GB1358504A - Elastomerically encapsulated semiconductor device - Google Patents
Elastomerically encapsulated semiconductor deviceInfo
- Publication number
- GB1358504A GB1358504A GB4084772A GB4084772A GB1358504A GB 1358504 A GB1358504 A GB 1358504A GB 4084772 A GB4084772 A GB 4084772A GB 4084772 A GB4084772 A GB 4084772A GB 1358504 A GB1358504 A GB 1358504A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrodes
- semi
- wafer
- sleeve
- contact members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Gasket Seals (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19246871A | 1971-10-26 | 1971-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1358504A true GB1358504A (en) | 1974-07-03 |
Family
ID=22709794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4084772A Expired GB1358504A (en) | 1971-10-26 | 1972-09-04 | Elastomerically encapsulated semiconductor device |
Country Status (9)
| Country | Link |
|---|---|
| JP (2) | JPS4857581A (enrdf_load_stackoverflow) |
| AU (1) | AU465197B2 (enrdf_load_stackoverflow) |
| BE (1) | BE790502A (enrdf_load_stackoverflow) |
| CA (1) | CA963586A (enrdf_load_stackoverflow) |
| DE (1) | DE2250753A1 (enrdf_load_stackoverflow) |
| ES (1) | ES406779A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2157923A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1358504A (enrdf_load_stackoverflow) |
| ZA (1) | ZA725913B (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0122431A1 (de) * | 1983-03-11 | 1984-10-24 | Siemens Aktiengesellschaft | Halbleiterbauelement mit scheibenförmigem Gehäuse |
| EP0127750A1 (de) * | 1983-05-09 | 1984-12-12 | Siemens Aktiengesellschaft | Halbleiterbauelement mit vergossenem Becher |
| WO2012059193A3 (en) * | 2010-11-02 | 2012-07-26 | Converteam Technology Ltd | Power electronic device with edge passivation |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2246423C3 (de) * | 1972-09-21 | 1979-03-08 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Thyristor mit scheibenförmigem Gehäuse |
| DE2525390A1 (de) * | 1975-06-06 | 1976-12-16 | Siemens Ag | Steuerbares halbleiterbauelement |
| JPS5619406Y2 (enrdf_load_stackoverflow) * | 1976-06-10 | 1981-05-08 | ||
| DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
| DE2636631A1 (de) * | 1976-08-13 | 1978-02-16 | Siemens Ag | Thyristor |
| JPS5636134Y2 (enrdf_load_stackoverflow) * | 1976-09-07 | 1981-08-25 | ||
| DE2654532C3 (de) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Scheibenförmige Halbleiterzelle |
| FR2440077A1 (fr) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Conteneur pour composant electronique de puissance a semi-conducteur et son procede de fabrication |
| JPH0744191B2 (ja) * | 1989-12-15 | 1995-05-15 | 三菱電機株式会社 | 半導体装置およびそのための電極ブロック |
-
0
- BE BE790502D patent/BE790502A/xx unknown
-
1972
- 1972-08-29 ZA ZA725913A patent/ZA725913B/xx unknown
- 1972-09-01 AU AU46240/72A patent/AU465197B2/en not_active Expired
- 1972-09-04 GB GB4084772A patent/GB1358504A/en not_active Expired
- 1972-09-11 CA CA 151336 patent/CA963586A/en not_active Expired
- 1972-09-18 ES ES406779A patent/ES406779A1/es not_active Expired
- 1972-10-12 JP JP10167072A patent/JPS4857581A/ja active Pending
- 1972-10-17 DE DE2250753A patent/DE2250753A1/de not_active Ceased
- 1972-10-24 FR FR7237651A patent/FR2157923A1/fr not_active Withdrawn
-
1977
- 1977-07-12 JP JP9164177U patent/JPS5311966U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0122431A1 (de) * | 1983-03-11 | 1984-10-24 | Siemens Aktiengesellschaft | Halbleiterbauelement mit scheibenförmigem Gehäuse |
| EP0127750A1 (de) * | 1983-05-09 | 1984-12-12 | Siemens Aktiengesellschaft | Halbleiterbauelement mit vergossenem Becher |
| WO2012059193A3 (en) * | 2010-11-02 | 2012-07-26 | Converteam Technology Ltd | Power electronic device with edge passivation |
| US9349790B2 (en) | 2010-11-02 | 2016-05-24 | Ge Energy Power Conversion Technology Ltd. | Power electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| ZA725913B (en) | 1973-05-30 |
| ES406779A1 (es) | 1975-10-01 |
| FR2157923A1 (enrdf_load_stackoverflow) | 1973-06-08 |
| AU465197B2 (en) | 1975-09-18 |
| DE2250753A1 (de) | 1973-05-03 |
| BE790502A (fr) | 1973-04-25 |
| JPS5311966U (enrdf_load_stackoverflow) | 1978-01-31 |
| AU4624072A (en) | 1974-03-07 |
| CA963586A (en) | 1975-02-25 |
| JPS4857581A (enrdf_load_stackoverflow) | 1973-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1358504A (en) | Elastomerically encapsulated semiconductor device | |
| ES458354A1 (es) | Junta para impedir la fuga de fluidos entre superficies ad- yacentes de dos piezas conectables entre si y sum metodo de produccion. | |
| GB1116647A (en) | A method of forming an annular laminated sealing element | |
| ES433338A1 (es) | Sistema de junta hermetica con cierre hermetico deslizante pivotable. | |
| SE8503461D0 (sv) | Contoured shaft seal for high pressure applications | |
| ES1002813U (es) | Conjunto de estanqueidad para ser interpuesto entre dos organos en movimiento relativo | |
| GB1256144A (en) | A face seal for sealing two relatively rotatable members | |
| GB1042265A (en) | Elastomeric bearing bush | |
| DE3678433D1 (de) | Leckabdichtung. | |
| ES463812A1 (es) | Procedimiento y dispositivo para formar un cierre hermetico entre la superficie exterior de un articulo | |
| GB1140677A (en) | Improvements relating to semi-conductor devices | |
| GB1273129A (en) | Semiconductor device | |
| GB1134019A (en) | Improvements in semi-conductor devices | |
| GB1068721A (en) | Header and sealing ring for packing assembly | |
| SE8502059L (sv) | Kolvcylinderanordning | |
| GB602746A (en) | Improvements in oil and like seals | |
| ES482691A1 (es) | Un dispositivo semiconductor. | |
| GB1487046A (en) | Low voltage zener diode | |
| GB1354802A (en) | Schotky barrier diode | |
| FR2275719A1 (fr) | Dispositif de raccordement rapide et etanche pour elements a embout tubulaire | |
| FR2406307A1 (fr) | Dispositif semiconducteur a surface passivee et procede d'obtention de ce dispositif | |
| JPS4819113B1 (enrdf_load_stackoverflow) | ||
| GB1220315A (en) | Semi-conductor device | |
| GB1267662A (en) | Fluid pressure retaining seals for high temperature joints | |
| GB617486A (en) | Seal for tunnel kiln trucks |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |