytic cell, which is connected at adjustable intervals of time with the cycle line, e.g. via a valve, and the switching phase of the sensor takes place with the valve closed, i.e. in the by-pass during repose of the etching Fluid.
Here an entirely new method is employed. Measuring is no longer done continuously, as is customary in such processes, but intermittently. The intervals of time result by taking from the liquid a sample, transferring it into a measuring vessel and then measuring this liquid very accurately in the static state, independent of flow. As a function of this measured result the etching fluid is then regenerated or modified until an optimum etching speed exists.
A realization according to the invention consists in that the sensor is a float known in itself, with inductive or capacitive tap.
Further the sensor is appropriately contained in an overflow vessel disposed in the by-pass line.
This overflow vessel assures that the quan-tity of sample liquid remains always exactly constant.
Appropriately the valve is arranged in the inflow to the overflow vessel.
For automatic operation, the valve may be an electromagnetic valve whose open and closed position is program-controlled.
In a preFerred realization, in which the copper content in the etching fluid is adjusted to a certain amount, it is important that -the sensor adjusts the current supply of the electrolytic cell, e.g. via an amplifier.
The electrolytic cell is used for copper precipita-tion, and depending on an adjusted value one is -then in a p~sition to assign to the etching fluid a certain specific gravity according to a specific copper content.
Another possibility is that the sensor regulates the liquid supply to the electrolytic cell, e.g. via a valve and an amplifier.
If not only the copper content is to be adjus-ted by a switchable electrolytic cell, but if other parameters are selected which are to be adjusted to achieve an optimum etching rate, there results a process for etching circuit boards by continuously monitoring the etching fluid in its tank; the teaching of the invention then consists in that the etching fluid is intermittently replenished by additions -depending on the number of etching operations ~ until an optimum etching rate is obtained. This is possible as a sensor monitors the state of the etching fluid in a control vessel which is filled at selected intervals of time, and as the measuring phase of the sensor is shifted to the static phase of the measured liquid in the control vessel.
A preferred device which solves the problem of obtaining a uniform distribution of the liquid electrolyte includes a liquid-buffer tank formed by a partition within the tank and generally parallel to the inlet side of the electrolytic tank. The partition defines a flow path to the 1i39 tank to provide a uniforrn distribution of electrolyte therethroughou-t.
This device is suitable for use wl-th -top or bottorn inlets.
One possibility consists in that the inflow into -the liquid-buffer tank occurs from below under hydrostatic pressure.
By using a buffer tank, therefore, it is here achieved that under hydraulic pressure, a very uniforrn distribution takes place.
The design of the buffer tank or of the dividing walls may vary. ûne possibility is that the upper edge of the partition extends above the liquid level of the electrolytic tank and the inlet openings in the partition are arranged below the liquid level.
Depending on the size of the electrolytic tank and the type of liquid electrolyte, the inlet openings may be arranged approximately at mid-height of the liquid level so that they introduce the liquid stream evenly between the electrodes.
A plurality of inlet openings may be combined to form one slit. In another arrangement several partitions form a siphon type receiver.
The outlet side also has one or more partitions and the discharge below the liquid level through individual openings and/or slits occurs in a similar manner as at the inlet.
A variety of designs on the inlet side can be combined with designs on the outlet side. For example, on the inlet side one might use two dividing walls and on the outlet side only one dividing wall, or the same type of distribution device for the liquid stream at the inlet side and outlet side. The inlet openings in the partitions or dividing walls on the inlet side rnay be arranged at the top, but still bel~w the liquid level, while on the outlet side openings are located far-ther down. In thls rnar,ner, tne li4Uid goes in and out of the electrolytic tank through openinys, slits, overflow edges or the li~e, w~lich are located ~elow the liquid level.
Preferred embodiments of the invention are shown in ` the drawings, wherein:
o Figure 1 is a plan view of an electrolytic tank showing the flow pattern;
Figure 2 is a side view illustrating the electrolytic tank provided with a partition;
Figure 3 is a partial perspective view of a second lS embodiment of the partition;
Figure 4 is a partial perspective of a thir~
embodiment of the partition;
Figure 5 is a side view illustrating an etching tank with an electrolytic cell and measuring device; and Figure 6 is an enlarged side view illus~rating the mesuring device of the etching tank.
In Figure 1, the arrow direction 1 shows the liquid stream of the liquid electrolyte through the electrolytic tank
3 The liquid stream enters on the inlet side 6 and leaves the tank on the outlet side 18. Electrodes 16 are connected one behind the other as anodes and cathodes. In this connection the uniform supply to and flow through the individual cells is of greatest importance.
According to the invention, in Fig. 2 e.g. the liquid stream is charged in arrow direction 1 from above through a feed 14. In this case a preceding preconnected buffer tank 13 must be present, through which the liquid stream flows in ,_ - 6 -~~
arrow direction 24 by passing through a thruway in partition 17 defined by openings 17a near the bottorn of the partition. It then enters the liqui~-buffer tank 5~ sweeping the partition 17, from below. The liquid-buffer tank is limited by a partition 7, whose lateral edges lû, 11, as shown in Fig. 3, ano the lower edge 9 are connected liquidproof with tank 3, so as to form a dividing wall. In this par-tition 7 inlet openings 4 are arranged. These inlet openings may be arranged either at the top, in the center, or distributed in any manner. If desired, 1~ tests will be made to determine how the most uniform admission of the individual plates is achieved during the precipitation.
The only essential point is that the inlet openings are located always below the liquid level. Then the electrolyte is conducted in arrow direction 25 through the individual cells in such a way that the individual electrodes 16 experience a uniform distribution of the liquid stream. In Fig. 2 the upper edge 15 of partition 7 is above the liquid level 2, but the inlet openings or slits 4 will be below the liquid level 2. It is possible also that the upper edge 8 of partition 7 lies below the liquid level 2 and the partition then has no inlet openings. The supplied liquid stream will then flow below the liquid level 2 in arrow direction 26 over this edge 8.
It is indicated schematically in Figure 2 that instead of the upper inflow or upper feed 14 a lower inflow 12 may be provided. In that case the preceding buffer tank 13 would be omitted.
In Fig. 4 it is illustrated once more perspectively how e.g. inlet openings 4 under the liquid level 2 may be arranged in the upper region inside the partition 7.
In Fig. 2 the outlet side 18 may be designed in the same manner as the inlet side. In the embodiment, to achieve regulation of the liquid level 2, drains 21 are arranged in a partition 2û. These drains may again be circular, slit type, , ` 1~
r I or adapted to the flow in some other way. In the embodirnent, t the liquid flow arrlving in arrow directlon 25 then passes in I arrow direction 27 into the buffer tank 28 on the outlet ¦ side, which may be designed analogously to the buffer -tank 5 ¦ 5 on the inlet side. An additional partition 19, which is arranged at the distance 29 from the bottom of tank 3, then permits the draining liquid to enter the aF-ter-connected tank 23 in arrow direction 30. There an overflow 22 automatically maintains level 2 constant.
qlthough the embodiment described in the following is applicable also to an arrangement according to Figures 1 to 4, for better comprehension the organization of the measuring device is described in a modified embodiment.
~ In Figure 5, according to a further embodiment, t 15 circuit boards are illustrated schematically, which are immersed by immersion in arrow direction 43 into the etching tank 32 in a manner known in itself for the production of electric circuits. The etching tank 32 is coupled with an electrolytic cell 33. A sensor 34 is arranged in the by-pass 36 of a recycle line 37. A valve 38 regulates the inflow to an overflow vessel 40. Further details are shown in Figure 6 where a float 35 is located in flow control vessel 40 and is actuated by a program control 42. In the embodiment the float has an inductive tap 39 known in itself, i.e. the measuring arrangement switches on or off via its contact terminals 44 when the contact 39 attached to float 35, e.g. a reed contact, gets out of the magnetic field of the exciter coils 45 in the stationary part~
The mode of operation is then the following:
The etching fluid 46 is drawn by pump 48 in arrow direction 47 and thus gets into the cycle line 37. In the embodiment of Figure 5 the cycle line contains further a water jet pump 49, which draws partial quanti-ties of 3~
regenera~ed ~tching fluid out of the electrolytic cell ~3 in arrow direc~ion 50. The purnp -then conveys the partially regenerated etching fluid fur-ther in arrow direction 51 back into the etching tank 32. The feed to the electrolytic cell 33 occurs via a branch 52 when valve 53 is open. Valve 38 is opened at intervals of time, e.g. by a program control 4~.
Thereby a sample quantity is taken from the etching fluid present in the cycle line 47 and is passed in arrow direction 54 (cf. ~ig. 6) into an overflow vessel 40. The overflow 55 in this vessel sees to it that the quantity to be measured in the measuring tank 56 remains the same. If this measuring tanl< 56 is full 9 the excess sample quantity runs in arrow direction 57 back into the etching tank 32.
Depending on the measurement result, float 35 now moves in arrow direction 58, so that the contacts 54 e.g.
turn off the current supply of the electrolytic cell when the copper content in the etching fluid becomes too high, or turn it on again when it becomes too low.
Additionally or separately further valves 59, 60 may be switched, which via lines 61, 62 feed additions into the etching tank 32. Depending on the type of etching fluid and/or the materials of the circuit boards, known additives may be used for bringing the etching rate to an optimum.
Although various preferred embodiments of the present invention have been described herein in detail, it will be appreciated by those skilled in the art, that variations may be made thereto without departing from the spirit of the invention or the scope of the appended claims.
_ 9 _
According to the invention, in Fig. 2 e.g. the liquid stream is charged in arrow direction 1 from above through a feed 14. In this case a preceding preconnected buffer tank 13 must be present, through which the liquid stream flows in ,_ - 6 -~~
arrow direction 24 by passing through a thruway in partition 17 defined by openings 17a near the bottorn of the partition. It then enters the liqui~-buffer tank 5~ sweeping the partition 17, from below. The liquid-buffer tank is limited by a partition 7, whose lateral edges lû, 11, as shown in Fig. 3, ano the lower edge 9 are connected liquidproof with tank 3, so as to form a dividing wall. In this par-tition 7 inlet openings 4 are arranged. These inlet openings may be arranged either at the top, in the center, or distributed in any manner. If desired, 1~ tests will be made to determine how the most uniform admission of the individual plates is achieved during the precipitation.
The only essential point is that the inlet openings are located always below the liquid level. Then the electrolyte is conducted in arrow direction 25 through the individual cells in such a way that the individual electrodes 16 experience a uniform distribution of the liquid stream. In Fig. 2 the upper edge 15 of partition 7 is above the liquid level 2, but the inlet openings or slits 4 will be below the liquid level 2. It is possible also that the upper edge 8 of partition 7 lies below the liquid level 2 and the partition then has no inlet openings. The supplied liquid stream will then flow below the liquid level 2 in arrow direction 26 over this edge 8.
It is indicated schematically in Figure 2 that instead of the upper inflow or upper feed 14 a lower inflow 12 may be provided. In that case the preceding buffer tank 13 would be omitted.
In Fig. 4 it is illustrated once more perspectively how e.g. inlet openings 4 under the liquid level 2 may be arranged in the upper region inside the partition 7.
In Fig. 2 the outlet side 18 may be designed in the same manner as the inlet side. In the embodiment, to achieve regulation of the liquid level 2, drains 21 are arranged in a partition 2û. These drains may again be circular, slit type, , ` 1~
r I or adapted to the flow in some other way. In the embodirnent, t the liquid flow arrlving in arrow directlon 25 then passes in I arrow direction 27 into the buffer tank 28 on the outlet ¦ side, which may be designed analogously to the buffer -tank 5 ¦ 5 on the inlet side. An additional partition 19, which is arranged at the distance 29 from the bottom of tank 3, then permits the draining liquid to enter the aF-ter-connected tank 23 in arrow direction 30. There an overflow 22 automatically maintains level 2 constant.
qlthough the embodiment described in the following is applicable also to an arrangement according to Figures 1 to 4, for better comprehension the organization of the measuring device is described in a modified embodiment.
~ In Figure 5, according to a further embodiment, t 15 circuit boards are illustrated schematically, which are immersed by immersion in arrow direction 43 into the etching tank 32 in a manner known in itself for the production of electric circuits. The etching tank 32 is coupled with an electrolytic cell 33. A sensor 34 is arranged in the by-pass 36 of a recycle line 37. A valve 38 regulates the inflow to an overflow vessel 40. Further details are shown in Figure 6 where a float 35 is located in flow control vessel 40 and is actuated by a program control 42. In the embodiment the float has an inductive tap 39 known in itself, i.e. the measuring arrangement switches on or off via its contact terminals 44 when the contact 39 attached to float 35, e.g. a reed contact, gets out of the magnetic field of the exciter coils 45 in the stationary part~
The mode of operation is then the following:
The etching fluid 46 is drawn by pump 48 in arrow direction 47 and thus gets into the cycle line 37. In the embodiment of Figure 5 the cycle line contains further a water jet pump 49, which draws partial quanti-ties of 3~
regenera~ed ~tching fluid out of the electrolytic cell ~3 in arrow direc~ion 50. The purnp -then conveys the partially regenerated etching fluid fur-ther in arrow direction 51 back into the etching tank 32. The feed to the electrolytic cell 33 occurs via a branch 52 when valve 53 is open. Valve 38 is opened at intervals of time, e.g. by a program control 4~.
Thereby a sample quantity is taken from the etching fluid present in the cycle line 47 and is passed in arrow direction 54 (cf. ~ig. 6) into an overflow vessel 40. The overflow 55 in this vessel sees to it that the quantity to be measured in the measuring tank 56 remains the same. If this measuring tanl< 56 is full 9 the excess sample quantity runs in arrow direction 57 back into the etching tank 32.
Depending on the measurement result, float 35 now moves in arrow direction 58, so that the contacts 54 e.g.
turn off the current supply of the electrolytic cell when the copper content in the etching fluid becomes too high, or turn it on again when it becomes too low.
Additionally or separately further valves 59, 60 may be switched, which via lines 61, 62 feed additions into the etching tank 32. Depending on the type of etching fluid and/or the materials of the circuit boards, known additives may be used for bringing the etching rate to an optimum.
Although various preferred embodiments of the present invention have been described herein in detail, it will be appreciated by those skilled in the art, that variations may be made thereto without departing from the spirit of the invention or the scope of the appended claims.
_ 9 _
Claims (10)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An apparatus to precipitate a metal element from a liquid electrolyte comprising:
a) an electrolytic tank containing liquid electrolyte and having lateral walls and an inlet side with an inlet opening, and an outlet side with an outlet opening submerged in said liquid electrolyte;
b) at least one inlet partition of insulating material positioned close to said inlet side of said electrolyte tank and having a lower edge and two lateral edges forming a waterproof wall with an inside surface of said lateral walls of said electrolytic tank defining a liquid buffer container at the inlet side of said electrolytic tank, and at least one opening in said partition defining a thruway associated with said partition submerged in said liquid electrolyte, said partition controlling the speed of said liquid electrolyte as it travels in a path from said inlet side to said outlet side of said tank;
c) at least one outlet partition of an insulating material and of a number equal to a number of said inlet partitions positioned parallel to and adjacent said outlet side of said electrolytic tank defining an outlet buffer container for controlling the outflow of said liquid electrolyte from said electrolytic tank, at least one opening in said partition defining an outlet thruway submerged in said liquid electrolyte joining said outlet buffer container and said tank; and d) at least one anode and one cathode disposed within said tank intermediate said inlet buffer tank and said outlet buffer tank.
a) an electrolytic tank containing liquid electrolyte and having lateral walls and an inlet side with an inlet opening, and an outlet side with an outlet opening submerged in said liquid electrolyte;
b) at least one inlet partition of insulating material positioned close to said inlet side of said electrolyte tank and having a lower edge and two lateral edges forming a waterproof wall with an inside surface of said lateral walls of said electrolytic tank defining a liquid buffer container at the inlet side of said electrolytic tank, and at least one opening in said partition defining a thruway associated with said partition submerged in said liquid electrolyte, said partition controlling the speed of said liquid electrolyte as it travels in a path from said inlet side to said outlet side of said tank;
c) at least one outlet partition of an insulating material and of a number equal to a number of said inlet partitions positioned parallel to and adjacent said outlet side of said electrolytic tank defining an outlet buffer container for controlling the outflow of said liquid electrolyte from said electrolytic tank, at least one opening in said partition defining an outlet thruway submerged in said liquid electrolyte joining said outlet buffer container and said tank; and d) at least one anode and one cathode disposed within said tank intermediate said inlet buffer tank and said outlet buffer tank.
2. An apparatus according to claim 1, wherein said inlet and outlet thruways of said inlet and outlet partitions are a plurality of openings disposed in said inlet and outlet partitions and positioned to facilitate the uniform flow of the liquid electrolyte through the electrolytic tank.
3. An apparatus according to claim 1, wherein said inlet thruways are defined between a top edge of one of said inlet partitions and the surface of the electrolyte.
4. An apparatus according to claim 2, wherein said at least one inlet paritition comprises first and second inlet partitions arranged in parallel, the inlet side and said second partition cooperating to define a preconnected buffer container receiving a charged stream of said liquid electrolyte from a supply unit, and an entrance channel formed between the bottom edge of said second partition and said electrolytic tank to facilitate movement of said charged stream of liquid electrolyte from said preconnected buffer container to said liquid buffer container.
5. An apparatus according to claim 4, wherein said at least one outlet partition comprises first and second outlet partitions arranged in parallel to define a buffer container between said first outlet partition and said second outlet partition, and an after-connected container between said second outlet partition and said outlet side of said electrolytic tank, said second outlet partition forming a channel between a bottom edge of said second outlet partition and the bottom side of the electrolytic tank facilitating the uniform movement of the liquid electrolyte from said outlet buffer container to said after-connected buffer container.
6. An apparatus according to claim 1, wherein said outlet side of said electrolytic tank comprises an overflow drain insuring a constant level of said liquid electrolyte in said electrolytic tank.
7. An apparatus according to claim 1, further comprising means for detecting a specific level of the metal element in the liquid electrolyte.
8. An apparatus according to claim 7, wherein said means for detecting said specific level of said metal element comprises a recycle line connecting said electrolytic tank to an etching tank in a manner permitting the liquid electrolyte to flow between said tanks, a sensor positioned on said recycle line between said electrolytic tank and said etching tank and measuring a specific amount of the liquid electrolyte, a valve positioned at a bypass on said recycle line and regulating the amount of the liquid electrolyte flowing through said recycle line to said sensor, and a pump conveying the liquid electrolyte through said recycle line.
9. An apparatus according to claim 8, wherein said sensor comprises a float located in an overflow vessel on said recycle line, said float having inductive contact tabs encompassed in a pair of contact terminals positioned at a bottom end of said float.
10. An apparatus according to claim 8, wherein said valve is electromagnetic and is regulated between an open and closed position at regular time intervals by a controlled program as said float moves through a magnetic field of said contact terminals.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843422276 DE3422276A1 (en) | 1984-06-15 | 1984-06-15 | Apparatus and procedure for etching printed circuit boards |
| DEP3422276.6 | 1984-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1269639A true CA1269639A (en) | 1990-05-29 |
Family
ID=6238450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000469113A Expired CA1269639A (en) | 1984-06-15 | 1984-11-30 | Multi-cell electrolytic tank with inlet and outlet partitions |
Country Status (2)
| Country | Link |
|---|---|
| CA (1) | CA1269639A (en) |
| DE (1) | DE3422276A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2008766B2 (en) * | 1970-02-23 | 1971-07-29 | Licentia Patent Verwaltungs GmbH, 6000 Frankfurt | Regenerating cupric chloride etching - solution enriched with cuprous chloride |
| AT313671B (en) * | 1971-03-08 | 1974-02-25 | Hoellmueller Maschbau H | Process for regenerating etching solutions for copper and copper alloys, regeneration system for carrying out this process and measuring and control device for this regeneration system |
| FI58698C (en) * | 1974-08-05 | 1981-03-10 | Mitsui Mining & Smelting Co | SYSTEM FOR AUTOMATIC AND CONTAINER MAINTENANCE OF ZINK AND OVER SWEEPER CONSTRUCTION AND CIRCULATION |
| US3999564A (en) * | 1976-01-09 | 1976-12-28 | Pesek Engineering & Mfg. Co. | Continuous etching and etched material recovery system |
-
1984
- 1984-06-15 DE DE19843422276 patent/DE3422276A1/en active Granted
- 1984-11-30 CA CA000469113A patent/CA1269639A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3422276C2 (en) | 1992-07-16 |
| DE3422276A1 (en) | 1985-12-19 |
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