GB1365172A - Chemical plating composition - Google Patents
Chemical plating compositionInfo
- Publication number
- GB1365172A GB1365172A GB459472A GB459472A GB1365172A GB 1365172 A GB1365172 A GB 1365172A GB 459472 A GB459472 A GB 459472A GB 459472 A GB459472 A GB 459472A GB 1365172 A GB1365172 A GB 1365172A
- Authority
- GB
- United Kingdom
- Prior art keywords
- feb
- electroless plating
- bath
- ketone
- metal compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000007772 electroless plating Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 150000002576 ketones Chemical class 0.000 abstract 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- LRFCRLLTPYGEKH-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;sulfuric acid Chemical compound OS(O)(=O)=O.OC(=O)C(O)C(O)C(O)=O LRFCRLLTPYGEKH-UHFFFAOYSA-N 0.000 abstract 1
- PXRKCOCTEMYUEG-UHFFFAOYSA-N 5-aminoisoindole-1,3-dione Chemical compound NC1=CC=C2C(=O)NC(=O)C2=C1 PXRKCOCTEMYUEG-UHFFFAOYSA-N 0.000 abstract 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical compound [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 abstract 1
- 229910052776 Thorium Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004327 boric acid Substances 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 229910052793 cadmium Inorganic materials 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Substances OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 235000019441 ethanol Nutrition 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- DOKHEARVIDLSFF-UHFFFAOYSA-N prop-1-en-1-ol Chemical compound CC=CO DOKHEARVIDLSFF-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000011975 tartaric acid Substances 0.000 abstract 1
- 235000002906 tartaric acid Nutrition 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 229910052720 vanadium Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US111904A US3889017A (en) | 1971-02-02 | 1971-02-02 | Chemical filming solution and process for plating therewith |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1365172A true GB1365172A (en) | 1974-08-29 |
Family
ID=22341055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB459472A Expired GB1365172A (en) | 1971-02-02 | 1972-02-01 | Chemical plating composition |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3889017A (enExample) |
| JP (1) | JPS5638675B1 (enExample) |
| AU (1) | AU469029B2 (enExample) |
| BE (1) | BE778815A (enExample) |
| CA (1) | CA978303A (enExample) |
| DE (1) | DE2204430C3 (enExample) |
| FR (1) | FR2124345B1 (enExample) |
| GB (1) | GB1365172A (enExample) |
| IT (1) | IT960884B (enExample) |
| NL (1) | NL149547B (enExample) |
| SE (1) | SE373561B (enExample) |
| ZA (1) | ZA72342B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3962497A (en) * | 1975-03-11 | 1976-06-08 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating |
| US4082898A (en) * | 1975-06-23 | 1978-04-04 | Ppg Industries, Inc. | Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates |
| JPS58500033A (ja) * | 1980-11-28 | 1983-01-06 | カピタノフ ボリス アレクシ−ビツチ | 内燃機関の燃料混合気磁化装置 |
| DE3326253A1 (de) * | 1983-07-21 | 1985-01-31 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung eines festen koerpers |
| JPH01315334A (ja) * | 1988-06-11 | 1989-12-20 | Nisshinbo Ind Inc | 金属コロイド分散液 |
| CA2125691C (en) * | 1991-12-13 | 2003-04-08 | Frederick K. Ault | Compositions and methods for removing minerals from hair |
| US5786030A (en) * | 1996-11-12 | 1998-07-28 | Henkel Corporation | Spotting resistant gloss enhancement of autodeposition coating |
| RU2167113C2 (ru) * | 1999-07-07 | 2001-05-20 | Ивановский государственный химико-технологический университет | Способ химического никелирования стекла |
| CN101155764A (zh) * | 2005-04-05 | 2008-04-02 | 松下电器产业株式会社 | 玻璃板及电视机座 |
| ES2402317B1 (es) * | 2011-09-26 | 2013-12-26 | Abengoa Solar New Technologies S.A. | Procedimiento de trabajo de un sistema de espejado parcial de tubos de vidrio y dicho sistema. |
| CN106232869B (zh) * | 2014-04-24 | 2019-01-25 | 埃托特克德国有限公司 | 铁硼合金涂层及其制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3058845A (en) * | 1959-06-23 | 1962-10-16 | Du Pont | Process for metallizing polyacrylonitrile shaped article by treating with a water soluble metal salt and reducing the salt to the free metal |
| US3140188A (en) * | 1960-08-29 | 1964-07-07 | Bayer Ag | Bath compositions for chemical plating of metals containing boron nitrogen compounds nd an organic solubilizing compound |
| US3483029A (en) * | 1966-07-15 | 1969-12-09 | Ibm | Method and composition for depositing nickel-iron-boron magnetic films |
| US3372059A (en) * | 1967-04-24 | 1968-03-05 | Dow Chemical Co | Chemical reduction process for silver, copper, or nickel deposition |
| US3532541A (en) * | 1967-06-19 | 1970-10-06 | Ibm | Boron containing composite metallic films and plating baths for their electroless deposition |
| CH533172A (de) * | 1969-05-22 | 1973-01-31 | Schering Ag | Stabilisiertes reduktives Nickelbad |
-
1971
- 1971-02-02 US US111904A patent/US3889017A/en not_active Expired - Lifetime
-
1972
- 1972-01-01 SE SE7201156A patent/SE373561B/xx unknown
- 1972-01-18 ZA ZA720342A patent/ZA72342B/xx unknown
- 1972-01-18 CA CA132,673A patent/CA978303A/en not_active Expired
- 1972-01-21 AU AU38178/72A patent/AU469029B2/en not_active Expired
- 1972-01-31 DE DE2204430A patent/DE2204430C3/de not_active Expired
- 1972-02-01 BE BE778815A patent/BE778815A/xx unknown
- 1972-02-01 FR FR7203294A patent/FR2124345B1/fr not_active Expired
- 1972-02-01 IT IT67295/72A patent/IT960884B/it active
- 1972-02-01 GB GB459472A patent/GB1365172A/en not_active Expired
- 1972-02-02 NL NL727201341A patent/NL149547B/xx unknown
- 1972-02-02 JP JP1214272A patent/JPS5638675B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5638675B1 (enExample) | 1981-09-08 |
| NL149547B (nl) | 1976-05-17 |
| AU3817872A (en) | 1973-07-26 |
| SE373561B (sv) | 1975-02-10 |
| NL7201341A (enExample) | 1972-08-04 |
| CA978303A (en) | 1975-11-25 |
| US3889017A (en) | 1975-06-10 |
| FR2124345B1 (enExample) | 1976-10-29 |
| ZA72342B (en) | 1973-09-26 |
| IT960884B (it) | 1973-11-30 |
| DE2204430A1 (de) | 1972-08-31 |
| FR2124345A1 (enExample) | 1972-09-22 |
| AU469029B2 (en) | 1976-01-29 |
| BE778815A (fr) | 1972-08-01 |
| DE2204430C3 (de) | 1975-07-17 |
| DE2204430B2 (de) | 1974-12-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |