GB1375054A - - Google Patents

Info

Publication number
GB1375054A
GB1375054A GB489372A GB489372A GB1375054A GB 1375054 A GB1375054 A GB 1375054A GB 489372 A GB489372 A GB 489372A GB 489372 A GB489372 A GB 489372A GB 1375054 A GB1375054 A GB 1375054A
Authority
GB
United Kingdom
Prior art keywords
plate
foil
face
tracks
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB489372A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1375054A publication Critical patent/GB1375054A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
GB489372A 1971-02-05 1972-02-02 Expired GB1375054A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101600.A NL164425C (nl) 1971-02-05 1971-02-05 Halfgeleiderinrichting voorzien van een koellichaam.

Publications (1)

Publication Number Publication Date
GB1375054A true GB1375054A (enExample) 1974-11-27

Family

ID=19812417

Family Applications (1)

Application Number Title Priority Date Filing Date
GB489372A Expired GB1375054A (enExample) 1971-02-05 1972-02-02

Country Status (9)

Country Link
JP (1) JPS5329071B2 (enExample)
AU (1) AU466735B2 (enExample)
CA (1) CA956731A (enExample)
CH (1) CH538194A (enExample)
DE (1) DE2202802B2 (enExample)
FR (1) FR2124487B1 (enExample)
GB (1) GB1375054A (enExample)
IT (1) IT947244B (enExample)
NL (1) NL164425C (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
US4617216A (en) * 1980-08-07 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Mbh Multi-layer identification card
GB2174840A (en) * 1985-04-29 1986-11-12 Energy Conversion Devices Inc Surface mounted circuits and methods of preparing the circuits
GB2202675A (en) * 1987-03-23 1988-09-28 Gen Hybrid Limited Semiconductor chip carriers
GB2218570A (en) * 1988-05-09 1989-11-15 Nat Semiconductor Corp Plastics moulded pin-grid-array power package
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425A (en) * 1990-01-20 1991-07-31 Motorola Ltd Power circuit cooling apparatus

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412270A (en) * 1977-06-22 1979-01-29 Nec Corp Integrated circuit rackage
DE2752655A1 (de) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Elektronisches bauelement
JPS5549513U (enExample) * 1978-09-28 1980-03-31
JPS55113389U (enExample) * 1979-02-02 1980-08-09
JPS58119595A (ja) * 1982-01-09 1983-07-16 三菱電機株式会社 巻上装置
JPS59116311U (ja) * 1983-01-21 1984-08-06 日立金属株式会社 羽根付コンベヤチエン
JPS62189743A (ja) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd 配線回路体
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
DE102019115500A1 (de) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Anordnung und Verfahren zur Herstellung einer Anordnung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
FR1564787A (enExample) * 1968-03-04 1969-04-25

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617216A (en) * 1980-08-07 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Mbh Multi-layer identification card
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
GB2124433A (en) * 1982-07-07 1984-02-15 Int Standard Electric Corp Electronic component assembly
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
GB2174840A (en) * 1985-04-29 1986-11-12 Energy Conversion Devices Inc Surface mounted circuits and methods of preparing the circuits
GB2202675A (en) * 1987-03-23 1988-09-28 Gen Hybrid Limited Semiconductor chip carriers
GB2218570A (en) * 1988-05-09 1989-11-15 Nat Semiconductor Corp Plastics moulded pin-grid-array power package
GB2218570B (en) * 1988-05-09 1991-07-31 Nat Semiconductor Corp Plastic moulded pin-grid-array power package
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425A (en) * 1990-01-20 1991-07-31 Motorola Ltd Power circuit cooling apparatus
GB2240425B (en) * 1990-01-20 1994-01-12 Motorola Ltd Radio transmitter power amplifier with cooling apparatus

Also Published As

Publication number Publication date
DE2202802A1 (de) 1972-08-17
NL164425C (nl) 1980-12-15
JPS5329071B2 (enExample) 1978-08-18
AU3853872A (en) 1973-08-09
CH538194A (de) 1973-06-15
FR2124487B1 (enExample) 1975-10-24
DE2202802B2 (de) 1979-05-10
JPS4845174A (enExample) 1973-06-28
AU466735B2 (en) 1973-08-09
CA956731A (en) 1974-10-22
NL7101600A (enExample) 1972-08-08
FR2124487A1 (enExample) 1972-09-22
NL164425B (nl) 1980-07-15
IT947244B (it) 1973-05-21

Similar Documents

Publication Publication Date Title
GB1375054A (enExample)
US3200296A (en) Combined mounting-bracket and heat-sink
ES320212A1 (es) Método para unir un elemento transistor de tipo plano a un circuito impreso
GB1341294A (en) Electronic header system having omni-directional heat dissipating characteristics
NL157456B (nl) Halfgeleiderinrichting in een isolerende kunststofomhulling.
GB1403371A (en) Semiconductor device arrangements
KR930006816A (ko) 반도체 장치 및 그 제조방법
US3855693A (en) Method for assembling microelectronic apparatus
DE69026992D1 (de) Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen
GB1197751A (en) Process for Packaging Multilead Semiconductor Devices and Resulting Product.
GB1373008A (en) Electronic components
US3396361A (en) Combined mounting support, heat sink, and electrical terminal connection assembly
IT987041B (it) Dispositivo elettrico circuitale a semiconduttori e procedimento per la sua fabbricazione
DK231287D0 (da) System til aftagelig montering af halvledere paa ledersubstrater
GB1383297A (en) Electrical integrated circuit package
KR890001172A (ko) 반도체 장치
US3421961A (en) Method of making high density electrical connections
GB1363805A (en) Electrical components particularly semiconductor devices
GB1457805A (en) Electric circuit modules
GB1072775A (en) Improvements in electric structural elements
US3522491A (en) Heat transfer apparatus for cooling semiconductor components
GB1403786A (en) Semiconductor devices
US3361937A (en) Electrical component assembly with improved diode and resistor structure
GB1494653A (en) Charge coupled devices
GB1149969A (en) Improvements in or relating to electronic circuit assemblies

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee