GB1348521A - Methods of making semiconductor components - Google Patents

Methods of making semiconductor components

Info

Publication number
GB1348521A
GB1348521A GB1315771A GB1315771A GB1348521A GB 1348521 A GB1348521 A GB 1348521A GB 1315771 A GB1315771 A GB 1315771A GB 1315771 A GB1315771 A GB 1315771A GB 1348521 A GB1348521 A GB 1348521A
Authority
GB
United Kingdom
Prior art keywords
wire
section
metal base
post
end section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1315771A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1348521A publication Critical patent/GB1348521A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Wire Bonding (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
GB1315771A 1970-05-09 1971-05-05 Methods of making semiconductor components Expired GB1348521A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
GB1348521A true GB1348521A (en) 1974-03-20

Family

ID=5770671

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1315771A Expired GB1348521A (en) 1970-05-09 1971-05-05 Methods of making semiconductor components

Country Status (7)

Country Link
US (1) US3720999A (cg-RX-API-DMAC7.html)
JP (1) JPS4914786B1 (cg-RX-API-DMAC7.html)
DE (1) DE2022717A1 (cg-RX-API-DMAC7.html)
FR (1) FR2088459B2 (cg-RX-API-DMAC7.html)
GB (1) GB1348521A (cg-RX-API-DMAC7.html)
IT (1) IT982341B (cg-RX-API-DMAC7.html)
NL (1) NL7106298A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2209096A (en) * 1987-08-25 1989-04-26 Bicc Plc Adaptor assembly for circuit boards

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245176Y2 (cg-RX-API-DMAC7.html) * 1973-09-19 1977-10-14
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
US4674166A (en) * 1984-12-18 1987-06-23 At&T Technologies, Inc. Spring clip transfer apparatus
US4582245A (en) * 1984-12-18 1986-04-15 At&T Technologies, Inc. Method and apparatus for automated spring clip insertion and removal
US4689866A (en) * 1984-12-18 1987-09-01 American Telephone And Telegraph Company, At&T Technologies, Inc. Methods for transferring spring clips
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2371754A (en) * 1942-04-22 1945-03-20 North American Aviation Inc Stiffened material
US2666874A (en) * 1950-08-25 1954-01-19 Rca Corp Construction of semiconductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US3065525A (en) * 1957-09-13 1962-11-27 Sylvania Electric Prod Method and device for making connections in transistors
US3005257A (en) * 1958-08-28 1961-10-24 Bell Telephone Labor Inc Fabrication of semiconductor devices
US3161811A (en) * 1960-02-15 1964-12-15 Clevite Corp Semiconductor device mount
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3267409A (en) * 1963-12-30 1966-08-16 Gen Instrument Corp Terminal for electronic component
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2209096A (en) * 1987-08-25 1989-04-26 Bicc Plc Adaptor assembly for circuit boards
US4948375A (en) * 1987-08-25 1990-08-14 Howard Lawrence Adaptor assembly for circuit boards
GB2209096B (en) * 1987-08-25 1992-01-15 Bicc Plc Adaptor assembly for circuit boards

Also Published As

Publication number Publication date
NL7106298A (cg-RX-API-DMAC7.html) 1971-11-11
US3720999A (en) 1973-03-20
FR2088459B2 (cg-RX-API-DMAC7.html) 1974-03-08
DE2022717A1 (de) 1971-12-02
FR2088459A2 (cg-RX-API-DMAC7.html) 1972-01-07
JPS4914786B1 (cg-RX-API-DMAC7.html) 1974-04-10
IT982341B (it) 1974-10-21

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees