GB1375121A - - Google Patents

Info

Publication number
GB1375121A
GB1375121A GB5493372A GB5493372A GB1375121A GB 1375121 A GB1375121 A GB 1375121A GB 5493372 A GB5493372 A GB 5493372A GB 5493372 A GB5493372 A GB 5493372A GB 1375121 A GB1375121 A GB 1375121A
Authority
GB
United Kingdom
Prior art keywords
detector
mirror
information
scanning
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5493372A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1375121A publication Critical patent/GB1375121A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Pathology (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
GB5493372A 1972-05-01 1972-11-28 Expired GB1375121A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00249058A US3803413A (en) 1972-05-01 1972-05-01 Infrared non-contact system for inspection of infrared emitting components in a device

Publications (1)

Publication Number Publication Date
GB1375121A true GB1375121A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-11-27

Family

ID=22941884

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5493372A Expired GB1375121A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-05-01 1972-11-28

Country Status (6)

Country Link
US (1) US3803413A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4941855A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2300436A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2186137A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1375121A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT976347B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0105078A1 (en) * 1982-09-30 1984-04-11 Vanzetti Systems, Inc. Fiber optic scanning system for laser/thermal inspection
EP0265417A3 (de) * 1986-10-17 1990-08-08 VOEST-ALPINE Eisenbahnsysteme Gesellschaft m.b.H. Einrichtung zum Erfassen von unzulässig erwärmten Radlagern und/oder Radreifen
GB2358466A (en) * 2000-01-18 2001-07-25 Cindy Maria Marcella Motmans Testing interconnections in an electronic circuit assembly by thermal conduction detection.
DE102010053766A1 (de) 2010-12-08 2012-06-14 Acculogic Corporation Vorrichtung zum thermischen Testen von Platinen
US8836354B2 (en) 2010-10-21 2014-09-16 Acculogic Corporation Apparatus for thermal testing of a printed circuit board

Families Citing this family (56)

