JPH0317292A - Aluminum electroplating apparatus with molten salt bath - Google Patents
Aluminum electroplating apparatus with molten salt bathInfo
- Publication number
- JPH0317292A JPH0317292A JP15073689A JP15073689A JPH0317292A JP H0317292 A JPH0317292 A JP H0317292A JP 15073689 A JP15073689 A JP 15073689A JP 15073689 A JP15073689 A JP 15073689A JP H0317292 A JPH0317292 A JP H0317292A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- strip
- molten salt
- salt bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000003839 salts Chemical class 0.000 title claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 title claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 15
- 238000009713 electroplating Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 89
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910001182 Mo alloy Inorganic materials 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 47
- 239000007788 liquid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- -1 aluminum halide Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 241000287828 Gallus gallus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
《産業上の利用分野）
本発明は、低温溶融塩浴によるＭＬａアルミニウムめっ
き′ｆ１置に関する．
（従米 Ｉ支術 ）
ストリップの電気アルミニウムめっき方法には有磯溶削
めっき浴を用いる方法と溶融塩浴を用いる方法とがある
が、近隼、後者のめっき方法で常温でも液体となる共晶
化合物を用いな低温溶融塩浴が作業性、安全性などの見
地から注目されている．例えば、アルミニウムハロデン
化物と（ノ、トリ）アルキルビリノニウムハロデン化物
またはイミダゾリウムハロデン化物とを混合溶融してな
る溶融塩浴などはその例である。DETAILED DESCRIPTION OF THE INVENTION <<Industrial Application Field> The present invention relates to MLa aluminum plating using a low temperature molten salt bath. (Jumei I Branch) There are two methods for electrolytic aluminum plating of strips: one using Ariiso hot-cut plating bath and the other using molten salt bath. Low-temperature molten salt baths using compounds are attracting attention from the viewpoint of workability and safety. For example, a molten salt bath formed by mixing and melting an aluminum halide and a (tri)alkylvinonium halide or an imidazolium halide is an example.
この方法で広幅のストリップを連続めっきする場合は、
従来より水溶液めっき浴による方法で一般的に使用して
いるめっき装置のようにストリ・冫プをめっき浴に浸漬
して、浴を攪件しながらストリンブを移送して電解する
装置によっていた。When continuously plating wide strips using this method,
Conventionally, plating apparatuses commonly used for methods using aqueous solution plating baths have used apparatuses in which strips and drops are immersed in a plating bath, and the strips are transferred and electrolyzed while stirring the bath.
（発明が解決しようとする問題点）
しかしながら、溶融塩浴による場合は、めっき液の粘性
が水溶液めっき浴に比べて高いため、攬件を強くしても
ストリップ表面に発生した反応〃入が除去されず、また
、金属イオンの供給も不十分なため、ｌｔ流密度を高く
しても＋１２ｉ速めつきできないという問題があった．
本発明は、これらの問題を解消した溶融塩浴による電気
アルミニウムめっき装置を提供するものである．
（ｉｆ！Ｈ！ｆｆ点を解決するための手段）本発明は、
上記問題をストリップのパスライン上下に陽極板を平行
に近接させて配置して、ストリップを通板した場合、ス
トリップと陽極板との間に形威される隙間にめっき液を
噴出させてめっ８浴にすることにより解消した。(Problem to be solved by the invention) However, when using a molten salt bath, the viscosity of the plating solution is higher than that of an aqueous solution plating bath, so even if the conditions are strong, the reaction generated on the strip surface is removed. Furthermore, since the supply of metal ions was insufficient, there was a problem that even if the lt flow density was increased, it was not possible to plate at +12i speed. The present invention provides an electrolytic aluminum plating apparatus using a molten salt bath that solves these problems. (Means for solving the if!H!ff point) The present invention
To solve the above problem, if the anode plates are placed close to each other in parallel above and below the pass line of the strip and the strip is passed through the strip, the plating solution will be ejected into the gap formed between the strip and the anode plate. The problem was resolved by using 8 baths.
すなわち、本発明は、ガス４人口を有する密閉型室両側
にストリップの入口と出口とを設けて、これらの出入口
でもって設定するストリ・ノブのパスライン上下に陽極
板をパスラインと平行に近接配置して、各Ｍｈ極板とパ
スラインとの間のストリップ出側に噴出口をストリップ
入側方向に向けためっ８液噴出管を挿入するとともに、
下側陽極板の下方にめっき液貯溜槽を配置して、この貯
溜槽と前記めっきｗ１．噴出管とを循環パイプで接続し
、また、下測ＰＩ極板と貯Ｍ槽との間に流下口が貯溜槽
に接続されためっき液受けを配置し、さらに、外周をパ
スラインと接触させることができる位置に通電ロールを
配置することに上り電気アルミニウムめっき装置を構處
した．
（作用）
この電気７ノレミニウムめっき装置は、ストリンプを通
板すると、ストリップと陽極板との間に隙間が形戊され
、その隙間のストリップ出側にめっき液噴出管を配置し
てあるので、噴出管よりめっき液を噴射すると、めっき
液が充たされ、めっき浴となる．また、通７４ローノレ
は、ストリンブのパスラインと接触させることのできる
位置に配置してあるので、ストリップ通板後ストリップ
と接触させて、これを陰極にすれば電解を行うことがで
きる。That is, in the present invention, an inlet and an outlet of the strip are provided on both sides of a closed chamber having four gas ports, and an anode plate is placed above and below the pass line of the strip knob set by these inlets and outlets in parallel with and close to the pass line. and insert an 8-liquid ejection tube with the ejection port facing toward the strip inlet side on the strip outlet side between each Mh electrode plate and the pass line,
A plating solution storage tank is arranged below the lower anode plate, and the plating solution storage tank and the plating solution w1. Connect the ejection pipe with a circulation pipe, and place a plating liquid receiver whose flow outlet is connected to the storage tank between the lower measuring PI electrode plate and the storage tank, and also bring the outer periphery into contact with the pass line. The electrolytic aluminum plating equipment was constructed by arranging the current-carrying roll in a position where it could be used. (Function) In this electric 7-reminium plating device, when the strip passes through the plate, a gap is formed between the strip and the anode plate, and a plating solution spouting pipe is arranged on the strip outlet side of the gap, so that the plating solution can be spouted. When plating solution is injected from the tube, it fills with plating solution and becomes a plating bath. Further, since the passage 74 is placed at a position where it can be brought into contact with the pass line of the string, electrolysis can be carried out by bringing it into contact with the strip after passing the strip and using it as a cathode.
めっき浴は、めっき液をストリ・ノブの出側から入側に
向かって噴出管より噴出させるようにしてであるので、
ストリップ表面に発生した反応がスを発生と同時に除去
する。また、めっき液組成と同じ金属イオン濃度のめっ
き液をストリップ芥面供給するので、ストリップ界面で
の金属イオン濃度が低くなることがない．さらに、めっ
き液を噴出管から噴出させると、めっき液は、陽！Ｉｉ
ｌ板１４の入′Ｒまで高速で流れ、入側に至るまで速度
の低下が少ない。これに対して、めっ！ｋ液を充たした
めっき裕内で噴出管からめっき液を噴出させても、めっ
き液の抵抗によりめっき液速度は急速に遅くなり、入側
でのめっき８ｌ速度を高速にすることができない．
ストリ・ノブとｌＩｌ極板の間から流れためっき謀は、
下ｆｌｔｌ！陽極板の下方に配置されためっき液受けで
集められ、めっき液貯溜槽に入る。この貯溜槽とめっき
液噴出管とは、循環バイブで接続されているので、循環
使用される．
めっき液噴出管より噴出させためっき液やめ９８液貯溜
槽内のめっき液は、〃ス導入口より密閉型室に窒素やア
ルゴンなどの不活性がスを辱入すれば、酸化を防止でき
る。The plating bath is designed so that the plating solution is spouted from the spout pipe from the outlet side of the strip knob to the inlet side.
The reaction that occurs on the strip surface removes the gas as it is generated. Furthermore, since the plating solution with the same metal ion concentration as the plating solution composition is supplied to the strip surface, the metal ion concentration at the strip interface does not become low. Furthermore, when the plating solution is ejected from the spout tube, the plating solution becomes positive! Ii
It flows at high speed until the entrance 'R' of the l plate 14, and there is little decrease in speed until it reaches the entrance side. On the other hand, meh! Even if the plating solution is jetted out from the jet tube in the plating chamber filled with K solution, the plating solution speed rapidly slows down due to the resistance of the plating solution, making it impossible to increase the plating speed at the entrance side. The plating that flows from between the strip knob and the lIl electrode plate is
Bottom fltl! The plating solution is collected in a plating solution receiver placed below the anode plate and enters the plating solution storage tank. This storage tank and the plating solution jet pipe are connected by a circulation vibrator, so they are used in circulation. The plating solution spouted from the plating solution jet pipe and the plating solution in the 98-liquid storage tank can be prevented from oxidizing by injecting inert gas such as nitrogen or argon into the closed chamber through the gas inlet.
（実施例）
！１４１図、第２図は、本発明に係る電気アルミニウム
めっき装置の１実施例を示すもので、ｆｊＳ１図におい
て、密閉型室１の左側および右側には、それぞれ人口２
および出口３が設けられている。そして、これらの出入
口の外側にデフレクターロール４が配置され、これらに
より密閉型室１を通板させるストリップ５のパスライン
を設定している。(Example) ! Figure 141 and Figure 2 show one embodiment of the electrolytic aluminum plating apparatus according to the present invention.
and an outlet 3 are provided. Deflector rolls 4 are disposed outside these entrances and exits, and these define a pass line for the strip 5 through which the closed chamber 1 is passed.
密閉型室１は、内部がストリップ５を通すスリットロを
有する仕切り板６により４室に区分けされ、人口２側か
らｔｊＳ１室７、第２室８、ｔｌＩＪ３室９および第４
室１０になっていて、第１室７は、完全に仕切られてい
るが、第２室８から第４室１０は、下側が連続している
．
第１室７と＃ＩＪ２室８の入側にはめつき液流出防止ロ
ール１１がストリップ５の上下に配置され、また、この
めっき液流出防止ロール１１の次にはス｝ ＋７ップ５
上側に通電ロール１２が、下側にバックアップロール１
３が配置され、バック７ツブロール１３の上下位置調整
によりストリップ５を通電ロール１２に接触させている
。第３室９と第４室１０にも入側に通電ロール１２とバ
ックアップロール１３が同様に配置されている．
また、第１〜４室の各室とも通電ロール１２とバックア
ンプロール１３の次に高純度アルミニウム板からなるＦ
！極板１４がストリップ５の上下に平行に配置されてい
る．これらの陽極板１４は、１２図に示すように、とも
１こストリ・冫ブ５の幅より広い１枚板で、ストリ・冫
プ５に近接して配置され、上側のものは、密閉型室１の
上部に固着され、下側のものは側面に固着されている．
そして、これらの陽極板１４とストリップ５との間のス
トリップ出側には、噴出口を入側方向に向けためっき液
噴出管１５が挿入されている。なお、陽極板は、１枚の
ものでなく、支持板の内側に陽極を固着したものでもよ
い．
各室のめっき液噴出管１５の次には、〃イドロール１６
が配置され、ストリップ５がめつき液噴出菅１５や仕切
り板６と接触するのを防止している。第４室については
、このがイドロール１６の次にめっ！液流出防止ロール
１１が配置されている。The closed room 1 is divided into four rooms by a partition plate 6 having a slit through which the strip 5 passes.
The first chamber 7 is completely partitioned, but the second chamber 8 to the fourth chamber 10 are continuous on the lower side. On the inlet sides of the first chamber 7 and #IJ2 chamber 8, plating solution spill prevention rolls 11 are arranged above and below the strip 5, and next to the plating solution spill prevention rolls 11 are strips 5
The energizing roll 12 is on the upper side, and the backup roll 1 is on the lower side.
3 is arranged, and the strip 5 is brought into contact with the energizing roll 12 by adjusting the vertical position of the back 7 tube roll 13. An energizing roll 12 and a backup roll 13 are similarly arranged on the entrance side of the third chamber 9 and the fourth chamber 10. Further, in each of the first to fourth chambers, next to the energizing roll 12 and the backing roll 13, a F made of a high-purity aluminum plate is provided.
! Pole plates 14 are arranged in parallel above and below the strip 5. These anode plates 14, as shown in FIG. It is fixed to the top of chamber 1, and the lower one is fixed to the side.
A plating solution jetting tube 15 is inserted between the anode plate 14 and the strip 5 on the strip exit side, with the jetting port facing toward the inlet side. Note that the anode plate is not a single piece, but may be one in which the anode is fixed to the inside of the support plate. Next to the plating solution jetting pipe 15 of each chamber is an idle roll 16.
is arranged to prevent the strip 5 from coming into contact with the plating liquid spout tube 15 or the partition plate 6. Regarding the 4th room, this is next to Idrol 16! A liquid outflow prevention roll 11 is arranged.
密閉型室１の入口２の外側には、グクト１７が接続され
、内部にストリンブ５乾燥用の乾燥装置１８がストリッ
プ５の通過位置両側に固着されている．同様に、密閉型
室１の出口３つ外側にもダクト１７が接続されている．
なお、これらのダクト１７およびｆｆｉｌ￥ｌ型室１に
は、〃ス導入口１９が設けられている。A drying device 17 is connected to the outside of the entrance 2 of the closed chamber 1, and a drying device 18 for drying the string 5 is fixed on both sides of the passage position of the strip 5 inside. Similarly, ducts 17 are also connected to the outside of the three outlets of the closed room 1.
Note that these ducts 17 and the ffil\l type chamber 1 are provided with a gas inlet 19.
第１室７の下側にはめっき液貯溜槽２０が設置され、こ
の貯溜槽と下側陽極板１４との間にめっき液受け２１が
固着されている。このめっき液受け２１は、中央部に向
かって下り傾斜になっていて、その中穴部にめっき液貯
溜′Ｐａ２０と接続された流出口２２が設けられている
。A plating solution reservoir 20 is installed below the first chamber 7 , and a plating solution receiver 21 is fixed between the reservoir and the lower anode plate 14 . The plating solution receiver 21 is sloped downward toward the center, and has an outlet 22 connected to the plating solution reservoir 'Pa20' in the hollow part thereof.
同様に、第２室８から第４室１０の連続した部分には、
めっき液貯ＷＩ槽２０が設置され、この貯溜槽と下側陽
極板１４との間に第１室と同様のめっき液受け２１が固
着され、また、第３室９にも単独でめっき液受け２〕が
固着されている。Similarly, in the continuous part from the second chamber 8 to the fourth chamber 10,
A plating solution storage WI tank 20 is installed, and a plating solution receiver 21 similar to that in the first chamber is fixed between this reservoir and the lower anode plate 14, and the third chamber 9 also has an independent plating solution receiver. 2] is fixed.
ＰｔＳｌ室７のめっき液貯溜′！ｆ１２０は、図示して
ないが、第１室７のめっき液噴出管１５と循環パイプで
接続され、同様に第２室８から第４室１０の下部連続部
分に設けられためっき液貯溜槽２０もＰｔＳ２室からＷ
Ｓ４室１０のめっき液噴出管１５に循環パイプで接続さ
れている。なお、いずれのめっき液貯溜槽２０とも外側
にめっき？ｉｌ２３の温度制御用水Ｗ！２４が設けられ
、下側に熱媒体を入れる入口２５が、上側にその出口２
６が設けられている。Plating solution reservoir in PtSl chamber 7'! Although not shown, f120 is connected to the plating solution jetting pipe 15 of the first chamber 7 through a circulation pipe, and is also connected to a plating solution storage tank 20 provided in the lower continuous portion of the second chamber 8 to the fourth chamber 10. Also W from PtS room 2
It is connected to the plating solution jet pipe 15 of the S4 chamber 10 through a circulation pipe. In addition, both plating solution storage tanks 20 are plated on the outside? il23 temperature control water W! 24 is provided, an inlet 25 for introducing the heat medium is provided on the lower side, and an outlet 25 thereof is provided on the upper side.
