CA956731A - Semi-conductor device - Google Patents
Semi-conductor deviceInfo
- Publication number
- CA956731A CA956731A CA133,483A CA133483A CA956731A CA 956731 A CA956731 A CA 956731A CA 133483 A CA133483 A CA 133483A CA 956731 A CA956731 A CA 956731A
- Authority
- CA
- Canada
- Prior art keywords
- semi
- conductor device
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2924/0665—Epoxy resin
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- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7101600A NL164425C (en) | 1971-02-05 | 1971-02-05 | SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY. |
Publications (1)
Publication Number | Publication Date |
---|---|
CA956731A true CA956731A (en) | 1974-10-22 |
Family
ID=19812417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA133,483A Expired CA956731A (en) | 1971-02-05 | 1972-01-31 | Semi-conductor device |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS5329071B2 (en) |
AU (1) | AU466735B2 (en) |
CA (1) | CA956731A (en) |
CH (1) | CH538194A (en) |
DE (1) | DE2202802B2 (en) |
FR (1) | FR2124487B1 (en) |
GB (1) | GB1375054A (en) |
IT (1) | IT947244B (en) |
NL (1) | NL164425C (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5412270A (en) * | 1977-06-22 | 1979-01-29 | Nec Corp | Integrated circuit rackage |
DE2752655A1 (en) * | 1977-09-23 | 1979-06-07 | Blaupunkt Werke Gmbh | Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink |
JPS5549513U (en) * | 1978-09-28 | 1980-03-31 | ||
JPS55113389U (en) * | 1979-02-02 | 1980-08-09 | ||
DE3029939A1 (en) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION |
JPS58119595A (en) * | 1982-01-09 | 1983-07-16 | 三菱電機株式会社 | Hoisting device |
FR2521350B1 (en) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | SEMICONDUCTOR CHIP HOLDER |
JPS5922386A (en) * | 1982-07-07 | 1984-02-04 | アルカテル・エヌ・ブイ | Electronic part structure |
JPS59116311U (en) * | 1983-01-21 | 1984-08-06 | 日立金属株式会社 | Conveyor chain with blades |
GB2135521A (en) * | 1983-02-16 | 1984-08-30 | Ferranti Plc | Printed circuit boards |
US4685030A (en) * | 1985-04-29 | 1987-08-04 | Energy Conversion Devices, Inc. | Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits |
JPS62189743A (en) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | Wiring circuit unit |
GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
GB2237682A (en) * | 1989-09-28 | 1991-05-08 | Redpoint Limited | Heatsink for semiconductor devices |
GB2240425B (en) * | 1990-01-20 | 1994-01-12 | Motorola Ltd | Radio transmitter power amplifier with cooling apparatus |
JPH07109867B2 (en) * | 1991-04-15 | 1995-11-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Cooling structure for semiconductor chips |
DE102019115500A1 (en) * | 2019-06-07 | 2020-12-10 | OSRAM CONTINENTAL GmbH | Arrangement and method for making an arrangement |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3414775A (en) * | 1967-03-03 | 1968-12-03 | Ibm | Heat dissipating module assembly and method |
FR1564787A (en) * | 1968-03-04 | 1969-04-25 |
-
1971
- 1971-02-05 NL NL7101600A patent/NL164425C/en not_active IP Right Cessation
-
1972
- 1972-01-21 DE DE19722202802 patent/DE2202802B2/en not_active Withdrawn
- 1972-01-31 CA CA133,483A patent/CA956731A/en not_active Expired
- 1972-02-02 JP JP1143672A patent/JPS5329071B2/ja not_active Expired
- 1972-02-02 IT IT2014672A patent/IT947244B/en active
- 1972-02-02 GB GB489372A patent/GB1375054A/en not_active Expired
- 1972-02-02 CH CH153072A patent/CH538194A/en not_active IP Right Cessation
- 1972-02-02 AU AU38538/72A patent/AU466735B2/en not_active Expired
- 1972-02-04 FR FR7203792A patent/FR2124487B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IT947244B (en) | 1973-05-21 |
DE2202802B2 (en) | 1979-05-10 |
NL164425C (en) | 1980-12-15 |
DE2202802A1 (en) | 1972-08-17 |
FR2124487A1 (en) | 1972-09-22 |
GB1375054A (en) | 1974-11-27 |
CH538194A (en) | 1973-06-15 |
JPS4845174A (en) | 1973-06-28 |
AU3853872A (en) | 1973-08-09 |
NL7101600A (en) | 1972-08-08 |
FR2124487B1 (en) | 1975-10-24 |
JPS5329071B2 (en) | 1978-08-18 |
AU466735B2 (en) | 1973-08-09 |
NL164425B (en) | 1980-07-15 |
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