NL7101600A - - Google Patents

Info

Publication number
NL7101600A
NL7101600A NL7101600A NL7101600A NL7101600A NL 7101600 A NL7101600 A NL 7101600A NL 7101600 A NL7101600 A NL 7101600A NL 7101600 A NL7101600 A NL 7101600A NL 7101600 A NL7101600 A NL 7101600A
Authority
NL
Netherlands
Application number
NL7101600A
Other versions
NL164425B (en
NL164425C (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7101600A priority Critical patent/NL164425C/en
Priority to DE19722202802 priority patent/DE2202802B2/en
Priority to CA133,483A priority patent/CA956731A/en
Priority to JP1143672A priority patent/JPS5329071B2/ja
Priority to CH153072A priority patent/CH538194A/en
Priority to GB489372A priority patent/GB1375054A/en
Priority to AU38538/72A priority patent/AU466735B2/en
Priority to IT2014672A priority patent/IT947244B/en
Priority to FR7203792A priority patent/FR2124487B1/fr
Publication of NL7101600A publication Critical patent/NL7101600A/xx
Priority to US00370476A priority patent/US3846825A/en
Publication of NL164425B publication Critical patent/NL164425B/en
Application granted granted Critical
Publication of NL164425C publication Critical patent/NL164425C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
NL7101600A 1971-02-05 1971-02-05 SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY. NL164425C (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL7101600A NL164425C (en) 1971-02-05 1971-02-05 SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.
DE19722202802 DE2202802B2 (en) 1971-02-05 1972-01-21 Semiconductor device
CA133,483A CA956731A (en) 1971-02-05 1972-01-31 Semi-conductor device
CH153072A CH538194A (en) 1971-02-05 1972-02-02 Semiconductor device
JP1143672A JPS5329071B2 (en) 1971-02-05 1972-02-02
GB489372A GB1375054A (en) 1971-02-05 1972-02-02
AU38538/72A AU466735B2 (en) 1971-02-05 1972-02-02 Semi-conductor device
IT2014672A IT947244B (en) 1971-02-05 1972-02-02 SEMICONDUCTOR DEVICE
FR7203792A FR2124487B1 (en) 1971-02-05 1972-02-04
US00370476A US3846825A (en) 1971-02-05 1973-06-13 Semiconductor device having conducting pins and cooling member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101600A NL164425C (en) 1971-02-05 1971-02-05 SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.

Publications (3)

Publication Number Publication Date
NL7101600A true NL7101600A (en) 1972-08-08
NL164425B NL164425B (en) 1980-07-15
NL164425C NL164425C (en) 1980-12-15

Family

ID=19812417

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7101600A NL164425C (en) 1971-02-05 1971-02-05 SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.

Country Status (9)

Country Link
JP (1) JPS5329071B2 (en)
AU (1) AU466735B2 (en)
CA (1) CA956731A (en)
CH (1) CH538194A (en)
DE (1) DE2202802B2 (en)
FR (1) FR2124487B1 (en)
GB (1) GB1375054A (en)
IT (1) IT947244B (en)
NL (1) NL164425C (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412270A (en) * 1977-06-22 1979-01-29 Nec Corp Integrated circuit rackage
DE2752655A1 (en) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink
JPS5549513U (en) * 1978-09-28 1980-03-31
JPS55113389U (en) * 1979-02-02 1980-08-09
DE3029939A1 (en) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION
JPS58119595A (en) * 1982-01-09 1983-07-16 三菱電機株式会社 Hoisting device
FR2521350B1 (en) * 1982-02-05 1986-01-24 Hitachi Ltd SEMICONDUCTOR CHIP HOLDER
JPS5922386A (en) * 1982-07-07 1984-02-04 アルカテル・エヌ・ブイ Electronic part structure
JPS59116311U (en) * 1983-01-21 1984-08-06 日立金属株式会社 Conveyor chain with blades
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4685030A (en) * 1985-04-29 1987-08-04 Energy Conversion Devices, Inc. Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits
JPS62189743A (en) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd Wiring circuit unit
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4868349A (en) * 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425B (en) * 1990-01-20 1994-01-12 Motorola Ltd Radio transmitter power amplifier with cooling apparatus
JPH07109867B2 (en) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション Cooling structure for semiconductor chips
DE102019115500A1 (en) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Arrangement and method for making an arrangement

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
FR1564787A (en) * 1968-03-04 1969-04-25

Also Published As

Publication number Publication date
JPS4845174A (en) 1973-06-28
CH538194A (en) 1973-06-15
DE2202802A1 (en) 1972-08-17
DE2202802B2 (en) 1979-05-10
FR2124487B1 (en) 1975-10-24
IT947244B (en) 1973-05-21
AU3853872A (en) 1973-08-09
GB1375054A (en) 1974-11-27
NL164425B (en) 1980-07-15
CA956731A (en) 1974-10-22
FR2124487A1 (en) 1972-09-22
NL164425C (en) 1980-12-15
AU466735B2 (en) 1973-08-09
JPS5329071B2 (en) 1978-08-18

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