6 is provided.
なお、今まで述べためっき液流出防止ロール１１、バッ
クア・／ブロール１３および〃イドロール１６は、溶融
塩浴の場合、めっき液の腐食性が強いので、耐食性材料
、例えばフッ素ゴムで表面を被覆したものにする．また
、密閉型室１やめっき液受け２１およびめっき液貯溜槽
２ｏを鋼材で作製する場合は、表面を耐食性材料、例え
ば７ノ素系樹脂、ガラス、塩化ビニル系υ１脂などで被
覆する．
通電ロール１２としては、高純ノ文アルミニウムやＮｉ
−Ｃｒ−Ｎｏ系合金製にすると不純物がめつき液に混入
しないので好ましい。The plating solution spill prevention roll 11, backer/broiler 13, and idle roll 16 described above are coated with a corrosion-resistant material, such as fluororubber, because the plating solution is highly corrosive when used in a molten salt bath. Make it into something. In addition, when the closed chamber 1, plating solution receiver 21, and plating solution storage tank 2o are made of steel, the surfaces are coated with a corrosion-resistant material, such as heptadonium-based resin, glass, vinyl chloride-based υ1 resin, etc. The energizing roll 12 is made of high-purity aluminum or Ni.
-Cr-No based alloy is preferred because impurities will not be mixed into the plating solution.
本実施例でのめっき装置は、第１室７で低電流密度でス
トリップの電解活性化処理を行い、第２〜４室でアルミ
ニウムのＷ１スめっきを施す、（発明の効果）
以上のように、本発明のめつき装置によれば、めっき液
の粘性が高い溶融塩浴でも高速でめっきできる。The plating apparatus in this embodiment performs electrolytic activation treatment of the strip at low current density in the first chamber 7, and performs aluminum W1 plating in the second to fourth chambers. (Effects of the Invention) As described above, According to the plating apparatus of the present invention, plating can be performed at high speed even in a molten salt bath in which the plating solution has a high viscosity.
第１図は、本発明に係る７１ｔａＡ７ルミニウムめっキ
ｆ１ｒａノ縦断面図であＱ、ＰｔＳ２図１ｉ、ｔｊＳｌ
図１１−■での横断面図である。FIG. 1 is a longitudinal cross-sectional view of 71taA7 aluminum plating f1ra according to the present invention.
FIG. 11 is a cross-sectional view in FIG. 11-■.
Claims (4)
入口と出口とを設けて、これらの出入口でもっで設定す
るストリップのパスライン上下に陽極板をパスラインと
平行に近接配置して、各陽極板とパスラインとの間のス
トリップ出側に噴出口をストリップ入側方向に向けため
っき液噴出管を挿入するとともに、下側陽極板の下方に
めっき液貯溜槽を配置して、この貯溜槽と前記めっき液
噴出管とを循環パイプで接続し、また、下側陽極板と貯
溜槽との間に流下口が貯溜槽に接続されためっき液受け
を配置し、さらに、外周をパスラインと接触させること
ができる位置に通電ロールを配置したことを特徴とする
溶融塩浴による電気アルミニウムめっき装置。(1) An inlet and an outlet for the strip are provided on both sides of a closed chamber having a gas inlet, and anode plates are arranged close to each other parallel to the pass line above and below the pass line of the strip set by these inlets and outlets. Insert a plating solution jet tube with its spout facing toward the strip inlet side on the strip outlet side between each anode plate and the pass line, and place a plating solution reservoir below the lower anode plate. The storage tank and the plating solution jet pipe are connected by a circulation pipe, and a plating solution receiver whose flow outlet is connected to the storage tank is arranged between the lower anode plate and the storage tank, and a plating solution receiver is placed between the lower anode plate and the storage tank, and the outer periphery is passed through. An electrolytic aluminum plating device using a molten salt bath, characterized in that an energizing roll is placed at a position where it can be brought into contact with a line.
面をフッ素系樹脂、塩化ビニル系樹脂またはガラスで被
覆したことを特徴とする特許請求の範囲１項に記載の溶
融塩浴による電気アルミニウムめっき装置。(2) Electrical aluminum produced by a molten salt bath according to claim 1, characterized in that the inner surfaces of the closed chamber, the plating solution receiver, and the plating reservoir are coated with a fluororesin, a vinyl chloride resin, or glass. Plating equipment.
たことを特徴とする特許請求の範囲第１項に記載の溶融
塩浴による電気アルミニウムめっき装置。(3) The electrolytic aluminum plating apparatus using a molten salt bath according to claim 1, characterized in that a water tank for temperature control is provided around the plating solution storage tank.
Ｃｒ−Ｍｏ系合金製にしたことを特徴とする特許請求の
範囲１項に記載の溶融塩浴による電気アルミニウムめっ
き装置。(4) The energizing roll is made of high-purity aluminum or Ni-
The electrolytic aluminum plating apparatus using a molten salt bath according to claim 1, characterized in that the apparatus is made of a Cr-Mo alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073689A JPH0317292A (en) | 1989-06-14 | 1989-06-14 | Aluminum electroplating apparatus with molten salt bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073689A JPH0317292A (en) | 1989-06-14 | 1989-06-14 | Aluminum electroplating apparatus with molten salt bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317292A true JPH0317292A (en) | 1991-01-25 |
Family
ID=15503291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15073689A Pending JPH0317292A (en) | 1989-06-14 | 1989-06-14 | Aluminum electroplating apparatus with molten salt bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317292A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
| CN102015408A (en) * | 2009-03-25 | 2011-04-13 | 西日本旅客铁道株式会社 | Improvement of body structure of rolling stock |
| CN102066179A (en) * | 2009-08-19 | 2011-05-18 | 西日本旅客铁道株式会社 | Body structure of rolling stock |
| WO2014141736A1 (en) * | 2013-03-12 | 2014-09-18 | 住友電気工業株式会社 | Fused-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173171A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173176A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173175A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173173A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| WO2015118977A1 (en) * | 2014-02-05 | 2015-08-13 | 住友電気工業株式会社 | Aluminum film manufacturing method and manufacturing device |
-
1989
- 1989-06-14 JP JP15073689A patent/JPH0317292A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423389B1 (en) * | 1997-04-10 | 2002-07-23 | Occ Corporation | Metal tube armored linear body, metal tube armoring linear body, method and apparatus for manufacturing metal tube armored linear body |
| CN102015408A (en) * | 2009-03-25 | 2011-04-13 | 西日本旅客铁道株式会社 | Improvement of body structure of rolling stock |
| CN102066179A (en) * | 2009-08-19 | 2011-05-18 | 西日本旅客铁道株式会社 | Body structure of rolling stock |
| US8931418B2 (en) | 2009-08-19 | 2015-01-13 | West Japan Railway Company | Bodyshell structure of railcar |
| WO2014141736A1 (en) * | 2013-03-12 | 2014-09-18 | 住友電気工業株式会社 | Fused-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173171A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173176A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173175A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| JP2014173173A (en) * | 2013-03-12 | 2014-09-22 | Sumitomo Electric Ind Ltd | Molten-salt electrolysis plating apparatus, and method for producing aluminum film |
| CN105051262A (en) * | 2013-03-12 | 2015-11-11 | 住友电气工业株式会社 | Fused-salt electrolysis plating apparatus, and method for producing aluminum film |
| WO2015118977A1 (en) * | 2014-02-05 | 2015-08-13 | 住友電気工業株式会社 | Aluminum film manufacturing method and manufacturing device |
| JPWO2015118977A1 (en) * | 2014-02-05 | 2017-03-23 | 住友電気工業株式会社 | Method and apparatus for manufacturing aluminum film |
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