* Cited by examiner, † Cited by third party
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JPS53121451U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-03-07 1978-09-27
JPS5686367A (en) * 1979-12-14 1981-07-14 Nec Corp Measuring method for characteristic of electronic circuit
JPS5798847A (en) * 1980-12-11 1982-06-19 Nec Corp X-ray diffractometer
US4454585A (en) * 1981-05-28 1984-06-12 Ele John H Printed wiring board inspection, work logging and information system
DE3373018D1 (en) * 1982-03-18 1987-09-17 Atomic Energy Authority Uk Transient thermography
JPS5950349A (ja) * 1982-09-16 1984-03-23 Shinku Riko Kk 熱定数測定装置
DE3303140A1 (de) * 1983-01-31 1984-08-02 Bruker Analytische Meßtechnik GmbH, 7512 Rheinstetten Infrarot-spektrometer
ATE25151T1 (de) * 1983-05-25 1987-02-15 Battelle Memorial Institute Untersuchungs- und pruefungsverfahren fuer eine elektrische vorrichtung in der art einer integrierten oder gedruckten schaltung.
JPS59218938A (ja) * 1983-05-27 1984-12-10 Fujitsu Ltd プリント基板の配線パタ−ン検査方法
GB8422873D0 (en) * 1984-09-11 1984-10-17 Secr Defence Static stress measurement in object
US4644162A (en) * 1984-09-20 1987-02-17 General Electric Company Cooling hole inspection
US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
EP0209650A3 (en) * 1985-06-07 1989-07-05 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
JPS62134568A (ja) * 1985-12-09 1987-06-17 Nippon Atom Ind Group Co Ltd 電子基板の劣化診断装置
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
US4782299A (en) * 1987-03-09 1988-11-01 Itt Avionics, A Division Of Itt Corporation Methods of arc and corona monitoring for high voltage generators
DE3722715A1 (de) * 1987-07-09 1989-01-26 Siemens Ag Verfahren zur bestueckungskontrolle von kondensatoren auf leiterplatten
US4814870A (en) * 1987-08-05 1989-03-21 Compix Incorporated Portable infrared imaging apparatus
DE3813258A1 (de) * 1988-04-20 1989-11-02 Siemens Ag Verfahren zur beruehrungslosen und zerstoerungsfreien pruefung von absorptionsfaehigen materialien und vorrichtung zu seiner durchfuehrung
US4854162A (en) * 1988-06-27 1989-08-08 Ford Motor Company Method of locating friction generating defects in a multiple bearing assembly
US5208528A (en) * 1989-01-19 1993-05-04 Bull S.A. Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method
DE3913474A1 (de) * 1989-04-24 1990-10-25 Siemens Ag Photothermisches untersuchungsverfahren, einrichtung zu seiner durchfuehrung und verwendung des verfahrens
US4999499A (en) * 1989-09-21 1991-03-12 General Dynamics Corporation Method of inspecting solder joints with a laser inspection system
US5264819A (en) * 1990-12-12 1993-11-23 Electric Power Research Institute, Inc. High energy zinc oxide varistor
JPH0734367Y2 (ja) * 1991-11-14 1995-08-02 工業技術院長 赤外光学材料の吸収センタ検出装置
US5407275A (en) * 1992-03-31 1995-04-18 Vlsi Technology, Inc. Non-destructive test for inner lead bond of a tab device
US5246291A (en) * 1992-06-01 1993-09-21 Motorola, Inc. Bond inspection technique for a semiconductor chip
US5580471A (en) * 1994-03-30 1996-12-03 Panasonic Technologies, Inc. Apparatus and method for material treatment and inspection using fiber-coupled laser diode
JP3163909B2 (ja) * 1994-08-19 2001-05-08 株式会社富士通ゼネラル 安全試験の自動化装置
US5509597A (en) * 1994-10-17 1996-04-23 Panasonic Technologies, Inc. Apparatus and method for automatic monitoring and control of a soldering process
US5562842A (en) * 1994-10-17 1996-10-08 Panasonic Technologies, Inc. Material treatment apparatus combining a laser diode and an illumination light with a video imaging system
US5504017A (en) * 1994-12-20 1996-04-02 Advanced Micro Devices, Inc. Void detection in metallization patterns
US5733041A (en) * 1995-10-31 1998-03-31 General Electric Company Methods and apparatus for electrical connection inspection
DE19542534C1 (de) * 1995-11-15 1997-02-27 Phototherm Dr Petry Gmbh Vorrichtung zum Erzeugen und Erfassen von induzierter Wärmestrahlung
EP0851221A1 (en) * 1996-12-23 1998-07-01 European Atomic Energy Community (Euratom) Measuring head for use in radiant energy flash measuring of the thermal diffusivity of heterogeneous samples
US5808303A (en) * 1997-01-29 1998-09-15 Art Aerospace Research Technologies Inc. Infrared screening and inspection system
US6096997A (en) * 1997-08-29 2000-08-01 Trw Inc. Method of assembling an igniter including infrared testing of heating element and welds
US6089750A (en) * 1997-09-30 2000-07-18 Sumitomo Electric Industries, Ltd. Noncontact temperature distribution measuring apparatus
US6294923B1 (en) * 1998-12-07 2001-09-25 Advanced Micro Devices, Inc. Method and system for detecting faults utilizing an AC power supply
US6320895B1 (en) * 1999-03-08 2001-11-20 Trw Inc. Resonant galvanometer driven two dimensional gain scanner
US6340817B1 (en) * 1999-04-23 2002-01-22 Creo S.R.L. Inspection method for unpopulated printed circuit boards
GB0004214D0 (en) * 2000-02-23 2000-04-12 Gibbs Leo M Method and apparatus for isolated thermal fault finding in electronic components
US6812047B1 (en) * 2000-03-08 2004-11-02 Boxer Cross, Inc. Evaluating a geometric or material property of a multilayered structure
AU2002214889A1 (en) * 2000-12-11 2002-06-24 Art Advanced Research Technologies, Inc / Art Recherches Et Technologies Avancees, Inc. Method and apparatus for detection of defects using localized heat injection of short laser pulses
US6911349B2 (en) * 2001-02-16 2005-06-28 Boxer Cross Inc. Evaluating sidewall coverage in a semiconductor wafer
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6971791B2 (en) * 2002-03-01 2005-12-06 Boxer Cross, Inc Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
US6878559B2 (en) * 2002-09-23 2005-04-12 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6963393B2 (en) * 2002-09-23 2005-11-08 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US7026175B2 (en) * 2004-03-29 2006-04-11 Applied Materials, Inc. High throughput measurement of via defects in interconnects
DE102005002189B4 (de) * 2005-01-17 2007-02-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Ermitteln der Winkelposition eines Lichtstrahls und Verfahren zum Betreiben einer Vorrichtung zum Ermitteln der Winkelposition eines Lichtstrahls
US7989769B2 (en) * 2008-08-21 2011-08-02 Rockwell Automation Technologies, Inc. In-cabinet thermal monitoring method and system
US7859276B1 (en) 2008-12-02 2010-12-28 Lockheed Martin Corporation Non-destructive validation of semiconductor devices
WO2015042577A1 (en) * 2013-09-23 2015-03-26 Thermal Wave Imaging, Inc. Nondestructive testing active thermography system and method for utilizing the same
US9546907B2 (en) * 2014-04-18 2017-01-17 Quantum Focus Instruments Corporation Dynamic differential thermal measurement systems and methods
US11525736B2 (en) 2020-01-15 2022-12-13 International Business Machines Corporation Temperature monitoring for printed circuit board assemblies during mass soldering

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0105078A1 (en) * 1982-09-30 1984-04-11 Vanzetti Systems, Inc. Fiber optic scanning system for laser/thermal inspection
EP0265417A3 (de) * 1986-10-17 1990-08-08 VOEST-ALPINE Eisenbahnsysteme Gesellschaft m.b.H. Einrichtung zum Erfassen von unzulässig erwärmten Radlagern und/oder Radreifen
GB2358466A (en) * 2000-01-18 2001-07-25 Cindy Maria Marcella Motmans Testing interconnections in an electronic circuit assembly by thermal conduction detection.
US8836354B2 (en) 2010-10-21 2014-09-16 Acculogic Corporation Apparatus for thermal testing of a printed circuit board
DE102010053766A1 (de) 2010-12-08 2012-06-14 Acculogic Corporation Vorrichtung zum thermischen Testen von Platinen
DE102010053766B4 (de) 2010-12-08 2019-05-23 Acculogic Corporation Vorrichtung zum thermischen Testen von Platinen

Also Published As

Publication number Publication date
DE2300436A1 (de) 1973-11-22
JPS4941855A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-04-19
US3803413A (en) 1974-04-09
FR2186137A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-01-04
IT976347B (it) 1974-08-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee